CN105102169B - 用于声光偏转器击溃处理的激光系统和方法 - Google Patents

用于声光偏转器击溃处理的激光系统和方法 Download PDF

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Publication number
CN105102169B
CN105102169B CN201480014078.7A CN201480014078A CN105102169B CN 105102169 B CN105102169 B CN 105102169B CN 201480014078 A CN201480014078 A CN 201480014078A CN 105102169 B CN105102169 B CN 105102169B
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laser
sequence
processing
defeat
pulse
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CN105102169A (zh
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马克·A·昂瑞斯
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Irecto Science Industry Co ltd
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Irecto Science Industry Co ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
CN201480014078.7A 2013-03-15 2014-03-14 用于声光偏转器击溃处理的激光系统和方法 Active CN105102169B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361791361P 2013-03-15 2013-03-15
US61/791,361 2013-03-15
PCT/US2014/027275 WO2014152380A1 (en) 2013-03-15 2014-03-14 Laser systems and methods for aod rout processing

Publications (2)

Publication Number Publication Date
CN105102169A CN105102169A (zh) 2015-11-25
CN105102169B true CN105102169B (zh) 2017-05-03

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CN201480014078.7A Active CN105102169B (zh) 2013-03-15 2014-03-14 用于声光偏转器击溃处理的激光系统和方法

Country Status (6)

Country Link
US (1) US9931713B2 (enExample)
JP (2) JP2016512792A (enExample)
KR (1) KR102245810B1 (enExample)
CN (1) CN105102169B (enExample)
TW (1) TWI632013B (enExample)
WO (1) WO2014152380A1 (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6217624B2 (ja) * 2014-12-26 2017-10-25 ブラザー工業株式会社 レーザ加工装置及びレーザ加工方法
CN116213918A (zh) * 2015-09-09 2023-06-06 伊雷克托科学工业股份有限公司 镭射处理设备、镭射处理工件的方法及相关配置
CN114654082A (zh) 2016-12-30 2022-06-24 伊雷克托科学工业股份有限公司 用于延长镭射处理设备中的光学器件生命期的方法和系统
KR20250039487A (ko) * 2018-06-05 2025-03-20 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
JP7484112B2 (ja) * 2019-09-20 2024-05-16 カシオ計算機株式会社 印刷装置、印刷方法及びプログラム
CN117500629A (zh) * 2021-06-21 2024-02-02 伊雷克托科学工业股份有限公司 包括射束分析系统的激光加工设备以及射束特性的测量和控制方法

Family Cites Families (39)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01197084A (ja) * 1988-01-29 1989-08-08 Fanuc Ltd Ｃｎｃレーザ加工機のパワー制御方式
JPH0230388A (ja) * 1988-07-20 1990-01-31 Komatsu Ltd レーザ切断方法
DE69117267T2 (de) * 1990-11-30 1996-10-02 Ebara Corp Verfahren zum Schneiden von Rillen in ein hydrodynamisches Lager aus keramischem Werkstoff
US5841099A (en) 1994-07-18 1998-11-24 Electro Scientific Industries, Inc. Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets
US6555781B2 (en) * 1999-05-10 2003-04-29 Nanyang Technological University Ultrashort pulsed laser micromachining/submicromachining using an acoustooptic scanning device with dispersion compensation
TW482705B (en) 1999-05-28 2002-04-11 Electro Scient Ind Inc Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias
JP3768730B2 (ja) * 1999-06-14 2006-04-19 松下電器産業株式会社 レーザ加工機およびその数値制御装置ならびにレーザ加工機の制御方法
US6676878B2 (en) 2001-01-31 2004-01-13 Electro Scientific Industries, Inc. Laser segmented cutting
JP2003136270A (ja) 2001-11-02 2003-05-14 Hitachi Via Mechanics Ltd レーザ加工装置
US6706999B1 (en) 2003-02-24 2004-03-16 Electro Scientific Industries, Inc. Laser beam tertiary positioner apparatus and method
JP4443208B2 (ja) 2003-12-12 2010-03-31 日立ビアメカニクス株式会社 スキャナ装置
US7133186B2 (en) 2004-06-07 2006-11-07 Electro Scientific Industries, Inc. AOM modulation techniques employing transducers to modulate different axes
US7425471B2 (en) 2004-06-18 2008-09-16 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset
US7259354B2 (en) * 2004-08-04 2007-08-21 Electro Scientific Industries, Inc. Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories
KR100462359B1 (ko) 2004-08-18 2004-12-17 주식회사 이오테크닉스 폴리곤 미러를 이용한 레이저 가공장치 및 방법
JP2006143996A (ja) 2004-10-19 2006-06-08 Nitto Denko Corp 耐熱性樹脂
US7244906B2 (en) 2005-08-30 2007-07-17 Electro Scientific Industries, Inc. Energy monitoring or control of individual vias formed during laser micromachining
US8084706B2 (en) * 2006-07-20 2011-12-27 Gsi Group Corporation System and method for laser processing at non-constant velocities
JP5654234B2 (ja) * 2006-08-22 2015-01-14 ケンブリッジ テクノロジー インコーポレイテッド Ｘ−ｙ高速穴あけシステム
JP2008049383A (ja) 2006-08-28 2008-03-06 Sumitomo Heavy Ind Ltd ビーム照射方法及びビーム照射装置
JP2008168297A (ja) 2007-01-05 2008-07-24 Sumitomo Heavy Ind Ltd レーザ加工装置及びレーザ加工方法
CN200998940Y (zh) * 2007-01-08 2008-01-02 李毅 太阳能电池激光标刻装置
US7718554B2 (en) * 2007-02-09 2010-05-18 Wafermasters, Inc. Focused laser beam processing
US7599048B2 (en) * 2007-02-09 2009-10-06 Wafermasters, Inc. Optical emission spectroscopy process monitoring and material characterization
DE102007012815B4 (de) * 2007-03-16 2024-06-06 Dmg Mori Ultrasonic Lasertec Gmbh Verfahren und Vorrichtung zur Bildung eines Gesenks
US8026158B2 (en) 2007-06-01 2011-09-27 Electro Scientific Industries, Inc. Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window
GB0800333D0 (en) 2008-01-09 2008-02-20 Ucl Business Plc Beam deflection apparatus and methods
US8426768B2 (en) * 2008-02-20 2013-04-23 Aerotech, Inc. Position-based laser triggering for scanner
EP2163339B1 (de) * 2008-09-11 2016-11-02 Bystronic Laser AG Laserschneidanlage zum Schneiden eines Werkstücks mit einem Laserstrahl mit einer variablen Schneidgeschwindigkeit
US8680430B2 (en) * 2008-12-08 2014-03-25 Electro Scientific Industries, Inc. Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features
US20100252959A1 (en) 2009-03-27 2010-10-07 Electro Scientific Industries, Inc. Method for improved brittle materials processing
TWI594828B (zh) 2009-05-28 2017-08-11 伊雷克托科學工業股份有限公司 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法
JP4961468B2 (ja) * 2009-10-29 2012-06-27 三星ダイヤモンド工業株式会社 レーザー加工方法、被加工物の分割方法およびレーザー加工装置
GB201006679D0 (en) * 2010-04-21 2010-06-09 Ucl Business Plc Methods and apparatus to control acousto-optic deflectors
KR101973660B1 (ko) * 2010-10-22 2019-04-30 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 빔 디더링 및 스카이빙을 위한 레이저 처리 시스템 및 방법
JP2012187620A (ja) * 2011-03-11 2012-10-04 Sumitomo Heavy Ind Ltd レーザ加工方法及びレーザ加工計画方法
JP2012245539A (ja) * 2011-05-27 2012-12-13 Panasonic Industrial Devices Sunx Co Ltd レーザマーキング装置
CN102679948A (zh) * 2012-03-28 2012-09-19 中国科学院上海技术物理研究所 一种消除高重频激光测距脉冲混叠的方法
KR102214398B1 (ko) * 2012-11-30 2021-02-08 어플라이드 머티어리얼스, 인코포레이티드 모터 모듈들, 다중-축 모터 구동 조립체들, 다중-축 로봇 장치, 및 전자 디바이스 제조 시스템들 및 방법들

Also Published As

Publication number Publication date
JP6773822B2 (ja) 2020-10-21
US20140263201A1 (en) 2014-09-18
US9931713B2 (en) 2018-04-03
JP2019111583A (ja) 2019-07-11
JP2016512792A (ja) 2016-05-09
WO2014152380A1 (en) 2014-09-25
KR102245810B1 (ko) 2021-04-30
TW201442814A (zh) 2014-11-16
CN105102169A (zh) 2015-11-25
TWI632013B (zh) 2018-08-11
KR20150130277A (ko) 2015-11-23

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