JP2016111249A5 - - Google Patents

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Publication number
JP2016111249A5
JP2016111249A5 JP2014248663A JP2014248663A JP2016111249A5 JP 2016111249 A5 JP2016111249 A5 JP 2016111249A5 JP 2014248663 A JP2014248663 A JP 2014248663A JP 2014248663 A JP2014248663 A JP 2014248663A JP 2016111249 A5 JP2016111249 A5 JP 2016111249A5
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JP
Japan
Prior art keywords
electronic component
heat
electronic
casing
electronic unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014248663A
Other languages
English (en)
Japanese (ja)
Other versions
JP6328044B2 (ja
JP2016111249A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2014248663A external-priority patent/JP6328044B2/ja
Priority to JP2014248663A priority Critical patent/JP6328044B2/ja
Priority to PCT/JP2015/075196 priority patent/WO2016092919A1/ja
Priority to CN201580066300.2A priority patent/CN107432090B/zh
Priority to EP15867496.0A priority patent/EP3232748A1/en
Priority to US15/534,825 priority patent/US9943010B2/en
Publication of JP2016111249A publication Critical patent/JP2016111249A/ja
Publication of JP2016111249A5 publication Critical patent/JP2016111249A5/ja
Publication of JP6328044B2 publication Critical patent/JP6328044B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014248663A 2014-12-09 2014-12-09 電子ユニット Active JP6328044B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2014248663A JP6328044B2 (ja) 2014-12-09 2014-12-09 電子ユニット
US15/534,825 US9943010B2 (en) 2014-12-09 2015-09-04 Electronic unit
CN201580066300.2A CN107432090B (zh) 2014-12-09 2015-09-04 电子设备
EP15867496.0A EP3232748A1 (en) 2014-12-09 2015-09-04 Electronic unit
PCT/JP2015/075196 WO2016092919A1 (ja) 2014-12-09 2015-09-04 電子ユニット

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014248663A JP6328044B2 (ja) 2014-12-09 2014-12-09 電子ユニット

Publications (3)

Publication Number Publication Date
JP2016111249A JP2016111249A (ja) 2016-06-20
JP2016111249A5 true JP2016111249A5 (enExample) 2017-12-28
JP6328044B2 JP6328044B2 (ja) 2018-05-23

Family

ID=56107115

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014248663A Active JP6328044B2 (ja) 2014-12-09 2014-12-09 電子ユニット

Country Status (5)

Country Link
US (1) US9943010B2 (enExample)
EP (1) EP3232748A1 (enExample)
JP (1) JP6328044B2 (enExample)
CN (1) CN107432090B (enExample)
WO (1) WO2016092919A1 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD929477S1 (en) * 2020-01-07 2021-08-31 Worthington Cylinders Corporation Electronic module for a tank lid
USD924952S1 (en) * 2020-01-07 2021-07-13 Worthington Cylinders Corporation Electronic module for a tank lid
FR3115653B1 (fr) * 2020-10-22 2022-09-09 Continental Automotive Gmbh Elément de boitier électronique comprenant un radiateur et procédé d’ajustement associé
CN113301756B (zh) * 2021-06-07 2022-11-01 国网黑龙江省电力有限公司供电服务中心 一种高寒地区电能表数据采集信号强化器

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2537539Y2 (ja) 1991-09-19 1997-06-04 三菱重工業株式会社 コントロールボックスのトランス固定構造
JPH0550788U (ja) 1991-12-02 1993-07-02 株式会社東芝 パネルの取付構造
JP2924387B2 (ja) * 1991-12-16 1999-07-26 株式会社デンソー Ic応用製品の防水構造
US6614108B1 (en) * 2000-10-23 2003-09-02 Delphi Technologies, Inc. Electronic package and method therefor
JP4043930B2 (ja) * 2002-12-05 2008-02-06 カルソニックカンセイ株式会社 Pwmモジュール
JP3966820B2 (ja) 2003-01-20 2007-08-29 カルソニックカンセイ株式会社 Pwmモジュール
JP2010147260A (ja) * 2008-12-19 2010-07-01 Stanley Electric Co Ltd 回路モジュール及びその密封方法
DE102009054517B4 (de) * 2009-12-10 2011-12-29 Robert Bosch Gmbh Elektronisches Steuergerät
DE112011105178B4 (de) * 2011-04-22 2017-11-09 Mitsubishi Electric Corporation Halbleitervorrichtung
JP2013165139A (ja) * 2012-02-10 2013-08-22 Honda Motor Co Ltd 電子部品ユニットの封止構造及び製造方法

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