JP2016510170A5 - - Google Patents

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Publication number
JP2016510170A5
JP2016510170A5 JP2015559577A JP2015559577A JP2016510170A5 JP 2016510170 A5 JP2016510170 A5 JP 2016510170A5 JP 2015559577 A JP2015559577 A JP 2015559577A JP 2015559577 A JP2015559577 A JP 2015559577A JP 2016510170 A5 JP2016510170 A5 JP 2016510170A5
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JP
Japan
Prior art keywords
led
assembly according
led assembly
electrode layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015559577A
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English (en)
Japanese (ja)
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JP2016510170A (ja
JP6419089B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/IB2014/058986 external-priority patent/WO2014132164A2/en
Publication of JP2016510170A publication Critical patent/JP2016510170A/ja
Publication of JP2016510170A5 publication Critical patent/JP2016510170A5/ja
Application granted granted Critical
Publication of JP6419089B2 publication Critical patent/JP6419089B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015559577A 2013-02-28 2014-02-14 容量性駆動に適したシンプルなｌｅｄパッケージ Expired - Fee Related JP6419089B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361770413P 2013-02-28 2013-02-28
US61/770,413 2013-02-28
PCT/IB2014/058986 WO2014132164A2 (en) 2013-02-28 2014-02-14 Simple led package suitable for capacitive driving

Publications (3)

Publication Number Publication Date
JP2016510170A JP2016510170A (ja) 2016-04-04
JP2016510170A5 true JP2016510170A5 (OSRAM) 2017-03-23
JP6419089B2 JP6419089B2 (ja) 2018-11-07

Family

ID=50193558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015559577A Expired - Fee Related JP6419089B2 (ja) 2013-02-28 2014-02-14 容量性駆動に適したシンプルなｌｅｄパッケージ

Country Status (6)

Country Link
US (1) US9281299B2 (OSRAM)
EP (1) EP2962531B1 (OSRAM)
JP (1) JP6419089B2 (OSRAM)
CN (1) CN105027674B (OSRAM)
RU (1) RU2663814C2 (OSRAM)
WO (1) WO2014132164A2 (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015114010A1 (de) * 2015-08-24 2017-03-02 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement, Verfahren zur Herstellung eines optoelektronischen Bauelements und Verfahren zum Betrieb eines optoelektronischen Bauelements
JP6914938B2 (ja) 2015-12-23 2021-08-04 コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． 海洋構造物
MX373148B (es) 2015-12-23 2020-04-21 Koninklijke Philips Nv Disposición de carga y disposición de energía eléctrica para alimentar una carga.
TR201910560T4 (tr) 2015-12-23 2019-08-21 Koninklijke Philips Nv Bir yüke güç sağlamaya yönelik yük düzenlemesi ve elektrik gücü düzenlemesi.
CN109690174A (zh) * 2016-10-07 2019-04-26 格罗特工业有限公司 包括电源线、灯和传感器的薄膜片
CN110690329B (zh) * 2019-10-16 2021-06-29 福州大学 一种单端电学接触、单端载流子注入的μLED发光与显示器件及其制备方法
CN110690328B (zh) * 2019-10-16 2021-05-18 福州大学 一种基于波长下转换的无电学接触μLED发光器件

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3249582B2 (ja) 1992-07-24 2002-01-21 シャープ株式会社 発光装置
US6630689B2 (en) 2001-05-09 2003-10-07 Lumileds Lighting, U.S. Llc Semiconductor LED flip-chip with high reflectivity dielectric coating on the mesa
EP1656700A1 (en) * 2003-08-12 2006-05-17 Philips Intellectual Property & Standards GmbH Circuit arrangement for ac driving of organic diodes
TWI223460B (en) 2003-09-23 2004-11-01 United Epitaxy Co Ltd Light emitting diodes in series connection and method of making the same
DE602005027186D1 (de) * 2004-02-25 2011-05-12 Michael Miskin Berverfahren und -vorrichtung
US7294961B2 (en) 2004-03-29 2007-11-13 Articulated Technologies, Llc Photo-radiation source provided with emissive particles dispersed in a charge-transport matrix
US8188503B2 (en) * 2004-05-10 2012-05-29 Permlight Products, Inc. Cuttable illuminated panel
TW200702824A (en) 2005-06-02 2007-01-16 Koninkl Philips Electronics Nv LED assembly and module
US7498252B2 (en) 2006-09-29 2009-03-03 Intel Corporation Dual layer dielectric stack for microelectronics having thick metal lines
US20090140279A1 (en) 2007-12-03 2009-06-04 Goldeneye, Inc. Substrate-free light emitting diode chip
US8530906B2 (en) 2008-06-17 2013-09-10 Koninklijke Philips N.V. Light emitting device adapted for AC drive
WO2010017655A1 (zh) 2008-08-12 2010-02-18 海立尔股份有限公司 具有埋入式电容的发光二极管座体结构
US20110234114A1 (en) * 2008-12-05 2011-09-29 Lynk Labs, Inc. Ac led lighting element and ac led lighting system methods and apparatus
US8384097B2 (en) 2009-04-08 2013-02-26 Ledengin, Inc. Package for multiple light emitting diodes
CN102044600A (zh) 2009-10-15 2011-05-04 展晶科技(深圳)有限公司 发光二极管封装结构及其制备方法
JP5375544B2 (ja) * 2009-11-19 2013-12-25 日亜化学工業株式会社 半導体発光装置及びその製造方法
TWM401207U (en) 2010-11-03 2011-04-01 Harvatek Corp Light-emitting diode packaging structure
JP2012142410A (ja) * 2010-12-28 2012-07-26 Rohm Co Ltd 発光素子ユニットおよびその製造方法、発光素子パッケージならびに照明装置
US8797285B2 (en) 2011-04-18 2014-08-05 Atmel Corporation Panel

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