JP2016204420A5 - - Google Patents

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Publication number
JP2016204420A5
JP2016204420A5 JP2015083444A JP2015083444A JP2016204420A5 JP 2016204420 A5 JP2016204420 A5 JP 2016204420A5 JP 2015083444 A JP2015083444 A JP 2015083444A JP 2015083444 A JP2015083444 A JP 2015083444A JP 2016204420 A5 JP2016204420 A5 JP 2016204420A5
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JP
Japan
Prior art keywords
molding material
epoxy resin
sic
sealing
gan
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JP2015083444A
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English (en)
Japanese (ja)
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JP6497652B2 (ja
JP2016204420A (ja
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Priority to JP2015083444A priority Critical patent/JP6497652B2/ja
Priority claimed from JP2015083444A external-priority patent/JP6497652B2/ja
Publication of JP2016204420A publication Critical patent/JP2016204420A/ja
Publication of JP2016204420A5 publication Critical patent/JP2016204420A5/ja
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JP2015083444A 2015-04-15 2015-04-15 封止用エポキシ樹脂成形材料及び電子部品 Active JP6497652B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015083444A JP6497652B2 (ja) 2015-04-15 2015-04-15 封止用エポキシ樹脂成形材料及び電子部品

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015083444A JP6497652B2 (ja) 2015-04-15 2015-04-15 封止用エポキシ樹脂成形材料及び電子部品

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2018103752A Division JP6611861B2 (ja) 2018-05-30 2018-05-30 封止用エポキシ樹脂成形材料及び電子部品

Publications (3)

Publication Number Publication Date
JP2016204420A JP2016204420A (ja) 2016-12-08
JP2016204420A5 true JP2016204420A5 (sv) 2018-07-12
JP6497652B2 JP6497652B2 (ja) 2019-04-10

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ID=57489017

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JP2015083444A Active JP6497652B2 (ja) 2015-04-15 2015-04-15 封止用エポキシ樹脂成形材料及び電子部品

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JP (1) JP6497652B2 (sv)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6537170B2 (ja) * 2015-05-12 2019-07-03 京セラ株式会社 封止用成形材料及び電子部品装置
JP7296191B2 (ja) 2018-01-09 2023-06-22 味の素株式会社 硬化性樹脂組成物、樹脂シート、プリント配線板及び半導体装置
EP3876273B1 (en) * 2018-11-01 2024-04-03 Sumitomo Bakelite Co., Ltd. Encapsulating resin composition for power device and power device
CN111621152A (zh) * 2019-02-28 2020-09-04 京瓷株式会社 元件密封用成型材料组合物及电子部件装置
WO2021039687A1 (ja) * 2019-08-26 2021-03-04 リンテック株式会社 樹脂組成物及び樹脂シート

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05239426A (ja) * 1992-03-03 1993-09-17 Yokohama Rubber Co Ltd:The 接着剤組成物
JP4276423B2 (ja) * 2002-11-13 2009-06-10 トヨタ自動車株式会社 塩基性シリカ粉体、その製造方法及び樹脂組成物
JP5217119B2 (ja) * 2005-06-15 2013-06-19 日立化成株式会社 封止用液状エポキシ樹脂組成物、電子部品装置及びウエハーレベルチップサイズパッケージ
KR20090071774A (ko) * 2007-12-28 2009-07-02 주식회사 두산 접착제용 수지 조성물 및 이의 이용
JP2010100803A (ja) * 2008-09-24 2010-05-06 Sekisui Chem Co Ltd エポキシ系樹脂組成物、シート状成形体、プリプレグ、硬化体、積層板及び多層積層板
JP5195454B2 (ja) * 2009-01-22 2013-05-08 味の素株式会社 樹脂組成物
JP5609165B2 (ja) * 2009-04-30 2014-10-22 横浜ゴム株式会社 シーラント用トップコート組成物
JP5691312B2 (ja) * 2010-09-06 2015-04-01 横浜ゴム株式会社 シーラント用の硬化促進剤およびこれを用いるシーラントの施工方法
KR101803127B1 (ko) * 2010-10-19 2017-11-29 스미또모 베이크라이트 가부시키가이샤 밀봉용 수지 조성물 및 전자 부품 장치
US8735733B2 (en) * 2011-01-18 2014-05-27 Hitachi Chemical Company, Ltd. Resin composition, prepreg laminate obtained with the same and printed-wiring board
CN103347938B (zh) * 2011-01-24 2014-07-30 住友电木株式会社 半固化片、层压板、印刷电路板及半导体装置
JP5307263B1 (ja) * 2012-03-01 2013-10-02 住友ベークライト株式会社 固定用樹脂組成物、ロータ、および自動車
JP2014019815A (ja) * 2012-07-20 2014-02-03 Mitsubishi Gas Chemical Co Inc 硬化性樹脂組成物、およびその硬化物
JPWO2014065152A1 (ja) * 2012-10-26 2016-09-08 新日鉄住金化学株式会社 エポキシ樹脂組成物、エポキシ樹脂硬化物の製造方法、及び半導体装置
JP6021150B2 (ja) * 2012-12-05 2016-11-09 中部電力株式会社 耐低温性樹脂組成物及びそれを用いた超電導線材
JP2014237861A (ja) * 2014-09-26 2014-12-18 日本化薬株式会社 エポキシ樹脂組成物、硬化性樹脂組成物

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