JP2016127116A5 - - Google Patents

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Publication number
JP2016127116A5
JP2016127116A5 JP2014266140A JP2014266140A JP2016127116A5 JP 2016127116 A5 JP2016127116 A5 JP 2016127116A5 JP 2014266140 A JP2014266140 A JP 2014266140A JP 2014266140 A JP2014266140 A JP 2014266140A JP 2016127116 A5 JP2016127116 A5 JP 2016127116A5
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JP
Japan
Prior art keywords
adhesive sheet
ring frame
pressure
semiconductor chips
adhesive layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2014266140A
Other languages
English (en)
Japanese (ja)
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JP6482866B2 (ja
JP2016127116A (ja
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Priority to JP2014266140A priority Critical patent/JP6482866B2/ja
Priority claimed from JP2014266140A external-priority patent/JP6482866B2/ja
Priority to TW104143856A priority patent/TWI695421B/zh
Publication of JP2016127116A publication Critical patent/JP2016127116A/ja
Publication of JP2016127116A5 publication Critical patent/JP2016127116A5/ja
Application granted granted Critical
Publication of JP6482866B2 publication Critical patent/JP6482866B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014266140A 2014-12-26 2014-12-26 半導体装置の製造方法 Active JP6482866B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014266140A JP6482866B2 (ja) 2014-12-26 2014-12-26 半導体装置の製造方法
TW104143856A TWI695421B (zh) 2014-12-26 2015-12-25 半導體裝置之製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014266140A JP6482866B2 (ja) 2014-12-26 2014-12-26 半導体装置の製造方法

Publications (3)

Publication Number Publication Date
JP2016127116A JP2016127116A (ja) 2016-07-11
JP2016127116A5 true JP2016127116A5 (cs) 2017-11-24
JP6482866B2 JP6482866B2 (ja) 2019-03-13

Family

ID=56359712

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014266140A Active JP6482866B2 (ja) 2014-12-26 2014-12-26 半導体装置の製造方法

Country Status (2)

Country Link
JP (1) JP6482866B2 (cs)
TW (1) TWI695421B (cs)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110800091A (zh) * 2017-08-04 2020-02-14 琳得科株式会社 半导体装置的制造方法
JP7093630B2 (ja) * 2017-12-27 2022-06-30 リンテック株式会社 離間装置および離間方法
CN111886673B (zh) * 2018-03-07 2025-02-11 琳得科株式会社 扩片方法、半导体装置的制造方法、以及粘合片
JP7250468B6 (ja) * 2018-10-12 2023-04-25 三井化学株式会社 電子装置の製造方法および粘着性フィルム
JP7334063B2 (ja) * 2019-05-24 2023-08-28 株式会社ディスコ モールドチップの製造方法
JP2021034398A (ja) * 2019-08-14 2021-03-01 株式会社ジャパンディスプレイ 素子移載装置、素子移載方法
KR102351045B1 (ko) * 2019-12-19 2022-01-14 한국기계연구원 마이크로 소자의 간격 조절 전사방법

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005243910A (ja) * 2004-02-26 2005-09-08 Lintec Corp 半導体チップの製造方法
JP2006203079A (ja) * 2005-01-21 2006-08-03 Sharp Corp 半導体装置および半導体装置の製造方法
JP5518502B2 (ja) * 2009-01-27 2014-06-11 シチズン電子株式会社 発光ダイオードの製造方法
WO2014002535A1 (ja) * 2012-06-29 2014-01-03 シャープ株式会社 半導体装置の製造方法

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