JP2016512792A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2016512792A5 JP2016512792A5 JP2016502393A JP2016502393A JP2016512792A5 JP 2016512792 A5 JP2016512792 A5 JP 2016512792A5 JP 2016502393 A JP2016502393 A JP 2016502393A JP 2016502393 A JP2016502393 A JP 2016502393A JP 2016512792 A5 JP2016512792 A5 JP 2016512792A5
- Authority
- JP
- Japan
- Prior art keywords
- time
- laser
- route sequence
- turning
- beam position
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 description 3
- 230000001133 acceleration Effects 0.000 description 2
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361791361P | 2013-03-15 | 2013-03-15 | |
| US61/791,361 | 2013-03-15 | ||
| PCT/US2014/027275 WO2014152380A1 (en) | 2013-03-15 | 2014-03-14 | Laser systems and methods for aod rout processing |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019010116A Division JP6773822B2 (ja) | 2013-03-15 | 2019-01-24 | Aodラウト加工用レーザシステム及び方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016512792A JP2016512792A (ja) | 2016-05-09 |
| JP2016512792A5 true JP2016512792A5 (enExample) | 2017-04-20 |
Family
ID=51522871
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016502393A Pending JP2016512792A (ja) | 2013-03-15 | 2014-03-14 | Aodラウト加工用レーザシステム及び方法 |
| JP2019010116A Active JP6773822B2 (ja) | 2013-03-15 | 2019-01-24 | Aodラウト加工用レーザシステム及び方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019010116A Active JP6773822B2 (ja) | 2013-03-15 | 2019-01-24 | Aodラウト加工用レーザシステム及び方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9931713B2 (enExample) |
| JP (2) | JP2016512792A (enExample) |
| KR (1) | KR102245810B1 (enExample) |
| CN (1) | CN105102169B (enExample) |
| TW (1) | TWI632013B (enExample) |
| WO (1) | WO2014152380A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6217624B2 (ja) * | 2014-12-26 | 2017-10-25 | ブラザー工業株式会社 | レーザ加工装置及びレーザ加工方法 |
| CN116213918A (zh) * | 2015-09-09 | 2023-06-06 | 伊雷克托科学工业股份有限公司 | 镭射处理设备、镭射处理工件的方法及相关配置 |
| CN114654082A (zh) | 2016-12-30 | 2022-06-24 | 伊雷克托科学工业股份有限公司 | 用于延长镭射处理设备中的光学器件生命期的方法和系统 |
| KR20250039487A (ko) * | 2018-06-05 | 2025-03-20 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법 |
| JP7484112B2 (ja) * | 2019-09-20 | 2024-05-16 | カシオ計算機株式会社 | 印刷装置、印刷方法及びプログラム |
| CN117500629A (zh) * | 2021-06-21 | 2024-02-02 | 伊雷克托科学工业股份有限公司 | 包括射束分析系统的激光加工设备以及射束特性的测量和控制方法 |
Family Cites Families (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01197084A (ja) * | 1988-01-29 | 1989-08-08 | Fanuc Ltd | Cncレーザ加工機のパワー制御方式 |
| JPH0230388A (ja) * | 1988-07-20 | 1990-01-31 | Komatsu Ltd | レーザ切断方法 |
| DE69117267T2 (de) * | 1990-11-30 | 1996-10-02 | Ebara Corp | Verfahren zum Schneiden von Rillen in ein hydrodynamisches Lager aus keramischem Werkstoff |
| US5841099A (en) | 1994-07-18 | 1998-11-24 | Electro Scientific Industries, Inc. | Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets |
| US6555781B2 (en) * | 1999-05-10 | 2003-04-29 | Nanyang Technological University | Ultrashort pulsed laser micromachining/submicromachining using an acoustooptic scanning device with dispersion compensation |
| TW482705B (en) | 1999-05-28 | 2002-04-11 | Electro Scient Ind Inc | Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias |
| JP3768730B2 (ja) * | 1999-06-14 | 2006-04-19 | 松下電器産業株式会社 | レーザ加工機およびその数値制御装置ならびにレーザ加工機の制御方法 |
| US6676878B2 (en) | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
| JP2003136270A (ja) | 2001-11-02 | 2003-05-14 | Hitachi Via Mechanics Ltd | レーザ加工装置 |
| US6706999B1 (en) | 2003-02-24 | 2004-03-16 | Electro Scientific Industries, Inc. | Laser beam tertiary positioner apparatus and method |
| JP4443208B2 (ja) | 2003-12-12 | 2010-03-31 | 日立ビアメカニクス株式会社 | スキャナ装置 |
| US7133186B2 (en) | 2004-06-07 | 2006-11-07 | Electro Scientific Industries, Inc. | AOM modulation techniques employing transducers to modulate different axes |
| US7425471B2 (en) | 2004-06-18 | 2008-09-16 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset |
| US7259354B2 (en) * | 2004-08-04 | 2007-08-21 | Electro Scientific Industries, Inc. | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
| KR100462359B1 (ko) | 2004-08-18 | 2004-12-17 | 주식회사 이오테크닉스 | 폴리곤 미러를 이용한 레이저 가공장치 및 방법 |
| JP2006143996A (ja) | 2004-10-19 | 2006-06-08 | Nitto Denko Corp | 耐熱性樹脂 |
| US7244906B2 (en) | 2005-08-30 | 2007-07-17 | Electro Scientific Industries, Inc. | Energy monitoring or control of individual vias formed during laser micromachining |
| US8084706B2 (en) * | 2006-07-20 | 2011-12-27 | Gsi Group Corporation | System and method for laser processing at non-constant velocities |
| JP5654234B2 (ja) * | 2006-08-22 | 2015-01-14 | ケンブリッジ テクノロジー インコーポレイテッド | X−y高速穴あけシステム |
| JP2008049383A (ja) | 2006-08-28 | 2008-03-06 | Sumitomo Heavy Ind Ltd | ビーム照射方法及びビーム照射装置 |
| JP2008168297A (ja) | 2007-01-05 | 2008-07-24 | Sumitomo Heavy Ind Ltd | レーザ加工装置及びレーザ加工方法 |
| CN200998940Y (zh) * | 2007-01-08 | 2008-01-02 | 李毅 | 太阳能电池激光标刻装置 |
| US7718554B2 (en) * | 2007-02-09 | 2010-05-18 | Wafermasters, Inc. | Focused laser beam processing |
| US7599048B2 (en) * | 2007-02-09 | 2009-10-06 | Wafermasters, Inc. | Optical emission spectroscopy process monitoring and material characterization |
| DE102007012815B4 (de) * | 2007-03-16 | 2024-06-06 | Dmg Mori Ultrasonic Lasertec Gmbh | Verfahren und Vorrichtung zur Bildung eines Gesenks |
| US8026158B2 (en) | 2007-06-01 | 2011-09-27 | Electro Scientific Industries, Inc. | Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window |
| GB0800333D0 (en) | 2008-01-09 | 2008-02-20 | Ucl Business Plc | Beam deflection apparatus and methods |
| US8426768B2 (en) * | 2008-02-20 | 2013-04-23 | Aerotech, Inc. | Position-based laser triggering for scanner |
| EP2163339B1 (de) * | 2008-09-11 | 2016-11-02 | Bystronic Laser AG | Laserschneidanlage zum Schneiden eines Werkstücks mit einem Laserstrahl mit einer variablen Schneidgeschwindigkeit |
| US8680430B2 (en) * | 2008-12-08 | 2014-03-25 | Electro Scientific Industries, Inc. | Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features |
| US20100252959A1 (en) | 2009-03-27 | 2010-10-07 | Electro Scientific Industries, Inc. | Method for improved brittle materials processing |
| TWI594828B (zh) | 2009-05-28 | 2017-08-11 | 伊雷克托科學工業股份有限公司 | 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法 |
| JP4961468B2 (ja) * | 2009-10-29 | 2012-06-27 | 三星ダイヤモンド工業株式会社 | レーザー加工方法、被加工物の分割方法およびレーザー加工装置 |
| GB201006679D0 (en) * | 2010-04-21 | 2010-06-09 | Ucl Business Plc | Methods and apparatus to control acousto-optic deflectors |
| KR101973660B1 (ko) * | 2010-10-22 | 2019-04-30 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 빔 디더링 및 스카이빙을 위한 레이저 처리 시스템 및 방법 |
| JP2012187620A (ja) * | 2011-03-11 | 2012-10-04 | Sumitomo Heavy Ind Ltd | レーザ加工方法及びレーザ加工計画方法 |
| JP2012245539A (ja) * | 2011-05-27 | 2012-12-13 | Panasonic Industrial Devices Sunx Co Ltd | レーザマーキング装置 |
| CN102679948A (zh) * | 2012-03-28 | 2012-09-19 | 中国科学院上海技术物理研究所 | 一种消除高重频激光测距脉冲混叠的方法 |
| KR102214398B1 (ko) * | 2012-11-30 | 2021-02-08 | 어플라이드 머티어리얼스, 인코포레이티드 | 모터 모듈들, 다중-축 모터 구동 조립체들, 다중-축 로봇 장치, 및 전자 디바이스 제조 시스템들 및 방법들 |
-
2014
- 2014-03-14 TW TW103109589A patent/TWI632013B/zh active
- 2014-03-14 CN CN201480014078.7A patent/CN105102169B/zh active Active
- 2014-03-14 KR KR1020157022808A patent/KR102245810B1/ko active Active
- 2014-03-14 US US14/211,115 patent/US9931713B2/en active Active
- 2014-03-14 JP JP2016502393A patent/JP2016512792A/ja active Pending
- 2014-03-14 WO PCT/US2014/027275 patent/WO2014152380A1/en not_active Ceased
-
2019
- 2019-01-24 JP JP2019010116A patent/JP6773822B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2016512792A5 (enExample) | ||
| MX394232B (es) | Método y sistema para explorar un objeto. | |
| PH12013501380A1 (en) | Beam processor | |
| WO2015168218A3 (en) | Light control systems and methods | |
| JP2012528011A5 (enExample) | ||
| EP3941693A4 (en) | Robotic surgical collision detection systems | |
| TW201613710A (en) | Method and device for laser-based machining of planar, crystalline substrates, in particular of semiconductor substrates | |
| EP4296654A3 (en) | High speed scanning system with acceleration tracking | |
| JP2018505427A5 (enExample) | ||
| EP3722832C0 (en) | LASER RADAR SYSTEM | |
| JP2018511793A5 (enExample) | ||
| WO2017021778A3 (en) | Methods and systems for generating and using localisation reference data | |
| WO2016166763A3 (en) | Methods and systems for detecting at least the position of an object in space | |
| EP3990943A4 (en) | ADAPTIVE MULTIPULSE LIDAR SYSTEM | |
| IL253303B (en) | A method of laser processing of a metallic material with high dynamic control of the movement axes of the laser beam along a predetermined processing path, as well as a machine and a computer program for the implementation of said method | |
| IL261400B (en) | High-performance beam director for high-power laser systems or other systems | |
| EP3889728A3 (en) | Selective processing of sensor data | |
| JP2014089211A5 (enExample) | ||
| JP2013530034A5 (enExample) | ||
| GB201312015D0 (en) | Sensor location method and system | |
| WO2017097812A3 (de) | Verfahren zur bestimmung der referenz-fokuslage eines laserstrahls | |
| KR20180084667A (ko) | 기판 프로세싱 방법 | |
| JP2018512059A5 (enExample) | ||
| EP3514560A4 (en) | WAFER LAYOUT OF A MAGNETORESISTIVE SENSOR FOR LASER WRITING SYSTEM AND LASER SCANING PROCESS | |
| PL3799998T3 (pl) | Sposób wykrywania stanu roboczego elementu optycznego usytuowanego wzdłuż toru propagacji wiązki laserowej maszyny do obróbki materiału; maszyna do obróbki laserowej wyposażona w układ realizujący wymieniony sposób |