JP2016111249A5 - - Google Patents
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- Publication number
- JP2016111249A5 JP2016111249A5 JP2014248663A JP2014248663A JP2016111249A5 JP 2016111249 A5 JP2016111249 A5 JP 2016111249A5 JP 2014248663 A JP2014248663 A JP 2014248663A JP 2014248663 A JP2014248663 A JP 2014248663A JP 2016111249 A5 JP2016111249 A5 JP 2016111249A5
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- heat
- electronic
- casing
- electronic unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009434 installation Methods 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 4
- 238000004382 potting Methods 0.000 claims description 4
- 238000005192 partition Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims description 2
- 229920001187 thermosetting polymer Polymers 0.000 claims description 2
- 210000000078 claw Anatomy 0.000 claims 2
- 238000000465 moulding Methods 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014248663A JP6328044B2 (ja) | 2014-12-09 | 2014-12-09 | 電子ユニット |
| US15/534,825 US9943010B2 (en) | 2014-12-09 | 2015-09-04 | Electronic unit |
| CN201580066300.2A CN107432090B (zh) | 2014-12-09 | 2015-09-04 | 电子设备 |
| EP15867496.0A EP3232748A1 (en) | 2014-12-09 | 2015-09-04 | Electronic unit |
| PCT/JP2015/075196 WO2016092919A1 (ja) | 2014-12-09 | 2015-09-04 | 電子ユニット |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014248663A JP6328044B2 (ja) | 2014-12-09 | 2014-12-09 | 電子ユニット |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016111249A JP2016111249A (ja) | 2016-06-20 |
| JP2016111249A5 true JP2016111249A5 (enExample) | 2017-12-28 |
| JP6328044B2 JP6328044B2 (ja) | 2018-05-23 |
Family
ID=56107115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014248663A Active JP6328044B2 (ja) | 2014-12-09 | 2014-12-09 | 電子ユニット |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9943010B2 (enExample) |
| EP (1) | EP3232748A1 (enExample) |
| JP (1) | JP6328044B2 (enExample) |
| CN (1) | CN107432090B (enExample) |
| WO (1) | WO2016092919A1 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USD929477S1 (en) * | 2020-01-07 | 2021-08-31 | Worthington Cylinders Corporation | Electronic module for a tank lid |
| USD924952S1 (en) * | 2020-01-07 | 2021-07-13 | Worthington Cylinders Corporation | Electronic module for a tank lid |
| FR3115653B1 (fr) * | 2020-10-22 | 2022-09-09 | Continental Automotive Gmbh | Elément de boitier électronique comprenant un radiateur et procédé d’ajustement associé |
| CN113301756B (zh) * | 2021-06-07 | 2022-11-01 | 国网黑龙江省电力有限公司供电服务中心 | 一种高寒地区电能表数据采集信号强化器 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2537539Y2 (ja) | 1991-09-19 | 1997-06-04 | 三菱重工業株式会社 | コントロールボックスのトランス固定構造 |
| JPH0550788U (ja) | 1991-12-02 | 1993-07-02 | 株式会社東芝 | パネルの取付構造 |
| JP2924387B2 (ja) * | 1991-12-16 | 1999-07-26 | 株式会社デンソー | Ic応用製品の防水構造 |
| US6614108B1 (en) * | 2000-10-23 | 2003-09-02 | Delphi Technologies, Inc. | Electronic package and method therefor |
| JP4043930B2 (ja) * | 2002-12-05 | 2008-02-06 | カルソニックカンセイ株式会社 | Pwmモジュール |
| JP3966820B2 (ja) | 2003-01-20 | 2007-08-29 | カルソニックカンセイ株式会社 | Pwmモジュール |
| JP2010147260A (ja) * | 2008-12-19 | 2010-07-01 | Stanley Electric Co Ltd | 回路モジュール及びその密封方法 |
| DE102009054517B4 (de) * | 2009-12-10 | 2011-12-29 | Robert Bosch Gmbh | Elektronisches Steuergerät |
| DE112011105178B4 (de) * | 2011-04-22 | 2017-11-09 | Mitsubishi Electric Corporation | Halbleitervorrichtung |
| JP2013165139A (ja) * | 2012-02-10 | 2013-08-22 | Honda Motor Co Ltd | 電子部品ユニットの封止構造及び製造方法 |
-
2014
- 2014-12-09 JP JP2014248663A patent/JP6328044B2/ja active Active
-
2015
- 2015-09-04 EP EP15867496.0A patent/EP3232748A1/en not_active Withdrawn
- 2015-09-04 US US15/534,825 patent/US9943010B2/en active Active
- 2015-09-04 WO PCT/JP2015/075196 patent/WO2016092919A1/ja not_active Ceased
- 2015-09-04 CN CN201580066300.2A patent/CN107432090B/zh active Active
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