JP2016507162A5 - - Google Patents

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Publication number
JP2016507162A5
JP2016507162A5 JP2015556606A JP2015556606A JP2016507162A5 JP 2016507162 A5 JP2016507162 A5 JP 2016507162A5 JP 2015556606 A JP2015556606 A JP 2015556606A JP 2015556606 A JP2015556606 A JP 2015556606A JP 2016507162 A5 JP2016507162 A5 JP 2016507162A5
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JP
Japan
Prior art keywords
top plate
module
cavity
substrate
wavelength converting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2015556606A
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English (en)
Japanese (ja)
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JP2016507162A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/IB2014/058875 external-priority patent/WO2014122626A1/en
Publication of JP2016507162A publication Critical patent/JP2016507162A/ja
Publication of JP2016507162A5 publication Critical patent/JP2016507162A5/ja
Ceased legal-status Critical Current

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JP2015556606A 2013-02-11 2014-02-10 波長変換材料の気密シールを有するledモジュール Ceased JP2016507162A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361763081P 2013-02-11 2013-02-11
US61/763,081 2013-02-11
PCT/IB2014/058875 WO2014122626A1 (en) 2013-02-11 2014-02-10 Led module with hermetic seal of wavelength conversion material

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019182604A Division JP2019220726A (ja) 2013-02-11 2019-10-03 波長変換材料の気密シールを有するledモジュール

Publications (2)

Publication Number Publication Date
JP2016507162A JP2016507162A (ja) 2016-03-07
JP2016507162A5 true JP2016507162A5 (https=) 2017-03-09

Family

ID=50151344

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015556606A Ceased JP2016507162A (ja) 2013-02-11 2014-02-10 波長変換材料の気密シールを有するledモジュール
JP2019182604A Pending JP2019220726A (ja) 2013-02-11 2019-10-03 波長変換材料の気密シールを有するledモジュール

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2019182604A Pending JP2019220726A (ja) 2013-02-11 2019-10-03 波長変換材料の気密シールを有するledモジュール

Country Status (7)

Country Link
US (3) US10002855B2 (https=)
EP (1) EP2954566B1 (https=)
JP (2) JP2016507162A (https=)
KR (1) KR20150119179A (https=)
CN (2) CN110010742B (https=)
TW (1) TWI645583B (https=)
WO (1) WO2014122626A1 (https=)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6623157B2 (ja) * 2013-08-16 2019-12-18 三星電子株式会社Samsung Electronics Co.,Ltd. 光学部品を作製する方法、光学部品、および光学部品を含む製品
WO2015138495A1 (en) * 2014-03-11 2015-09-17 Osram Sylvania Inc. Light converter assemblies with enhanced heat dissipation
DE102014108282A1 (de) * 2014-06-12 2015-12-17 Osram Opto Semiconductors Gmbh Optoelektronisches Halbleiterbauelement, Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements sowie Lichtquelle mit einem optoelektronischen Halbleiterbauelement
US9481572B2 (en) * 2014-07-17 2016-11-01 Texas Instruments Incorporated Optical electronic device and method of fabrication
TW201624776A (zh) * 2014-12-18 2016-07-01 Edison Opto Corp Led照明模組
DE112015006331T5 (de) * 2015-03-19 2017-12-14 Osram Opto Semiconductors Gmbh Fenster zum Bedecken eines optoelektronischen Halbleiterchips, mehrere Fenster umfassende Scheibe, Verfahren zur Herstellung von Fenstern und optoelektronisches Halbleiterbauelement
KR20180014184A (ko) * 2015-06-26 2018-02-07 코닝 인코포레이티드 양자점을 포함하는 밀봉 장치 및 그 제조 방법
DE102015111910A1 (de) * 2015-07-22 2017-01-26 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement, Verbund von optoelektronischen Bauelementen und Verfahren zur Herstellung eines optoelektronischen Bauelements
JP2018532256A (ja) * 2015-08-12 2018-11-01 コーニング インコーポレイテッド 密封型装置及びその構成方法
KR101778848B1 (ko) * 2015-08-21 2017-09-14 엘지전자 주식회사 발광소자 패키지 어셈블리 및 이의 제조 방법
CN109314170B (zh) * 2015-12-02 2023-05-09 亮锐控股有限公司 用于优化的热阻、焊接可靠性和smt加工良率的led金属焊盘配置
CN114725272B (zh) 2016-03-24 2025-03-11 索尼公司 显示装置、发光装置以及照明装置
US10211384B2 (en) * 2016-03-28 2019-02-19 Samsung Electronics Co., Ltd. Light emitting diode apparatus and manufacturing method thereof
JP6748501B2 (ja) * 2016-07-14 2020-09-02 ローム株式会社 電子部品およびその製造方法
KR102627073B1 (ko) * 2016-11-30 2024-01-19 삼성디스플레이 주식회사 백라이트 유닛, 표시 장치 및 표시 장치의 제조 방법
JP6790899B2 (ja) 2017-02-17 2020-11-25 日亜化学工業株式会社 発光モジュールの製造方法及び発光モジュール
DE102017109083A1 (de) 2017-04-27 2018-10-31 Osram Gmbh Beleuchtungsvorrichtung und Verfahren zur Herstellung einer Beleuchtungsvorrichtung
US20180323354A1 (en) * 2017-05-07 2018-11-08 Yang Wang Light emitting device and method for manufacturing light emitting device
TWI658610B (zh) * 2017-09-08 2019-05-01 Maven Optronics Co., Ltd. 應用量子點色彩轉換之發光裝置及其製造方法
KR102415343B1 (ko) * 2017-09-25 2022-06-30 엘지전자 주식회사 디스플레이 디바이스
KR102498252B1 (ko) * 2017-09-26 2023-02-10 삼성전자주식회사 발광 칩들을 포함하는 디스플레이 및 그 제조 방법
CN109962149B (zh) * 2017-12-14 2020-10-27 Tcl科技集团股份有限公司 一种封装薄膜及其制备方法、光电器件
CN113544829A (zh) * 2019-03-07 2021-10-22 康宁股份有限公司 用于管芯向上的扇出型封装的玻璃载体及其制造方法
US20220293669A1 (en) * 2021-03-15 2022-09-15 Samsung Electronics Co., Ltd. Display apparatus and method of manufacturing the same
TWI813359B (zh) * 2022-06-29 2023-08-21 晶呈科技股份有限公司 Led電路基板結構、led測試封裝方法及led畫素封裝體
TWI824591B (zh) 2022-06-29 2023-12-01 晶呈科技股份有限公司 Led電路基板結構、led測試封裝方法及led畫素封裝體

Family Cites Families (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003298115A (ja) * 2002-04-05 2003-10-17 Citizen Electronics Co Ltd 発光ダイオード
JP2004047748A (ja) * 2002-07-12 2004-02-12 Stanley Electric Co Ltd 発光ダイオード
CN101789482B (zh) * 2003-03-10 2013-04-17 丰田合成株式会社 固体元件装置及其制造方法
US7087465B2 (en) * 2003-12-15 2006-08-08 Philips Lumileds Lighting Company, Llc Method of packaging a semiconductor light emitting device
US8816369B2 (en) * 2004-10-29 2014-08-26 Led Engin, Inc. LED packages with mushroom shaped lenses and methods of manufacturing LED light-emitting devices
JP5113329B2 (ja) * 2005-11-25 2013-01-09 パナソニック株式会社 発光装置
JP4881001B2 (ja) * 2005-12-29 2012-02-22 シチズン電子株式会社 発光装置
JP2007243052A (ja) * 2006-03-10 2007-09-20 Matsushita Electric Works Ltd 照明器具及びその製造方法
JP2007250817A (ja) 2006-03-16 2007-09-27 Stanley Electric Co Ltd Led
JP2007273506A (ja) * 2006-03-30 2007-10-18 Sumitomo Chemical Co Ltd 化合物半導体発光素子
US20080029774A1 (en) * 2006-08-04 2008-02-07 Acol Technologies S.A. Semiconductor light source packages with broadband and angular uniformity support
US20080203412A1 (en) * 2007-02-28 2008-08-28 E-Pin Optical Industry Co., Ltd. LED assembly with molded glass lens
EP2121872B1 (en) 2007-03-19 2015-12-09 Nanosys, Inc. Methods for encapsulating nanocrystals
GB0801509D0 (en) * 2008-01-28 2008-03-05 Photonstar Led Ltd Light emitting system with optically transparent thermally conductive element
US8390193B2 (en) * 2008-12-31 2013-03-05 Intematix Corporation Light emitting device with phosphor wavelength conversion
JP2010177375A (ja) 2009-01-28 2010-08-12 Citizen Electronics Co Ltd 発光装置及び発光装置の製造方法
US7855394B2 (en) * 2009-06-18 2010-12-21 Bridgelux, Inc. LED array package covered with a highly thermal conductive plate
CN102110756B (zh) * 2009-12-23 2012-10-03 海洋王照明科技股份有限公司 白光led及其封装方法
JP5497469B2 (ja) * 2010-02-16 2014-05-21 スタンレー電気株式会社 発光装置およびその製造方法
KR20110094996A (ko) * 2010-02-18 2011-08-24 엘지이노텍 주식회사 발광소자 패키지, 그 제조방법 및 조명시스템
JP2011192845A (ja) * 2010-03-15 2011-09-29 Seiko Instruments Inc 発光部品、発光器及び発光部品の製造方法
JP2011216712A (ja) * 2010-03-31 2011-10-27 Citizen Finetech Miyota Co Ltd 電子デバイス
US8723409B2 (en) * 2010-04-07 2014-05-13 Nichia Corporation Light emitting device
JP2011249729A (ja) * 2010-05-31 2011-12-08 Hitachi Kyowa Engineering Co Ltd 光素子搭載用基板および光素子搭載パッケージ
US20110317397A1 (en) 2010-06-23 2011-12-29 Soraa, Inc. Quantum dot wavelength conversion for hermetically sealed optical devices
WO2012011460A1 (ja) * 2010-07-22 2012-01-26 京セラ株式会社 発光装置
CN102347420A (zh) * 2010-08-04 2012-02-08 展晶科技(深圳)有限公司 发光二极管制造方法
TWI406435B (zh) 2010-08-06 2013-08-21 Advanced Optoelectronic Tech 發光二極體製造方法
US8198109B2 (en) * 2010-08-27 2012-06-12 Quarkstar Llc Manufacturing methods for solid state light sheet or strip with LEDs connected in series for general illumination
US8253330B2 (en) 2010-11-30 2012-08-28 GEM Weltronics TWN Corporation Airtight multi-layer array type LED
JP2012134435A (ja) * 2010-11-30 2012-07-12 Mitsubishi Shindoh Co Ltd バックライト用発光装置
JP2012156409A (ja) * 2011-01-28 2012-08-16 Mitsubishi Shindoh Co Ltd バックライト用発光装置
US20120261703A1 (en) * 2011-03-21 2012-10-18 Zimmerman Scott M Self-cooling solid-state emitters
JP5919504B2 (ja) 2011-06-30 2016-05-18 パナソニックIpマネジメント株式会社 発光装置
US20140299902A1 (en) * 2012-01-18 2014-10-09 Goldeneye, Inc. Articles and methods for rapid manufacturing of solid state light sources

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