JP2016123999A - 急加熱工法用フラックス及び急加熱工法用ソルダペースト - Google Patents
急加熱工法用フラックス及び急加熱工法用ソルダペースト Download PDFInfo
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- JP2016123999A JP2016123999A JP2014265959A JP2014265959A JP2016123999A JP 2016123999 A JP2016123999 A JP 2016123999A JP 2014265959 A JP2014265959 A JP 2014265959A JP 2014265959 A JP2014265959 A JP 2014265959A JP 2016123999 A JP2016123999 A JP 2016123999A
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- solvent
- flux
- rapid heating
- boiling point
- heating method
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Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 95
- 230000004907 flux Effects 0.000 title claims abstract description 41
- 238000010438 heat treatment Methods 0.000 title claims abstract description 35
- 238000000034 method Methods 0.000 title claims abstract description 25
- 239000002904 solvent Substances 0.000 claims abstract description 81
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 55
- 239000000956 alloy Substances 0.000 claims abstract description 55
- 238000009835 boiling Methods 0.000 claims abstract description 52
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 claims abstract description 12
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 claims abstract description 12
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 claims abstract description 12
- 150000007524 organic acids Chemical class 0.000 claims abstract description 11
- 239000013008 thixotropic agent Substances 0.000 claims abstract description 8
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 claims abstract description 6
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 claims description 3
- GCYHRYNSUGLLMA-UHFFFAOYSA-N 2-prop-2-enoxyethanol Chemical compound OCCOCC=C GCYHRYNSUGLLMA-UHFFFAOYSA-N 0.000 claims description 3
- HCGFUIQPSOCUHI-UHFFFAOYSA-N 2-propan-2-yloxyethanol Chemical compound CC(C)OCCO HCGFUIQPSOCUHI-UHFFFAOYSA-N 0.000 claims description 3
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical group COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 claims description 3
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 claims description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 3
- 125000003827 glycol group Chemical group 0.000 claims description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000843 powder Substances 0.000 abstract description 8
- 239000004210 ether based solvent Substances 0.000 abstract 1
- 238000002844 melting Methods 0.000 description 13
- 230000008018 melting Effects 0.000 description 13
- 239000000203 mixture Substances 0.000 description 13
- 238000005476 soldering Methods 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 239000012190 activator Substances 0.000 description 4
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 235000014113 dietary fatty acids Nutrition 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000194 fatty acid Substances 0.000 description 2
- 229930195729 fatty acid Natural products 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 235000005985 organic acids Nutrition 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- ZUHZGEOKBKGPSW-UHFFFAOYSA-N tetraglyme Chemical compound COCCOCCOCCOCCOC ZUHZGEOKBKGPSW-UHFFFAOYSA-N 0.000 description 2
- SNAQINZKMQFYFV-UHFFFAOYSA-N 1-[2-[2-(2-methoxyethoxy)ethoxy]ethoxy]butane Chemical compound CCCCOCCOCCOCCOC SNAQINZKMQFYFV-UHFFFAOYSA-N 0.000 description 1
- OHJYHAOODFPJOD-UHFFFAOYSA-N 2-(2-ethylhexoxy)ethanol Chemical compound CCCCC(CC)COCCO OHJYHAOODFPJOD-UHFFFAOYSA-N 0.000 description 1
- GZMAAYIALGURDQ-UHFFFAOYSA-N 2-(2-hexoxyethoxy)ethanol Chemical compound CCCCCCOCCOCCO GZMAAYIALGURDQ-UHFFFAOYSA-N 0.000 description 1
- OADIZUFHUPTFAG-UHFFFAOYSA-N 2-[2-(2-ethylhexoxy)ethoxy]ethanol Chemical compound CCCCC(CC)COCCOCCO OADIZUFHUPTFAG-UHFFFAOYSA-N 0.000 description 1
- UPGSWASWQBLSKZ-UHFFFAOYSA-N 2-hexoxyethanol Chemical compound CCCCCCOCCO UPGSWASWQBLSKZ-UHFFFAOYSA-N 0.000 description 1
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- -1 fatty acid esters Chemical class 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
【解決手段】ロジンと、グリコールエーテル系の溶剤と、有機酸と、チキソ剤を含み、溶剤は、沸点が200℃以下のグリコール系の低沸点溶剤で、低沸点溶剤の含有量を20重量%以上40重量%以下とした急加熱工法用フラックス、及び、このフラックスとはんだ合金の粉末とを混合した急加熱工法用ソルダペーストである。沸点が200℃を超える高沸点溶剤を更に含有する場合、溶剤全体のうち、低沸点溶剤の含有量を60重量%以上とする。
【選択図】無し
Description
本実施の形態のフラックスは、ロジンと、グリコールエーテル系の溶剤と、有機酸と、チキソ剤を含む。本実施の形態のフラックスは、はんだ合金の粉末と混合されてソルダペーストが生成される。
試験装置 :JAPAN UNIX(登録商標) ULD−730
レーザ照射径:0.8mm
パッドサイズ:0.8×0.8mm 材質:Cu
照射条件:照射出力を1W/secの割合で1.5Wまで出力を上げ、照射開始から3秒後に停止。
ソルダペーストを0.1mm厚のマスクで印刷供給した。
測定回数はN=4で、測定値の平均で判定した。
(b)判定基準
◎:はんだボールの数が0〜5個
○:はんだボールの数が6〜10個
×:はんだボールの数が11個以上
Claims (3)
- ロジンと、グリコールエーテル系の溶剤と、有機酸と、チキソ剤を含み、
前記溶剤は、沸点が200℃以下のグリコール系の低沸点溶剤で、前記低沸点溶剤の含有量を20重量%以上40重量%以下とし、前記低沸点溶剤を、溶剤全体のうち、60重量%以上含有する
ことを特徴とする急加熱工法用フラックス。 - 前記低沸点溶剤は、ジプロピレングリコールモノメチルエーテル、プロピレングリコールモノブチルエーテル、ジエチレングリコールジメチルエーテル、エチレングリコールモノアリルエーテル、エチレングリコールモノイソプロピルエーテルである
ことを特徴とする請求項1に記載の急加熱工法用フラックス。 - はんだ合金と、請求項1または2に記載のフラックスが混合された
ことを特徴とする急加熱工法用ソルダペースト。
Priority Applications (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014265959A JP6160608B2 (ja) | 2014-12-26 | 2014-12-26 | 急加熱工法用フラックス及び急加熱工法用ソルダペースト |
US15/539,301 US20170355042A1 (en) | 2014-12-26 | 2015-12-21 | Flux for Rapid Heating Method and Solder Paste for Rapid Heating Method |
PCT/JP2015/085730 WO2016104458A1 (ja) | 2014-12-26 | 2015-12-21 | 急加熱工法用フラックス及び急加熱工法用ソルダペースト |
EP15873026.7A EP3238872A4 (en) | 2014-12-26 | 2015-12-21 | Flux for fast-heating method, and solder paste for fast-heating method |
CN201580071189.6A CN107107277B (zh) | 2014-12-26 | 2015-12-21 | 急加热方法用助焊剂及急加热方法用焊膏 |
KR1020177020529A KR20170097764A (ko) | 2014-12-26 | 2015-12-21 | 급가열 공법용 플럭스 및 급가열 공법용 솔더 페이스트 |
TW104143517A TWI661890B (zh) | 2014-12-26 | 2015-12-24 | 急加熱工法用助焊劑及急加熱工法用軟焊膏 |
PH12017501161A PH12017501161A1 (en) | 2014-12-26 | 2017-06-20 | Flux for fast-heating method, and solder paste for fast-heating method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014265959A JP6160608B2 (ja) | 2014-12-26 | 2014-12-26 | 急加熱工法用フラックス及び急加熱工法用ソルダペースト |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016123999A true JP2016123999A (ja) | 2016-07-11 |
JP2016123999A5 JP2016123999A5 (ja) | 2017-06-01 |
JP6160608B2 JP6160608B2 (ja) | 2017-07-12 |
Family
ID=56150476
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014265959A Active JP6160608B2 (ja) | 2014-12-26 | 2014-12-26 | 急加熱工法用フラックス及び急加熱工法用ソルダペースト |
Country Status (8)
Country | Link |
---|---|
US (1) | US20170355042A1 (ja) |
EP (1) | EP3238872A4 (ja) |
JP (1) | JP6160608B2 (ja) |
KR (1) | KR20170097764A (ja) |
CN (1) | CN107107277B (ja) |
PH (1) | PH12017501161A1 (ja) |
TW (1) | TWI661890B (ja) |
WO (1) | WO2016104458A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107442970A (zh) * | 2017-08-10 | 2017-12-08 | 东北大学 | 低温焊膏用免清洗助焊剂及其制备方法 |
JP2018161674A (ja) * | 2017-03-27 | 2018-10-18 | 株式会社タムラ製作所 | はんだ組成物および電子基板 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6338007B1 (ja) * | 2017-11-02 | 2018-06-06 | 千住金属工業株式会社 | フラックス及びソルダペースト |
JP7111957B2 (ja) * | 2018-06-14 | 2022-08-03 | 日亜化学工業株式会社 | 半導体装置及びその製造方法 |
CN108655606B (zh) * | 2018-08-02 | 2021-03-02 | 烟台艾邦电子材料有限公司 | 一种低熔点smt焊锡膏的配方及其制备方法 |
CN114340836A (zh) * | 2019-09-06 | 2022-04-12 | 汉高股份有限及两合公司 | 焊料合金及包含所述合金的焊膏 |
JP6993594B2 (ja) * | 2020-03-27 | 2022-02-04 | 千住金属工業株式会社 | フラックス及びソルダペースト |
CN116981541A (zh) * | 2021-03-12 | 2023-10-31 | 千住金属工业株式会社 | 助焊剂和电子设备的制造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01148488A (ja) * | 1987-12-02 | 1989-06-09 | Senju Metal Ind Co Ltd | クリームはんだ |
JPH0592296A (ja) * | 1991-04-17 | 1993-04-16 | Yuho Chem Kk | フラツクス又ははんだペースト用腐食防止剤 |
JPH07290277A (ja) * | 1994-04-25 | 1995-11-07 | Nippon Genma:Kk | フラックス |
JPH08332592A (ja) * | 1995-06-05 | 1996-12-17 | Nippon Genma:Kk | はんだボールの少ないクリームはんだ |
US6217671B1 (en) * | 1999-12-14 | 2001-04-17 | International Business Machines Corporation | Composition for increasing activity of a no-clean flux |
JP2009542019A (ja) * | 2006-06-30 | 2009-11-26 | ユミコア・アクチエンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト | 半導体素子の適用ための無洗浄低残留物ハンダペースト |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3423930B2 (ja) * | 1999-12-27 | 2003-07-07 | 富士通株式会社 | バンプ形成方法、電子部品、および半田ペースト |
JP6088204B2 (ja) * | 2012-10-29 | 2017-03-01 | 株式会社タムラ製作所 | はんだ組成物 |
-
2014
- 2014-12-26 JP JP2014265959A patent/JP6160608B2/ja active Active
-
2015
- 2015-12-21 US US15/539,301 patent/US20170355042A1/en not_active Abandoned
- 2015-12-21 CN CN201580071189.6A patent/CN107107277B/zh active Active
- 2015-12-21 WO PCT/JP2015/085730 patent/WO2016104458A1/ja active Application Filing
- 2015-12-21 EP EP15873026.7A patent/EP3238872A4/en not_active Withdrawn
- 2015-12-21 KR KR1020177020529A patent/KR20170097764A/ko unknown
- 2015-12-24 TW TW104143517A patent/TWI661890B/zh active
-
2017
- 2017-06-20 PH PH12017501161A patent/PH12017501161A1/en unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01148488A (ja) * | 1987-12-02 | 1989-06-09 | Senju Metal Ind Co Ltd | クリームはんだ |
JPH0592296A (ja) * | 1991-04-17 | 1993-04-16 | Yuho Chem Kk | フラツクス又ははんだペースト用腐食防止剤 |
JPH07290277A (ja) * | 1994-04-25 | 1995-11-07 | Nippon Genma:Kk | フラックス |
JPH08332592A (ja) * | 1995-06-05 | 1996-12-17 | Nippon Genma:Kk | はんだボールの少ないクリームはんだ |
US6217671B1 (en) * | 1999-12-14 | 2001-04-17 | International Business Machines Corporation | Composition for increasing activity of a no-clean flux |
JP2009542019A (ja) * | 2006-06-30 | 2009-11-26 | ユミコア・アクチエンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト | 半導体素子の適用ための無洗浄低残留物ハンダペースト |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018161674A (ja) * | 2017-03-27 | 2018-10-18 | 株式会社タムラ製作所 | はんだ組成物および電子基板 |
CN107442970A (zh) * | 2017-08-10 | 2017-12-08 | 东北大学 | 低温焊膏用免清洗助焊剂及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
TW201641207A (zh) | 2016-12-01 |
KR20170097764A (ko) | 2017-08-28 |
EP3238872A4 (en) | 2018-07-11 |
EP3238872A1 (en) | 2017-11-01 |
CN107107277B (zh) | 2018-11-02 |
US20170355042A1 (en) | 2017-12-14 |
WO2016104458A1 (ja) | 2016-06-30 |
TWI661890B (zh) | 2019-06-11 |
PH12017501161B1 (en) | 2017-12-11 |
CN107107277A (zh) | 2017-08-29 |
PH12017501161A1 (en) | 2017-12-11 |
JP6160608B2 (ja) | 2017-07-12 |
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