JP2016111093A - 基板保持装置 - Google Patents

基板保持装置 Download PDF

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Publication number
JP2016111093A
JP2016111093A JP2014245193A JP2014245193A JP2016111093A JP 2016111093 A JP2016111093 A JP 2016111093A JP 2014245193 A JP2014245193 A JP 2014245193A JP 2014245193 A JP2014245193 A JP 2014245193A JP 2016111093 A JP2016111093 A JP 2016111093A
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JP
Japan
Prior art keywords
substrate
fluid
mounting table
wafer
substrate mounting
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Pending
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JP2014245193A
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English (en)
Japanese (ja)
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JP2016111093A5 (cg-RX-API-DMAC7.html
Inventor
良行 竹内
Yoshiyuki Takeuchi
良行 竹内
周史 塚本
Shuji Tsukamoto
周史 塚本
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Samco Inc
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Samco Inc
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Priority to JP2014245193A priority Critical patent/JP2016111093A/ja
Publication of JP2016111093A publication Critical patent/JP2016111093A/ja
Publication of JP2016111093A5 publication Critical patent/JP2016111093A5/ja
Pending legal-status Critical Current

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  • Jigs For Machine Tools (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2014245193A 2014-12-03 2014-12-03 基板保持装置 Pending JP2016111093A (ja)

Priority Applications (1)

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JP2014245193A JP2016111093A (ja) 2014-12-03 2014-12-03 基板保持装置

Applications Claiming Priority (1)

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JP2014245193A JP2016111093A (ja) 2014-12-03 2014-12-03 基板保持装置

Publications (2)

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JP2016111093A true JP2016111093A (ja) 2016-06-20
JP2016111093A5 JP2016111093A5 (cg-RX-API-DMAC7.html) 2017-10-12

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JP2014245193A Pending JP2016111093A (ja) 2014-12-03 2014-12-03 基板保持装置

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JP (1) JP2016111093A (cg-RX-API-DMAC7.html)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022171524A (ja) * 2021-09-15 2022-11-11 中外炉工業株式会社 基板保持装置
JP2023023499A (ja) * 2021-08-05 2023-02-16 東京エレクトロン株式会社 接合装置および接合方法
CN115881610A (zh) * 2022-12-07 2023-03-31 锐立平芯微电子(广州)有限责任公司 一种控制顶升机构运动速度的方法和装置
JP2023097473A (ja) * 2021-12-28 2023-07-10 株式会社ディスコ 保持テーブル、それを備える加工装置、及び、加工方法
WO2025047483A1 (ja) * 2023-09-01 2025-03-06 東京エレクトロン株式会社 基板処理装置及び基板処理システム
WO2025047482A1 (ja) * 2023-09-01 2025-03-06 東京エレクトロン株式会社 基板処理装置及び基板処理システム

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07231034A (ja) * 1994-02-17 1995-08-29 Hitachi Ltd 板状物の固定方法および装置ならびにプラズマ処理装置
JP2001118916A (ja) * 1999-10-19 2001-04-27 Tomoegawa Paper Co Ltd 静電チャック装置およびその製造方法
JP2002270681A (ja) * 2001-03-07 2002-09-20 Anelva Corp 基板処理用静電吸着機構
JP2003318160A (ja) * 2003-06-03 2003-11-07 Matsushita Electric Ind Co Ltd プラズマ処理装置及びプラズマ処理方法
JP2004134437A (ja) * 2002-10-08 2004-04-30 Renesas Technology Corp 半導体装置の製造方法および半導体製造装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07231034A (ja) * 1994-02-17 1995-08-29 Hitachi Ltd 板状物の固定方法および装置ならびにプラズマ処理装置
JP2001118916A (ja) * 1999-10-19 2001-04-27 Tomoegawa Paper Co Ltd 静電チャック装置およびその製造方法
JP2002270681A (ja) * 2001-03-07 2002-09-20 Anelva Corp 基板処理用静電吸着機構
JP2004134437A (ja) * 2002-10-08 2004-04-30 Renesas Technology Corp 半導体装置の製造方法および半導体製造装置
JP2003318160A (ja) * 2003-06-03 2003-11-07 Matsushita Electric Ind Co Ltd プラズマ処理装置及びプラズマ処理方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023023499A (ja) * 2021-08-05 2023-02-16 東京エレクトロン株式会社 接合装置および接合方法
JP7660459B2 (ja) 2021-08-05 2025-04-11 東京エレクトロン株式会社 接合装置および接合方法
JP2022171524A (ja) * 2021-09-15 2022-11-11 中外炉工業株式会社 基板保持装置
JP2023097473A (ja) * 2021-12-28 2023-07-10 株式会社ディスコ 保持テーブル、それを備える加工装置、及び、加工方法
JP7743303B2 (ja) 2021-12-28 2025-09-24 株式会社ディスコ 保持テーブル、それを備える加工装置、及び、加工方法
CN115881610A (zh) * 2022-12-07 2023-03-31 锐立平芯微电子(广州)有限责任公司 一种控制顶升机构运动速度的方法和装置
WO2025047483A1 (ja) * 2023-09-01 2025-03-06 東京エレクトロン株式会社 基板処理装置及び基板処理システム
WO2025047482A1 (ja) * 2023-09-01 2025-03-06 東京エレクトロン株式会社 基板処理装置及び基板処理システム

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