JP2016115882A5 - - Google Patents

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Publication number
JP2016115882A5
JP2016115882A5 JP2014255287A JP2014255287A JP2016115882A5 JP 2016115882 A5 JP2016115882 A5 JP 2016115882A5 JP 2014255287 A JP2014255287 A JP 2014255287A JP 2014255287 A JP2014255287 A JP 2014255287A JP 2016115882 A5 JP2016115882 A5 JP 2016115882A5
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JP2014255287A
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English (en)
Japanese (ja)
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JP2016115882A (ja
JP6356592B2 (ja
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Priority to JP2014255287A priority Critical patent/JP6356592B2/ja
Priority claimed from JP2014255287A external-priority patent/JP6356592B2/ja
Priority to CN201580068085.XA priority patent/CN107004725B/zh
Priority to PCT/JP2015/079479 priority patent/WO2016098438A1/ja
Priority to US15/519,701 priority patent/US9972674B2/en
Publication of JP2016115882A publication Critical patent/JP2016115882A/ja
Publication of JP2016115882A5 publication Critical patent/JP2016115882A5/ja
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Publication of JP6356592B2 publication Critical patent/JP6356592B2/ja
Expired - Fee Related legal-status Critical Current
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JP2014255287A 2014-12-17 2014-12-17 ショットキーバリアダイオードとその製造方法 Expired - Fee Related JP6356592B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014255287A JP6356592B2 (ja) 2014-12-17 2014-12-17 ショットキーバリアダイオードとその製造方法
CN201580068085.XA CN107004725B (zh) 2014-12-17 2015-10-19 肖特基势垒二极管及其制造方法
PCT/JP2015/079479 WO2016098438A1 (ja) 2014-12-17 2015-10-19 ショットキーバリアダイオードとその製造方法
US15/519,701 US9972674B2 (en) 2014-12-17 2015-10-19 Schottky barrier diode and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014255287A JP6356592B2 (ja) 2014-12-17 2014-12-17 ショットキーバリアダイオードとその製造方法

Publications (3)

Publication Number Publication Date
JP2016115882A JP2016115882A (ja) 2016-06-23
JP2016115882A5 true JP2016115882A5 (https=) 2017-02-23
JP6356592B2 JP6356592B2 (ja) 2018-07-11

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ID=56126340

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JP2014255287A Expired - Fee Related JP6356592B2 (ja) 2014-12-17 2014-12-17 ショットキーバリアダイオードとその製造方法

Country Status (4)

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US (1) US9972674B2 (https=)
JP (1) JP6356592B2 (https=)
CN (1) CN107004725B (https=)
WO (1) WO2016098438A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6745458B2 (ja) * 2015-04-15 2020-08-26 パナソニックＩｐマネジメント株式会社 半導体素子
US20180047855A1 (en) * 2015-05-15 2018-02-15 Hitachi, Ltd. Power semiconductor element and power semiconductor module using same
EP3712962B1 (en) * 2019-03-22 2023-06-07 STMicroelectronics S.r.l. Semiconductor mps diode with reduced current-crowding effect and manufacturing method thereof
JP7687171B2 (ja) * 2021-09-28 2025-06-03 株式会社デンソー 半導体装置およびその製造方法
JP7828204B2 (ja) * 2022-03-22 2026-03-11 株式会社東芝 半導体装置
FR3152640A1 (fr) * 2023-08-28 2025-03-07 Stmicroelectronics International N.V. Composant vertical de puissance

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009094433A (ja) 2007-10-12 2009-04-30 National Institute Of Advanced Industrial & Technology 炭化珪素装置
JP2009164237A (ja) * 2007-12-28 2009-07-23 Panasonic Corp ショットキーバリアダイオード
JP5370985B2 (ja) * 2008-09-22 2013-12-18 日本インター株式会社 Ｊｂｓの製造方法
CN102315281B (zh) * 2010-09-07 2013-09-18 成都芯源系统有限公司 肖特基二极管及其制作方法
US8803277B2 (en) * 2011-02-10 2014-08-12 Cree, Inc. Junction termination structures including guard ring extensions and methods of fabricating electronic devices incorporating same
JP5999748B2 (ja) * 2011-08-12 2016-09-28 ルネサスエレクトロニクス株式会社 パワーｍｏｓｆｅｔ、ｉｇｂｔおよびパワーダイオード
JP5685237B2 (ja) 2012-11-09 2015-03-18 住友ゴム工業株式会社 空気入りタイヤ
JP6112600B2 (ja) 2012-12-10 2017-04-12 ローム株式会社 半導体装置および半導体装置の製造方法
CN104969360B (zh) * 2013-03-25 2018-04-20 富士电机株式会社 半导体装置
US9324645B2 (en) * 2013-05-23 2016-04-26 Avogy, Inc. Method and system for co-packaging vertical gallium nitride power devices
CN103346083B (zh) * 2013-07-09 2016-10-05 苏州捷芯威半导体有限公司 氮化镓肖特基二极管及其制造方法
CN103545382A (zh) * 2013-11-12 2014-01-29 株洲南车时代电气股份有限公司 一种结势垒肖特基二极管及其制作方法

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