JP2016139505A - 監視装置、イオン注入装置、及び監視方法 - Google Patents
監視装置、イオン注入装置、及び監視方法 Download PDFInfo
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- JP2016139505A JP2016139505A JP2015013460A JP2015013460A JP2016139505A JP 2016139505 A JP2016139505 A JP 2016139505A JP 2015013460 A JP2015013460 A JP 2015013460A JP 2015013460 A JP2015013460 A JP 2015013460A JP 2016139505 A JP2016139505 A JP 2016139505A
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- frequency component
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/304—Controlling tubes by information coming from the objects or from the beam, e.g. correction signals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/244—Detectors; Associated components or circuits therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/317—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation
- H01J37/3171—Electron-beam or ion-beam tubes for localised treatment of objects for changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation for ion implantation
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R19/00—Arrangements for measuring currents or voltages or for indicating presence or sign thereof
- G01R19/0046—Arrangements for measuring currents or voltages or for indicating presence or sign thereof characterised by a specific application or detail not covered by any other subgroup of G01R19/00
- G01R19/0061—Measuring currents of particle-beams, currents from electron multipliers, photocurrents, ion currents; Measuring in plasmas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/244—Detection characterized by the detecting means
- H01J2237/24495—Signal processing, e.g. mixing of two or more signals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/304—Controlling tubes
- H01J2237/30472—Controlling the beam
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31701—Ion implantation
- H01J2237/31703—Dosimetry
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- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
Abstract
Description
12 生成照射部
20 ファラデーカップ
30 監視装置
38 フィルタ回路
40 A/D変換回路
50 表示部
52 算出部
54 制御部
Claims (6)
- イオン注入装置の検知出力部より入力されるビーム電流の高周波成分及び低周波成分のうちの少なくとも一方を抽出して出力するフィルタ部と、
前記ビーム電流の前記高周波成分の含有率に相当する値、及び前記ビーム電流の前記低周波成分の含有率に相当する値の少なくとも一方を算出する算出部と、
を含む監視装置。 - 前記フィルタ部は、前記高周波成分及び前記低周波成分をアナログ信号で出力し、
前記アナログ信号をデジタル信号に変換するA/D変換部を更に含み、
前記算出部は、前記デジタル信号を用いて前記値を算出し、算出した前記値を表示部に表示させる請求項1に記載の監視装置。 - 前記算出部により算出された前記値が閾値を超えた場合に、前記イオンビームが抑制されるように前記イオン注入装置を制御する制御部を更に含む請求項1又は請求項2に記載の監視装置。
- 請求項1から請求項3の何れか1項に記載の監視装置と、
イオンビームを生成して照射する生成照射部と、
前記生成照射部により照射されたイオンビームによるビーム電流を検知して前記監視装置に出力する検知出力部と、
を含むイオン注入装置。 - バッチ式の処理を行う請求項4に記載のイオン注入装置。
- イオン注入装置の検知出力部より入力されるビーム電流の高周波成分及び低周波成分のうちの少なくとも一方を抽出して出力し、
前記ビーム電流の前記高周波成分の含有率に相当する値、及び前記ビーム電流の前記低周波成分の含有率に相当する値の少なくとも一方を算出することを含む監視方法。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015013460A JP6517520B2 (ja) | 2015-01-27 | 2015-01-27 | 監視装置、イオン注入装置、及び監視方法 |
US15/003,311 US9741534B2 (en) | 2015-01-27 | 2016-01-21 | Monitoring device, ion implantation device, and monitoring method |
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JP2015013460A JP6517520B2 (ja) | 2015-01-27 | 2015-01-27 | 監視装置、イオン注入装置、及び監視方法 |
Publications (2)
Publication Number | Publication Date |
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JP2016139505A true JP2016139505A (ja) | 2016-08-04 |
JP6517520B2 JP6517520B2 (ja) | 2019-05-22 |
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JP2015013460A Active JP6517520B2 (ja) | 2015-01-27 | 2015-01-27 | 監視装置、イオン注入装置、及び監視方法 |
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US (1) | US9741534B2 (ja) |
JP (1) | JP6517520B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024004311A1 (ja) * | 2022-06-28 | 2024-01-04 | 株式会社日立ハイテク | 測定装置および質量分析装置 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP4172636A2 (en) * | 2020-08-26 | 2023-05-03 | TAE Technologies, Inc. | Systems, devices, and methods for beam misalignment detection |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5981961A (en) * | 1996-03-15 | 1999-11-09 | Applied Materials, Inc. | Apparatus and method for improved scanning efficiency in an ion implanter |
JP2000306540A (ja) * | 1999-04-16 | 2000-11-02 | Nippon Steel Corp | イオン注入装置におけるビーム電流測定装置 |
US20040256573A1 (en) * | 2003-05-09 | 2004-12-23 | Varian Semiconductor Equipment Associates, Inc. | Methods and systems for optimizing ion implantation uniformity control |
JP2011060935A (ja) * | 2009-09-09 | 2011-03-24 | Fujitsu Semiconductor Ltd | 半導体装置の製造方法 |
WO2014179672A1 (en) * | 2013-05-03 | 2014-11-06 | Varian Semiconductor Equipment Associates, Inc. | Apparatus and techniques for controlling ion implantation uniformity |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0757671A (ja) | 1993-08-12 | 1995-03-03 | Nissin Electric Co Ltd | ビーム電流測定装置 |
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2015
- 2015-01-27 JP JP2015013460A patent/JP6517520B2/ja active Active
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2016
- 2016-01-21 US US15/003,311 patent/US9741534B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5981961A (en) * | 1996-03-15 | 1999-11-09 | Applied Materials, Inc. | Apparatus and method for improved scanning efficiency in an ion implanter |
JP2000306540A (ja) * | 1999-04-16 | 2000-11-02 | Nippon Steel Corp | イオン注入装置におけるビーム電流測定装置 |
US20040256573A1 (en) * | 2003-05-09 | 2004-12-23 | Varian Semiconductor Equipment Associates, Inc. | Methods and systems for optimizing ion implantation uniformity control |
JP2011060935A (ja) * | 2009-09-09 | 2011-03-24 | Fujitsu Semiconductor Ltd | 半導体装置の製造方法 |
WO2014179672A1 (en) * | 2013-05-03 | 2014-11-06 | Varian Semiconductor Equipment Associates, Inc. | Apparatus and techniques for controlling ion implantation uniformity |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2024004311A1 (ja) * | 2022-06-28 | 2024-01-04 | 株式会社日立ハイテク | 測定装置および質量分析装置 |
Also Published As
Publication number | Publication date |
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US20160217973A1 (en) | 2016-07-28 |
JP6517520B2 (ja) | 2019-05-22 |
US9741534B2 (en) | 2017-08-22 |
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