TWI632013B - 用以處理工件上或之內的特徵的雷射處理設備和用於雷射處理工件的方法 - Google Patents
用以處理工件上或之內的特徵的雷射處理設備和用於雷射處理工件的方法 Download PDFInfo
- Publication number
- TWI632013B TWI632013B TW103109589A TW103109589A TWI632013B TW I632013 B TWI632013 B TW I632013B TW 103109589 A TW103109589 A TW 103109589A TW 103109589 A TW103109589 A TW 103109589A TW I632013 B TWI632013 B TW I632013B
- Authority
- TW
- Taiwan
- Prior art keywords
- laser
- workpiece
- pulse
- sequence
- speed
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims abstract description 145
- 238000000034 method Methods 0.000 title claims abstract description 42
- 230000008569 process Effects 0.000 title claims abstract description 18
- 230000033001 locomotion Effects 0.000 claims description 19
- 239000002131 composite material Substances 0.000 claims description 14
- 230000001133 acceleration Effects 0.000 claims description 12
- 230000001360 synchronised effect Effects 0.000 claims description 2
- 230000026676 system process Effects 0.000 claims 2
- 238000010304 firing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 230000008859 change Effects 0.000 description 9
- 230000009471 action Effects 0.000 description 7
- 230000003287 optical effect Effects 0.000 description 7
- 238000005457 optimization Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000002679 ablation Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000000153 supplemental effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 238000002329 infrared spectrum Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- NUHSROFQTUXZQQ-UHFFFAOYSA-N isopentenyl diphosphate Chemical compound CC(=C)CCO[P@](O)(=O)OP(O)(O)=O NUHSROFQTUXZQQ-UHFFFAOYSA-N 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
- 238000002211 ultraviolet spectrum Methods 0.000 description 1
- 238000001429 visible spectrum Methods 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361791361P | 2013-03-15 | 2013-03-15 | |
| US61/791,361 | 2013-03-15 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201442814A TW201442814A (zh) | 2014-11-16 |
| TWI632013B true TWI632013B (zh) | 2018-08-11 |
Family
ID=51522871
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103109589A TWI632013B (zh) | 2013-03-15 | 2014-03-14 | 用以處理工件上或之內的特徵的雷射處理設備和用於雷射處理工件的方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9931713B2 (enExample) |
| JP (2) | JP2016512792A (enExample) |
| KR (1) | KR102245810B1 (enExample) |
| CN (1) | CN105102169B (enExample) |
| TW (1) | TWI632013B (enExample) |
| WO (1) | WO2014152380A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6217624B2 (ja) * | 2014-12-26 | 2017-10-25 | ブラザー工業株式会社 | レーザ加工装置及びレーザ加工方法 |
| CN112091421B (zh) | 2015-09-09 | 2022-12-23 | 伊雷克托科学工业股份有限公司 | 镭射处理设备、镭射处理工件的方法及相关配置 |
| CN114654082A (zh) | 2016-12-30 | 2022-06-24 | 伊雷克托科学工业股份有限公司 | 用于延长镭射处理设备中的光学器件生命期的方法和系统 |
| CN112074370B (zh) * | 2018-06-05 | 2023-03-14 | 伊雷克托科学工业股份有限公司 | 激光加工设备、其操作方法以及使用其加工工件的方法 |
| JP7484112B2 (ja) | 2019-09-20 | 2024-05-16 | カシオ計算機株式会社 | 印刷装置、印刷方法及びプログラム |
| US20240286217A1 (en) * | 2021-06-21 | 2024-08-29 | Electro Scientific Industries, Inc. | Laser processing apparatus including beam analysis system and methods of measurement and control of beam characteristics |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060039057A1 (en) * | 2004-08-18 | 2006-02-23 | Han You-Hie | Laser processing apparatus and method using polygon mirror |
| TW200821075A (en) * | 2006-08-22 | 2008-05-16 | Gsi Group Corp | System and method for employing a resonant scanner in an X-Y high speed drilling system |
| US20080192250A1 (en) * | 2007-02-09 | 2008-08-14 | Woo Sik Yoo | Optical Emission Spectroscopy Process Monitoring and Material Characterization |
| CN102069300A (zh) * | 2009-10-29 | 2011-05-25 | 三星钻石工业股份有限公司 | 雷射加工方法、被加工物的分割方法及雷射加工装置 |
| US20120083049A1 (en) * | 2006-07-20 | 2012-04-05 | Gsi Group Corporation | System and method for laser processing at non-constant velocities |
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| JPH01197084A (ja) * | 1988-01-29 | 1989-08-08 | Fanuc Ltd | Ｃｎｃレーザ加工機のパワー制御方式 |
| JPH0230388A (ja) * | 1988-07-20 | 1990-01-31 | Komatsu Ltd | レーザ切断方法 |
| JP2528760B2 (ja) * | 1990-11-30 | 1996-08-28 | 株式会社荏原製作所 | セラミックス製動圧軸受及びその溝加工方法 |
| US5841099A (en) | 1994-07-18 | 1998-11-24 | Electro Scientific Industries, Inc. | Method employing UV laser pulses of varied energy density to form depthwise self-limiting blind vias in multilayered targets |
| US6555781B2 (en) * | 1999-05-10 | 2003-04-29 | Nanyang Technological University | Ultrashort pulsed laser micromachining/submicromachining using an acoustooptic scanning device with dispersion compensation |
| TW482705B (en) | 1999-05-28 | 2002-04-11 | Electro Scient Ind Inc | Beam shaping and projection imaging with solid state UV Gaussian beam to form blind vias |
| JP3768730B2 (ja) * | 1999-06-14 | 2006-04-19 | 松下電器産業株式会社 | レーザ加工機およびその数値制御装置ならびにレーザ加工機の制御方法 |
| US6676878B2 (en) | 2001-01-31 | 2004-01-13 | Electro Scientific Industries, Inc. | Laser segmented cutting |
| JP2003136270A (ja) | 2001-11-02 | 2003-05-14 | Hitachi Via Mechanics Ltd | レーザ加工装置 |
| US6706999B1 (en) | 2003-02-24 | 2004-03-16 | Electro Scientific Industries, Inc. | Laser beam tertiary positioner apparatus and method |
| JP4443208B2 (ja) | 2003-12-12 | 2010-03-31 | 日立ビアメカニクス株式会社 | スキャナ装置 |
| US7133186B2 (en) | 2004-06-07 | 2006-11-07 | Electro Scientific Industries, Inc. | AOM modulation techniques employing transducers to modulate different axes |
| US7425471B2 (en) | 2004-06-18 | 2008-09-16 | Electro Scientific Industries, Inc. | Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset |
| US7259354B2 (en) | 2004-08-04 | 2007-08-21 | Electro Scientific Industries, Inc. | Methods for processing holes by moving precisely timed laser pulses in circular and spiral trajectories |
| JP2006143996A (ja) | 2004-10-19 | 2006-06-08 | Nitto Denko Corp | 耐熱性樹脂 |
| US7244906B2 (en) | 2005-08-30 | 2007-07-17 | Electro Scientific Industries, Inc. | Energy monitoring or control of individual vias formed during laser micromachining |
| JP2008049383A (ja) | 2006-08-28 | 2008-03-06 | Sumitomo Heavy Ind Ltd | ビーム照射方法及びビーム照射装置 |
| JP2008168297A (ja) | 2007-01-05 | 2008-07-24 | Sumitomo Heavy Ind Ltd | レーザ加工装置及びレーザ加工方法 |
| CN200998940Y (zh) * | 2007-01-08 | 2008-01-02 | 李毅 | 太阳能电池激光标刻装置 |
| US7718554B2 (en) * | 2007-02-09 | 2010-05-18 | Wafermasters, Inc. | Focused laser beam processing |
| DE102007012815B4 (de) * | 2007-03-16 | 2024-06-06 | Dmg Mori Ultrasonic Lasertec Gmbh | Verfahren und Vorrichtung zur Bildung eines Gesenks |
| US8026158B2 (en) | 2007-06-01 | 2011-09-27 | Electro Scientific Industries, Inc. | Systems and methods for processing semiconductor structures using laser pulses laterally distributed in a scanning window |
| GB0800333D0 (en) | 2008-01-09 | 2008-02-20 | Ucl Business Plc | Beam deflection apparatus and methods |
| US8426768B2 (en) * | 2008-02-20 | 2013-04-23 | Aerotech, Inc. | Position-based laser triggering for scanner |
| EP2163339B1 (de) * | 2008-09-11 | 2016-11-02 | Bystronic Laser AG | Laserschneidanlage zum Schneiden eines Werkstücks mit einem Laserstrahl mit einer variablen Schneidgeschwindigkeit |
| US8680430B2 (en) * | 2008-12-08 | 2014-03-25 | Electro Scientific Industries, Inc. | Controlling dynamic and thermal loads on laser beam positioning system to achieve high-throughput laser processing of workpiece features |
| US20100252959A1 (en) | 2009-03-27 | 2010-10-07 | Electro Scientific Industries, Inc. | Method for improved brittle materials processing |
| TWI523720B (zh) | 2009-05-28 | 2016-03-01 | 伊雷克托科學工業股份有限公司 | 應用於雷射處理工件中的特徵的聲光偏轉器及相關雷射處理方法 |
| GB201006679D0 (en) * | 2010-04-21 | 2010-06-09 | Ucl Business Plc | Methods and apparatus to control acousto-optic deflectors |
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| JP2012187620A (ja) * | 2011-03-11 | 2012-10-04 | Sumitomo Heavy Ind Ltd | レーザ加工方法及びレーザ加工計画方法 |
| JP2012245539A (ja) * | 2011-05-27 | 2012-12-13 | Panasonic Industrial Devices Sunx Co Ltd | レーザマーキング装置 |
| CN102679948A (zh) * | 2012-03-28 | 2012-09-19 | 中国科学院上海技术物理研究所 | 一种消除高重频激光测距脉冲混叠的方法 |
| KR102163086B1 (ko) * | 2012-11-30 | 2020-10-07 | 어플라이드 머티어리얼스, 인코포레이티드 | 비등가 길이 포어암들을 가진 다-축 로봇 장치, 전자 디바이스 제조 시스템들, 및 전자 디바이스 제조시 기판들을 운반하기 위한 방법들 |
-
2014
- 2014-03-14 US US14/211,115 patent/US9931713B2/en active Active
- 2014-03-14 CN CN201480014078.7A patent/CN105102169B/zh active Active
- 2014-03-14 JP JP2016502393A patent/JP2016512792A/ja active Pending
- 2014-03-14 KR KR1020157022808A patent/KR102245810B1/ko active Active
- 2014-03-14 WO PCT/US2014/027275 patent/WO2014152380A1/en not_active Ceased
- 2014-03-14 TW TW103109589A patent/TWI632013B/zh active
-
2019
- 2019-01-24 JP JP2019010116A patent/JP6773822B2/ja active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060039057A1 (en) * | 2004-08-18 | 2006-02-23 | Han You-Hie | Laser processing apparatus and method using polygon mirror |
| US20120083049A1 (en) * | 2006-07-20 | 2012-04-05 | Gsi Group Corporation | System and method for laser processing at non-constant velocities |
| TW200821075A (en) * | 2006-08-22 | 2008-05-16 | Gsi Group Corp | System and method for employing a resonant scanner in an X-Y high speed drilling system |
| US20080192250A1 (en) * | 2007-02-09 | 2008-08-14 | Woo Sik Yoo | Optical Emission Spectroscopy Process Monitoring and Material Characterization |
| CN102069300A (zh) * | 2009-10-29 | 2011-05-25 | 三星钻石工业股份有限公司 | 雷射加工方法、被加工物的分割方法及雷射加工装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR102245810B1 (ko) | 2021-04-30 |
| JP6773822B2 (ja) | 2020-10-21 |
| TW201442814A (zh) | 2014-11-16 |
| CN105102169B (zh) | 2017-05-03 |
| CN105102169A (zh) | 2015-11-25 |
| KR20150130277A (ko) | 2015-11-23 |
| US9931713B2 (en) | 2018-04-03 |
| WO2014152380A1 (en) | 2014-09-25 |
| JP2016512792A (ja) | 2016-05-09 |
| JP2019111583A (ja) | 2019-07-11 |
| US20140263201A1 (en) | 2014-09-18 |
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