JP2016143861A5

JP2016143861A5 -

Info

Publication number: JP2016143861A5
Application number: JP2015021259A
Authority: JP
Filing date: 2015-02-05
Publication date: 2016-10-13
Anticipated expiration: 2035-02-05

Description

図１（ａ）に示された第２のマーク４のうち、図の上側で封止済基板１の長手方向に沿って並ぶ第２のマーク４と、図の下側で封止済基板１の長手方向に沿って並ぶ第２のマーク４とからそれぞれ選ばれた相対向する各組合せ（４Ａと４Ｄ、４Ｈと４Ｅ、等）を結ぶようにして、短手方向に沿う複数の第１の切断線５がそれぞれ仮想的に設定される。図１（ａ）に示された第２のマーク４のうち、図の左側で封止済基板１の短手方向に沿って並ぶ第２のマーク４と、図の右側で封止済基板１の短手方向に沿って並ぶ第２のマーク４とからそれぞれ選ばれた相対向する各組合せ（４Ｂと４Ｇ、４Ｃと４Ｆ、等）を結ぶようにして、長手方向に沿う複数の第２の切断線６がそれぞれ仮想的に設定される。複数の第１の切断線５と複数の第２の切断線６とによって囲まれた複数の領域７が、個片化されることによってそれぞれ製造される製品に対応する。図１（ａ）においては、例えば、短手方向に７本の第１の切断線５が設定され、長手方向に４本の第２の切断線５が設定される。したがって、短手方向には３個及び長手方向には６個の領域７が形成され、合計で１８個の領域７が格子状に形成される。封止済基板１に形成される領域７は、個片化される製品のサイズや数によって任意に設定される。 Of the second marks 4 shown in FIG. 1A, the second marks 4 arranged along the longitudinal direction of the sealed substrate 1 on the upper side of the figure, and the sealed substrate 1 on the lower side of the figure. A plurality of first marks along the short direction so as to connect the respective opposing combinations (4A and 4D, 4H and 4E, etc.) selected from the second marks 4 arranged along the longitudinal direction Each cutting line 5 is set virtually. Of the second marks 4 shown in FIG. 1 (a), the second mark 4 arranged along the short direction of the sealed substrate 1 on the left side of the figure, and the sealed substrate 1 on the right side of the figure. A plurality of second combinations 4 along the longitudinal direction by connecting the respective opposing combinations (4B and 4G, 4C and 4F, etc.) selected from the second marks 4 arranged along the short direction of Each cutting line 6 is virtually set. A plurality of regions 7 surrounded by a plurality of first cutting lines 5 and a plurality of second cutting lines 6 correspond to products manufactured by being separated into pieces. In FIG. 1A, for example, seven first cutting lines 5 are set in the short direction, and four second cutting lines 5 are set in the longitudinal direction. Therefore, three regions 7 are formed in the short direction and six regions 7 are formed in the longitudinal direction, and a total of 18 regions 7 are formed in a lattice shape. The region 7 formed on the sealed substrate 1 is arbitrarily set depending on the size and number of products to be separated.

１封止済基板（被切断物）
２基板
３封止樹脂
４、４Ａ、４Ｂ、・・・、４Ｇ、４Ｈ第２のマーク
５第１の切断線（切断線）
６第２の切断線（切断線）
７領域（製品）
８切断用テーブル
９切断用治具
１０金属テーブル
１１樹脂シート
１２突起部
１３吸着孔
１４空間
１５第１の切断溝（切断溝）
１６第２の切断溝（切断溝）
１７、１７Ａ、１７Ｂ、・・・、１７Ｇ、１７Ｈ第１のマーク
１８、１８Ａ、１８Ｂ、・・・、１８Ｇ、１８Ｈ第１のマーク
１９切断装置
２０基板供給機構
２１基板載置部
２２搬送機構
２３移動機構
２４回転機構
２５アライメント用のカメラ（撮像手段）
２６スピンドル（切断機構）
２７回転刃
２８検査用テーブル
２９切断済基板
３０トレイ
３１大型の封止済基板
３２、３２Ａ、３２Ｂ、・・・、３２Ｇ、３２Ｈ、３２Ｉ、３２Ｊ第２のマーク
３３分割線
３４分割線
３５、３５Ａ、３５Ｂ、３５Ｃ、３５Ｄ分割された封止済基板（被切断物）
Ａ基板供給モジュール
Ｂ基板切断モジュール
Ｃ検査モジュール
Ｐ製品
ＣＴＬ制御部（制御手段）
ＳＵＢ封止済基板が載置される領域
1 Sealed substrate (object to be cut)
2 Substrate 3 Sealing resin 4, 4A, 4B,..., 4G, 4H Second mark 5 First cutting line (cutting line)
6 Second cutting line (cutting line)
7 Area (Product)
8 Cutting Table 9 Cutting Jig 10 Metal Table 11 Resin Sheet 12 Protrusion 13 Adsorption Hole 14 Space 15 First Cutting Groove (Cut Groove)
16 Second cutting groove (cutting groove)
17, 17A, 17B,..., 17G, 17H First mark 18, 18A, 18B,..., 18G, 18H First mark 19 Cutting device 20 Substrate supply mechanism 21 Substrate placing portion 22 Transport mechanism 23 Moving mechanism 24 Rotating mechanism 25 Camera for alignment (imaging means)
26 Spindle (cutting mechanism)
27 Rotating blade 28 Inspection table 29 Cut substrate 30 Tray 31 Large sealed substrate 32, 32A, 32B,..., 32G, 32H, 32I, 32J Second mark 33 Dividing line 34 Dividing line 35, 35A , 35B, 35C, 35D Divided sealed substrate (object to be cut)
A Board supply module B Board cutting module C Inspection module P Product CTL Control unit (control means)
SUB Area where the sealed substrate is placed

Claims

A cutting jig having a plurality of first marks and a plurality of cutting grooves, and a workpiece having a plurality of second marks placed on the cutting jig, along a plurality of cutting lines. A cutting mechanism for cutting, a transport mechanism for transporting the object to be cut, and a moving mechanism for moving the cutting jig and the cutting mechanism relative to each other. A cutting device used in manufacturing a plurality of products by cutting along,
Imaging means for imaging the plurality of first marks and the plurality of second marks;
Control means for aligning the object to be cut and the cutting jig placed on the cutting jig by the transport mechanism;
First position information consisting of position information of a specific first mark measured based on image data acquired by the imaging means and stored in advance, and a specific second mark measured by the imaging means The control means compares the second position information consisting of the position information to calculate a deviation amount representing a positional deviation between the cutting jig and the object to be cut,
The conveyance mechanism lifts the object to be cut from the cutting jig, and moves the conveyance mechanism and the cutting jig relative to each other based on the deviation amount, thereby setting the object to be cut to the deviation amount. After moving to the corresponding target position, the transport mechanism places the workpiece again on the cutting jig,
The position of the plurality of cutting grooves and the position of the plurality of cutting lines are aligned by moving the workpiece to the target position,
The cutting apparatus characterized in that the cutting mechanism cuts the object to be cut placed again along the plurality of cutting lines.

The cutting device according to claim 1, wherein
At least a part of the means contributing to the cutting included in the cutting mechanism or at least a part of the means contributing to the cutting supplied from the cutting mechanism corresponds to a cutting line cut among the plurality of cutting lines. A cutting device that passes through the cutting groove.

The cutting device according to claim 2, wherein
The object to be cut is moved to the target position along at least one of the X direction, the Y direction, and the θ direction by relatively moving the transport mechanism and the cutting jig. The cutting apparatus according to claim 1, wherein the transport mechanism places the workpiece again on the cutting jig.

In the cutting device according to any one of claims 1 to 3,
At least two of the specific first marks are set along a first direction and a second direction orthogonal to the first direction in plan view,
The particular second marks, cutting device which is characterized in that at least two sets respectively along said in plan view the first and second directions.

In the cutting device according to any one of claims 1 to 3,
The cutting apparatus, wherein the object to be cut is a sealed substrate or a divided sealed substrate.

In the cutting device according to any one of claims 1 to 3,
The object to be cut is a substrate in which functional elements are formed or divided substrates, resin molded products or divided resin molded products, or glass plates or divided in a plurality of regions respectively corresponding to the plurality of products. Cutting apparatus characterized by being a glass plate .

A step of preparing a cutting jig having a plurality of cutting grooves and a plurality of first marks, a step of preparing a workpiece having a plurality of cutting lines and a plurality of second marks, and a transport mechanism. A step of placing the object to be cut on the cutting jig, and moving the cutting jig and the cutting mechanism relative to each other along the plurality of cutting lines using the cutting mechanism. Cutting the object to be cut, and a cutting method comprising:
Obtaining a first image data by imaging a specific first mark among the plurality of first marks by an imaging means;
Obtaining first position information composed of position information of the specific first mark by performing image processing based on the first image data;
Capturing a specific second mark among the plurality of second marks by the imaging means to obtain second image data;
Obtaining second position information composed of position information of the specific second mark by performing image processing based on the second image data; and
Calculating a shift amount representing a positional shift between the cutting jig and the workpiece by comparing the first position information and the second position information;
The transport mechanism lifting the workpiece from the cutting jig;
Moving the workpiece to a target position corresponding to the shift amount by relatively moving the transport mechanism and the cutting jig based on the shift amount;
The transport mechanism comprises a step of placing the workpiece again on the cutting jig,
In the moving step, the position of the plurality of cutting grooves and the position of the plurality of cutting lines are aligned by moving the object to be cut to the target position,
In the cutting step, the cutting object placed again is cut.

The cutting method according to claim 7, wherein
In the cutting step, at least a part of the means contributing to the cutting included in the cutting mechanism or at least a part of the means contributing to the cutting supplied from the cutting mechanism is cut out of the plurality of cutting lines. A cutting method characterized by passing through the cutting groove corresponding to the cut line.

The cutting method according to claim 8, wherein
In the step of moving the object to be cut, the transport mechanism and the cutting jig are moved relatively to each other along at least one of the X direction, the Y direction, and the θ direction. A cutting method, wherein the object to be cut is moved to a target position.

In the cutting method according to any one of claims 7 to 9,
The specific first mark including at least two of the plurality of first marks is set along a first direction and a second direction orthogonal to the first direction in plan view. Process,
Along the first direction and the second direction in plan view, that each of the plurality of second mark and a step of setting the specific second mark of at least two Cutting method characterized.

In the cutting method according to any one of claims 7 to 9,
The cutting method, wherein the object to be cut is a sealed substrate or a divided sealed substrate.

In the cutting method according to any one of claims 7 to 9,
The object to be cut is a substrate in which functional elements are formed or divided substrates, resin molded products or divided resin molded products, or glass plates or divided in a plurality of regions respectively corresponding to the plurality of products. A cutting method characterized by being a glass plate .