JP2016505220A - 磁気抵抗トンネル接合（ｍｔｊ）デバイス強磁性層内の周辺端部損傷を改善するための方法および装置 - Google Patents

磁気抵抗トンネル接合（ｍｔｊ）デバイス強磁性層内の周辺端部損傷を改善するための方法および装置 Download PDF

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JP2016505220A
JP2016505220A JP2015555245A JP2015555245A JP2016505220A JP 2016505220 A JP2016505220 A JP 2016505220A JP 2015555245 A JP2015555245 A JP 2015555245A JP 2015555245 A JP2015555245 A JP 2015555245A JP 2016505220 A JP2016505220 A JP 2016505220A
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ferromagnetic
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JP2016505220A5 (enExample
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シャオチュン・ジュウ
シア・リ
スン・エイチ・カン
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クアルコム，インコーポレイテッド
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/10—Magnetoresistive devices
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
    • G11C11/15—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements using multiple magnetic layers
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/14—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements
    • G11C11/155—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using thin-film elements with cylindrical configuration
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
    • G11C11/02—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements
    • G11C11/16—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect
    • G11C11/161—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using magnetic elements using elements in which the storage effect is based on magnetic spin effect details concerning the memory cell structure, e.g. the layers of the ferromagnetic memory cell
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/80—Constructional details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N50/00—Galvanomagnetic devices
    • H10N50/80—Constructional details
    • H10N50/85—Materials of the active region

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Hall/Mr Elements (AREA)
  • Mram Or Spin Memory Techniques (AREA)
JP2015555245A 2013-01-25 2014-01-22 磁気抵抗トンネル接合（ｍｔｊ）デバイス強磁性層内の周辺端部損傷を改善するための方法および装置 Ceased JP2016505220A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/749,731 2013-01-25
US13/749,731 US20140210021A1 (en) 2013-01-25 2013-01-25 Method and apparatus for ameliorating peripheral edge damage in magnetoresistive tunnel junction (mtj) device ferromagnetic layers
PCT/US2014/012602 WO2014116742A1 (en) 2013-01-25 2014-01-22 Method and apparatus for ameliorating peripheral edge damage in magnetoresistive tunnel junction (mtj) device ferromagnetic layers

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JP2016505220A true JP2016505220A (ja) 2016-02-18
JP2016505220A5 JP2016505220A5 (enExample) 2017-02-16

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US (2) US20140210021A1 (enExample)
EP (1) EP2948953A1 (enExample)
JP (1) JP2016505220A (enExample)
KR (1) KR20150110691A (enExample)
CN (1) CN105308684B (enExample)
WO (1) WO2014116742A1 (enExample)

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JP2023086085A (ja) * 2021-12-09 2023-06-21 台湾積體電路製造股▲ふん▼有限公司 磁気トンネル接合装置及びその形成方法

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US9396781B2 (en) * 2010-12-10 2016-07-19 Avalanche Technology, Inc. Magnetic random access memory having perpendicular composite reference layer
KR102175471B1 (ko) * 2014-04-04 2020-11-06 삼성전자주식회사 자기 저항 메모리 장치 및 그 제조 방법
KR102240769B1 (ko) * 2014-08-14 2021-04-16 삼성전자주식회사 자기 메모리 장치 및 그의 형성방법
US10170690B2 (en) 2015-11-16 2019-01-01 Samsung Electronics Co., Ltd. Hybrid-fl with edge-modified coupling
CN108242504A (zh) * 2016-12-27 2018-07-03 上海磁宇信息科技有限公司 一种磁性隧道结的修剪方法及其制备方法
EP3343655B1 (en) * 2016-12-29 2022-03-02 IMEC vzw Magnetic tunnel junction device
US10297746B2 (en) * 2017-04-05 2019-05-21 Taiwan Semiconductor Manufacturing Company, Ltd. Post treatment to reduce shunting devices for physical etching process
US10497858B1 (en) * 2018-12-21 2019-12-03 Applied Materials, Inc. Methods for forming structures for MRAM applications
CN117425353A (zh) * 2019-05-09 2024-01-19 联华电子股份有限公司 磁阻式随机存取存储器
US11495737B2 (en) * 2020-06-29 2022-11-08 United Microelectronics Corp. Magnetic tunnel junction (MTJ) device
CN114156404A (zh) * 2021-11-09 2022-03-08 中电海康集团有限公司 一种具有高翻转效率的磁隧道结及其制备方法
US20230309415A1 (en) * 2022-03-23 2023-09-28 Tdk Corporation Magneto resistive element
CN116106801B (zh) * 2023-04-14 2023-06-20 珠海多创科技有限公司 磁阻传感器、磁传感装置及其制备方法

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WO2007032379A1 (ja) * 2005-09-13 2007-03-22 Canon Anelva Corporation 磁気抵抗効果素子の製造方法及び製造装置
JP2008186506A (ja) * 2007-01-29 2008-08-14 Hitachi Global Storage Technologies Netherlands Bv 薄膜磁気ヘッド及びその製造方法
US20110235217A1 (en) * 2010-03-29 2011-09-29 Qualcomm Incorporated Fabricating A Magnetic Tunnel Junction Storage Element
US20120074511A1 (en) * 2010-09-17 2012-03-29 Kabushiki Kaisha Toshiba Magnetic memory and method of manufacturing the same
US20120244639A1 (en) * 2011-03-22 2012-09-27 Yuichi Ohsawa Method of manufacturing magnetic memory

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US6365419B1 (en) * 2000-08-28 2002-04-02 Motorola, Inc. High density MRAM cell array
US20030231437A1 (en) * 2002-06-17 2003-12-18 Childress Jeffrey R. Current-perpendicular-to-plane magnetoresistive device with oxidized free layer side regions and method for its fabrication
JP2004146687A (ja) * 2002-10-25 2004-05-20 Toshiba Corp 磁気記憶装置及びその製造方法

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WO2007032379A1 (ja) * 2005-09-13 2007-03-22 Canon Anelva Corporation 磁気抵抗効果素子の製造方法及び製造装置
EP1926158A1 (en) * 2005-09-13 2008-05-28 Canon Anelva Corporation Method and apparatus for manufacturing magnetoresistive device
US20100155231A1 (en) * 2005-09-13 2010-06-24 Canon Anelva Corporation Method and Apparatus for Manufacturing Magnetoresistive Devices
JP2011071526A (ja) * 2005-09-13 2011-04-07 Canon Anelva Corp 磁気抵抗効果素子の製造方法
JP2008186506A (ja) * 2007-01-29 2008-08-14 Hitachi Global Storage Technologies Netherlands Bv 薄膜磁気ヘッド及びその製造方法
US20110235217A1 (en) * 2010-03-29 2011-09-29 Qualcomm Incorporated Fabricating A Magnetic Tunnel Junction Storage Element
WO2011123357A1 (en) * 2010-03-29 2011-10-06 Qualcomm Incorporated Magnetic tunnel junction storage element and method of fabricating the same
JP2013524515A (ja) * 2010-03-29 2013-06-17 クアルコム，インコーポレイテッド 磁気トンネル接合記憶素子の製造
US20120074511A1 (en) * 2010-09-17 2012-03-29 Kabushiki Kaisha Toshiba Magnetic memory and method of manufacturing the same
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Cited By (3)

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Publication number Priority date Publication date Assignee Title
JP2023086085A (ja) * 2021-12-09 2023-06-21 台湾積體電路製造股▲ふん▼有限公司 磁気トンネル接合装置及びその形成方法
JP7476271B2 (ja) 2021-12-09 2024-04-30 台湾積體電路製造股▲ふん▼有限公司 磁気トンネル接合装置及びその形成方法
US12464955B2 (en) 2021-12-09 2025-11-04 Taiwan Semiconductor Manufacturing Co., Ltd. Magnetic tunnel junction device and method of forming the same

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US20140210021A1 (en) 2014-07-31
US20160254443A1 (en) 2016-09-01
CN105308684B (zh) 2019-05-07
EP2948953A1 (en) 2015-12-02
CN105308684A (zh) 2016-02-03
KR20150110691A (ko) 2015-10-02
WO2014116742A1 (en) 2014-07-31

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