JP2016113665A - はんだ合金、ソルダペーストおよび電子回路基板 - Google Patents
はんだ合金、ソルダペーストおよび電子回路基板 Download PDFInfo
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- JP2016113665A JP2016113665A JP2014253280A JP2014253280A JP2016113665A JP 2016113665 A JP2016113665 A JP 2016113665A JP 2014253280 A JP2014253280 A JP 2014253280A JP 2014253280 A JP2014253280 A JP 2014253280A JP 2016113665 A JP2016113665 A JP 2016113665A
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 123
- 229910045601 alloy Inorganic materials 0.000 title claims abstract description 84
- 239000000956 alloy Substances 0.000 title claims abstract description 84
- 239000010949 copper Substances 0.000 claims abstract description 24
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 23
- 229910052797 bismuth Inorganic materials 0.000 claims abstract description 23
- 229910052802 copper Inorganic materials 0.000 claims abstract description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 18
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims abstract description 18
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 18
- 239000010941 cobalt Substances 0.000 claims abstract description 18
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229910052709 silver Inorganic materials 0.000 claims abstract description 17
- 239000004332 silver Substances 0.000 claims abstract description 16
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 15
- 239000011135 tin Substances 0.000 claims abstract description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052718 tin Inorganic materials 0.000 claims abstract description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 19
- 230000004907 flux Effects 0.000 claims description 13
- 238000005476 soldering Methods 0.000 claims description 12
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- 229910052733 gallium Inorganic materials 0.000 claims description 8
- 229910052732 germanium Inorganic materials 0.000 claims description 8
- 229910052738 indium Inorganic materials 0.000 claims description 8
- 229910052698 phosphorus Inorganic materials 0.000 claims description 8
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 6
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 6
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 6
- 239000011574 phosphorus Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 description 27
- 238000009472 formulation Methods 0.000 description 26
- 230000000052 comparative effect Effects 0.000 description 15
- 230000003247 decreasing effect Effects 0.000 description 13
- 238000002156 mixing Methods 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000011156 evaluation Methods 0.000 description 5
- 238000002844 melting Methods 0.000 description 5
- 230000008018 melting Effects 0.000 description 5
- 239000012535 impurity Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229910001152 Bi alloy Inorganic materials 0.000 description 3
- PQIJHIWFHSVPMH-UHFFFAOYSA-N [Cu].[Ag].[Sn] Chemical compound [Cu].[Ag].[Sn] PQIJHIWFHSVPMH-UHFFFAOYSA-N 0.000 description 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 description 3
- 229910000969 tin-silver-copper Inorganic materials 0.000 description 3
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- QLTBJHSQPNVBLW-UHFFFAOYSA-N [Bi].[In].[Ag].[Sn] Chemical compound [Bi].[In].[Ag].[Sn] QLTBJHSQPNVBLW-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical compound CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 235000013871 bee wax Nutrition 0.000 description 1
- 239000012166 beeswax Substances 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 235000015165 citric acid Nutrition 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000004310 lactic acid Substances 0.000 description 1
- 235000014655 lactic acid Nutrition 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- GZCWPZJOEIAXRU-UHFFFAOYSA-N tin zinc Chemical compound [Zn].[Sn] GZCWPZJOEIAXRU-UHFFFAOYSA-N 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/3006—Ag as the principal constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/06—Making non-ferrous alloys with the use of special agents for refining or deoxidising
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Abstract
Description
・はんだ合金の調製
表1〜2に記載の各金属の粉末を、表1〜2に記載の配合割合でそれぞれ混合し、得られた金属混合物を溶解炉にて溶解および均一化させて、はんだ合金を調製した。
得られたはんだ合金を、粒径が25〜38μmとなるように粉末化し、得られたはんだ合金の粉末と、公知のフラックスとを混合して、ソルダペーストを得た。
得られたソルダペーストをチップ部品搭載用のプリント基板に印刷して、リフロー法によりチップ部品を実装した。実装時のソルダペーストの印刷条件、チップ部品のサイズ等については、後述する各評価に応じて適宜設定した。
各実施例および各比較例において得られた合金を使用したソルダペーストを、チップ部品搭載用プリント基板に印刷して、リフロー法によりチップ部品を実装した。ソルダペーストの印刷膜厚は、厚さ150μmのメタルマスクを用いて調整した。ソルダペーストの印刷後、アルミニウム電解コンデンサ(5mmφ、5.8mm高さ)を上記プリント基板の所定位置に搭載して、リフロー炉で加熱し、チップ部品を実装した。リフロー条件は、プリヒートを170〜190℃、ピーク温度を245℃、220℃以上である時間が45秒間、ピーク温度から200℃までの降温時の冷却速度を3〜8℃/秒に設定した。
<落下衝撃性>
部品実装直後のプリント基板について、1mの高さから5回落下させ、部品と基板の接合部が破壊するかどうかを外観観察することにより評価した。
<総合評価>
「落下衝撃性」および「冷熱サイクル後の落下衝撃性」の合計点が10点のものを総合判定A++、合計点が8点または9点のものを総合判定A+、合計点が6点または7点のものを総合判定A、合計点が4点または5点のものを総合判定B、合計点が2点または3点のものを総合判定C、合計点が0点または1点のものを総合判定Dとした。
Claims (8)
- 実質的に、スズ、銀、銅、ビスマス、アンチモンおよびコバルトからなるはんだ合金であって、
前記はんだ合金の総量に対して、
前記銀の含有割合が、2質量%以上4質量%以下であり、
前記銅の含有割合が、0.3質量%以上1質量%以下であり、
前記ビスマスの含有割合が、4.8質量%を超過し10質量%以下であり、
前記アンチモンの含有割合が、3質量%以上10質量%以下であり、
前記コバルトの含有割合が、0.001質量%以上0.3質量%以下であり、
前記スズの含有割合が、残余の割合であることを特徴とする、はんだ合金。 - さらに、ニッケル、インジウム、ガリウム、ゲルマニウムおよびリンからなる群より選
ばれた少なくとも1種の元素を含有し、
はんだ合金の総量に対して、前記元素の含有割合が、0質量%超過し1質量%以下である、請求項1に記載のはんだ合金。 - 前記銅の含有割合が、0.5質量%以上0.7質量%以下である、請求項1または2に記載のはんだ合金。
- 前記ビスマスの含有割合が、4.8質量%を超過し7質量%以下である、請求項1〜3のいずれか一項に記載のはんだ合金。
- 前記アンチモンの含有割合が、5質量%以上7質量%以下である、請求項1〜4のいずれか一項に記載のはんだ合金。
- 前記コバルトの含有割合が、0.003質量%以上0.01質量%以下である、請求項1〜5のいずれか一項に記載のはんだ合金。
- 請求項1〜6のいずれか一項に記載のはんだ合金からなるはんだ粉末と、
フラックスとを
含有することを特徴とする、ソルダペースト。 - 請求項7記載のソルダペーストのはんだ付によるはんだ付け部を備えることを特徴とする、
電子回路基板。
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014253280A JP5723056B1 (ja) | 2014-12-15 | 2014-12-15 | はんだ合金、ソルダペーストおよび電子回路基板 |
EP15869567.6A EP3235587B1 (en) | 2014-12-15 | 2015-02-24 | Solder alloy, solder paste and electronic circuit board |
ES15869567T ES2776440T3 (es) | 2014-12-15 | 2015-02-24 | Aleación de soldadura, pasta de soldadura y placa de circuito electrónico |
CN201580066412.8A CN107000130A (zh) | 2014-12-15 | 2015-02-24 | 焊料合金、钎焊膏以及电路基板 |
KR1020177015754A KR20170094198A (ko) | 2014-12-15 | 2015-02-24 | 땜납 합금, 솔더 페이스트 및 전자 회로 기판 |
CA2969633A CA2969633C (en) | 2014-12-15 | 2015-02-24 | Solder alloy, solder paste, and electronic circuit board |
US15/535,895 US20170355043A1 (en) | 2014-12-15 | 2015-02-24 | Solder alloy, solder paste and electronic circuit board |
MYPI2017000884A MY164343A (en) | 2014-12-15 | 2015-02-24 | Solder alloy, solder paste, and electronic circuit board |
PCT/JP2015/055203 WO2016098358A1 (ja) | 2014-12-15 | 2015-02-24 | はんだ合金、ソルダペーストおよび電子回路基板 |
TW104141715A TWI655989B (zh) | 2014-12-15 | 2015-12-11 | Solder alloy, solder paste and electronic circuit substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014253280A JP5723056B1 (ja) | 2014-12-15 | 2014-12-15 | はんだ合金、ソルダペーストおよび電子回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP5723056B1 JP5723056B1 (ja) | 2015-05-27 |
JP2016113665A true JP2016113665A (ja) | 2016-06-23 |
Family
ID=53277933
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2014253280A Active JP5723056B1 (ja) | 2014-12-15 | 2014-12-15 | はんだ合金、ソルダペーストおよび電子回路基板 |
Country Status (10)
Country | Link |
---|---|
US (1) | US20170355043A1 (ja) |
EP (1) | EP3235587B1 (ja) |
JP (1) | JP5723056B1 (ja) |
KR (1) | KR20170094198A (ja) |
CN (1) | CN107000130A (ja) |
CA (1) | CA2969633C (ja) |
ES (1) | ES2776440T3 (ja) |
MY (1) | MY164343A (ja) |
TW (1) | TWI655989B (ja) |
WO (1) | WO2016098358A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020157349A (ja) * | 2019-03-27 | 2020-10-01 | 千住金属工業株式会社 | はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手 |
US11577344B2 (en) | 2020-07-31 | 2023-02-14 | Senju Metal Industry Co., Ltd. | Solder alloy |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6053248B1 (ja) * | 2015-07-24 | 2016-12-27 | ハリマ化成株式会社 | はんだ合金、ソルダペーストおよび電子回路基板 |
ES2830150T3 (es) * | 2015-07-24 | 2021-06-03 | Harima Chemicals Inc | Aleación de soldadura, pasta de soldadura y placa de circuito electrónico |
WO2017164194A1 (ja) | 2016-03-22 | 2017-09-28 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、フラックス組成物、ソルダペースト組成物、電子回路基板および電子制御装置 |
EP3449023B1 (en) * | 2016-05-06 | 2022-04-20 | Alpha Assembly Solutions Inc. | High reliability lead-free solder alloy |
US20180102464A1 (en) | 2016-10-06 | 2018-04-12 | Alpha Assembly Solutions Inc. | Advanced Solder Alloys For Electronic Interconnects |
BR112019020490B1 (pt) * | 2017-03-31 | 2023-03-28 | Senju Metal Industry Co., Ltd | Liga de solda, pasta de solda e junta de solda |
KR102286739B1 (ko) * | 2017-08-17 | 2021-08-05 | 현대자동차 주식회사 | 무연 솔더 조성물 |
US11577343B2 (en) * | 2017-11-09 | 2023-02-14 | Alpha Assembly Solutions Inc. | Low-silver alternative to standard SAC alloys for high reliability applications |
US11732330B2 (en) | 2017-11-09 | 2023-08-22 | Alpha Assembly Solutions, Inc. | High reliability lead-free solder alloy for electronic applications in extreme environments |
KR20240042569A (ko) * | 2018-10-24 | 2024-04-02 | 알파 어셈블리 솔루션스 인크. | 중합체 기재, 인쇄 회로 기판 및 기타 접합 응용을 위한 저온 납땜 해법 |
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KR101551613B1 (ko) * | 2014-06-24 | 2015-09-08 | 하리마카세이 가부시기가이샤 | 땜납 합금, 땜납 조성물, 솔더 페이스트 및 전자 회로 기판 |
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- 2015-02-24 CN CN201580066412.8A patent/CN107000130A/zh active Pending
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Cited By (3)
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JP2020157349A (ja) * | 2019-03-27 | 2020-10-01 | 千住金属工業株式会社 | はんだ合金、はんだボール、はんだプリフォーム、はんだペースト及びはんだ継手 |
US11167379B2 (en) | 2019-03-27 | 2021-11-09 | Senju Metal Industry Co., Ltd. | Solder alloy, solder ball, solder preform, solder paste and solder joint |
US11577344B2 (en) | 2020-07-31 | 2023-02-14 | Senju Metal Industry Co., Ltd. | Solder alloy |
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ES2776440T3 (es) | 2020-07-30 |
WO2016098358A1 (ja) | 2016-06-23 |
CA2969633A1 (en) | 2016-06-23 |
TWI655989B (zh) | 2019-04-11 |
EP3235587A1 (en) | 2017-10-25 |
MY164343A (en) | 2017-12-15 |
EP3235587B1 (en) | 2020-01-01 |
KR20170094198A (ko) | 2017-08-17 |
CN107000130A (zh) | 2017-08-01 |
JP5723056B1 (ja) | 2015-05-27 |
EP3235587A4 (en) | 2018-05-02 |
US20170355043A1 (en) | 2017-12-14 |
TW201632289A (zh) | 2016-09-16 |
CA2969633C (en) | 2022-04-05 |
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