JP2016512792A5 - - Google Patents

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Publication number
JP2016512792A5
JP2016512792A5 JP2016502393A JP2016502393A JP2016512792A5 JP 2016512792 A5 JP2016512792 A5 JP 2016512792A5 JP 2016502393 A JP2016502393 A JP 2016502393A JP 2016502393 A JP2016502393 A JP 2016502393A JP 2016512792 A5 JP2016512792 A5 JP 2016512792A5
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JP
Japan
Prior art keywords
time
laser
route sequence
turning
beam position
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Application number
JP2016502393A
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English (en)
Japanese (ja)
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JP2016512792A (ja
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Priority claimed from PCT/US2014/027275 external-priority patent/WO2014152380A1/en
Publication of JP2016512792A publication Critical patent/JP2016512792A/ja
Publication of JP2016512792A5 publication Critical patent/JP2016512792A5/ja
Pending legal-status Critical Current

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JP2016502393A 2013-03-15 2014-03-14 Ａｏｄラウト加工用レーザシステム及び方法 Pending JP2016512792A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361791361P 2013-03-15 2013-03-15
US61/791,361 2013-03-15
PCT/US2014/027275 WO2014152380A1 (en) 2013-03-15 2014-03-14 Laser systems and methods for aod rout processing

Related Child Applications (1)

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JP2019010116A Division JP6773822B2 (ja) 2013-03-15 2019-01-24 Ａｏｄラウト加工用レーザシステム及び方法

Publications (2)

Publication Number Publication Date
JP2016512792A JP2016512792A (ja) 2016-05-09
JP2016512792A5 true JP2016512792A5 (enExample) 2017-04-20

Family

ID=51522871

Family Applications (2)

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JP2016502393A Pending JP2016512792A (ja) 2013-03-15 2014-03-14 Ａｏｄラウト加工用レーザシステム及び方法
JP2019010116A Active JP6773822B2 (ja) 2013-03-15 2019-01-24 Ａｏｄラウト加工用レーザシステム及び方法

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JP2019010116A Active JP6773822B2 (ja) 2013-03-15 2019-01-24 Ａｏｄラウト加工用レーザシステム及び方法

Country Status (6)

Country Link
US (1) US9931713B2 (enExample)
JP (2) JP2016512792A (enExample)
KR (1) KR102245810B1 (enExample)
CN (1) CN105102169B (enExample)
TW (1) TWI632013B (enExample)
WO (1) WO2014152380A1 (enExample)

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US11077526B2 (en) 2015-09-09 2021-08-03 Electro Scientific Industries, Inc. Laser processing apparatus, methods of laser-processing workpieces and related arrangements
CN110139727B (zh) 2016-12-30 2022-04-05 伊雷克托科学工业股份有限公司 用于延长镭射处理设备中的光学器件生命期的方法和系统
KR102778985B1 (ko) * 2018-06-05 2025-03-12 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
JP7484112B2 (ja) 2019-09-20 2024-05-16 カシオ計算機株式会社 印刷装置、印刷方法及びプログラム
JP2024526083A (ja) * 2021-06-21 2024-07-17 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド ビーム分析システムを含むレーザ加工装置並びにビーム特性の測定及び制御の方法

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