JP2016204420A5 - - Google Patents
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- Publication number
- JP2016204420A5 JP2016204420A5 JP2015083444A JP2015083444A JP2016204420A5 JP 2016204420 A5 JP2016204420 A5 JP 2016204420A5 JP 2015083444 A JP2015083444 A JP 2015083444A JP 2015083444 A JP2015083444 A JP 2015083444A JP 2016204420 A5 JP2016204420 A5 JP 2016204420A5
- Authority
- JP
- Japan
- Prior art keywords
- molding material
- epoxy resin
- sic
- sealing
- gan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 3
- 239000011256 inorganic filler Substances 0.000 claims description 2
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 2
- 239000003822 epoxy resin Substances 0.000 claims 6
- 239000000463 material Substances 0.000 claims 6
- 238000000465 moulding Methods 0.000 claims 6
- 229920000647 polyepoxide Polymers 0.000 claims 6
- 229910002601 GaN Inorganic materials 0.000 claims 5
- 229910003465 moissanite Inorganic materials 0.000 claims 5
- 238000007789 sealing Methods 0.000 claims 5
- 229910010271 silicon carbide Inorganic materials 0.000 claims 5
- 239000003795 chemical substances by application Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 239000011347 resin Substances 0.000 claims 2
- 239000006087 Silane Coupling Agent Substances 0.000 claims 1
- 125000004432 carbon atoms Chemical group C* 0.000 claims 1
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 229910001410 inorganic ion Inorganic materials 0.000 claims 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- -1 for example Chemical compound 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015083444A JP6497652B2 (ja) | 2015-04-15 | 2015-04-15 | 封止用エポキシ樹脂成形材料及び電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015083444A JP6497652B2 (ja) | 2015-04-15 | 2015-04-15 | 封止用エポキシ樹脂成形材料及び電子部品 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2018103752A Division JP6611861B2 (ja) | 2018-05-30 | 2018-05-30 | 封止用エポキシ樹脂成形材料及び電子部品 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016204420A JP2016204420A (ja) | 2016-12-08 |
JP2016204420A5 true JP2016204420A5 (sv) | 2018-07-12 |
JP6497652B2 JP6497652B2 (ja) | 2019-04-10 |
Family
ID=57489017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015083444A Active JP6497652B2 (ja) | 2015-04-15 | 2015-04-15 | 封止用エポキシ樹脂成形材料及び電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6497652B2 (sv) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6537170B2 (ja) * | 2015-05-12 | 2019-07-03 | 京セラ株式会社 | 封止用成形材料及び電子部品装置 |
JP7296191B2 (ja) | 2018-01-09 | 2023-06-22 | 味の素株式会社 | 硬化性樹脂組成物、樹脂シート、プリント配線板及び半導体装置 |
EP3876273B1 (en) * | 2018-11-01 | 2024-04-03 | Sumitomo Bakelite Co., Ltd. | Encapsulating resin composition for power device and power device |
CN111621152A (zh) * | 2019-02-28 | 2020-09-04 | 京瓷株式会社 | 元件密封用成型材料组合物及电子部件装置 |
WO2021039687A1 (ja) * | 2019-08-26 | 2021-03-04 | リンテック株式会社 | 樹脂組成物及び樹脂シート |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05239426A (ja) * | 1992-03-03 | 1993-09-17 | Yokohama Rubber Co Ltd:The | 接着剤組成物 |
JP4276423B2 (ja) * | 2002-11-13 | 2009-06-10 | トヨタ自動車株式会社 | 塩基性シリカ粉体、その製造方法及び樹脂組成物 |
JP5217119B2 (ja) * | 2005-06-15 | 2013-06-19 | 日立化成株式会社 | 封止用液状エポキシ樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ |
KR20090071774A (ko) * | 2007-12-28 | 2009-07-02 | 주식회사 두산 | 접착제용 수지 조성물 및 이의 이용 |
JP2010100803A (ja) * | 2008-09-24 | 2010-05-06 | Sekisui Chem Co Ltd | エポキシ系樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板及び多層積層板 |
JP5195454B2 (ja) * | 2009-01-22 | 2013-05-08 | 味の素株式会社 | 樹脂組成物 |
JP5609165B2 (ja) * | 2009-04-30 | 2014-10-22 | 横浜ゴム株式会社 | シーラント用トップコート組成物 |
JP5691312B2 (ja) * | 2010-09-06 | 2015-04-01 | 横浜ゴム株式会社 | シーラント用の硬化促進剤およびこれを用いるシーラントの施工方法 |
KR101803127B1 (ko) * | 2010-10-19 | 2017-11-29 | 스미또모 베이크라이트 가부시키가이샤 | 밀봉용 수지 조성물 및 전자 부품 장치 |
US8735733B2 (en) * | 2011-01-18 | 2014-05-27 | Hitachi Chemical Company, Ltd. | Resin composition, prepreg laminate obtained with the same and printed-wiring board |
CN103347938B (zh) * | 2011-01-24 | 2014-07-30 | 住友电木株式会社 | 半固化片、层压板、印刷电路板及半导体装置 |
JP5307263B1 (ja) * | 2012-03-01 | 2013-10-02 | 住友ベークライト株式会社 | 固定用樹脂組成物、ロータ、および自動車 |
JP2014019815A (ja) * | 2012-07-20 | 2014-02-03 | Mitsubishi Gas Chemical Co Inc | 硬化性樹脂組成物、およびその硬化物 |
JPWO2014065152A1 (ja) * | 2012-10-26 | 2016-09-08 | 新日鉄住金化学株式会社 | エポキシ樹脂組成物、エポキシ樹脂硬化物の製造方法、及び半導体装置 |
JP6021150B2 (ja) * | 2012-12-05 | 2016-11-09 | 中部電力株式会社 | 耐低温性樹脂組成物及びそれを用いた超電導線材 |
JP2014237861A (ja) * | 2014-09-26 | 2014-12-18 | 日本化薬株式会社 | エポキシ樹脂組成物、硬化性樹脂組成物 |
-
2015
- 2015-04-15 JP JP2015083444A patent/JP6497652B2/ja active Active
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