JP2016110066A5 - - Google Patents
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- JP2016110066A5 JP2016110066A5 JP2015171202A JP2015171202A JP2016110066A5 JP 2016110066 A5 JP2016110066 A5 JP 2016110066A5 JP 2015171202 A JP2015171202 A JP 2015171202A JP 2015171202 A JP2015171202 A JP 2015171202A JP 2016110066 A5 JP2016110066 A5 JP 2016110066A5
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- JP
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- Prior art keywords
- substrate
- light
- determining
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- projecting means
- Prior art date
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Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/948,548 US9841299B2 (en) | 2014-11-28 | 2015-11-23 | Position determining device, position determining method, lithographic apparatus, and method for manufacturing object |
TW104139186A TWI620039B (zh) | 2014-11-28 | 2015-11-25 | 位置判斷裝置、位置判斷方法、微影設備及用於製造物件的方法 |
KR1020150167023A KR101993950B1 (ko) | 2014-11-28 | 2015-11-27 | 위치 결정 장치, 위치 결정 방법, 리소그래피 장치 및 물품 제조 방법 |
CN201510846079.4A CN105652611B (zh) | 2014-11-28 | 2015-11-27 | 位置确定装置和方法、平版印刷设备及物品制造方法 |
EP15196752.8A EP3026491B1 (en) | 2014-11-28 | 2015-11-27 | Position determining device, position determining method, lithographic apparatus, and method for manufacturing object |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014242526 | 2014-11-28 | ||
JP2014242526 | 2014-11-28 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2016110066A JP2016110066A (ja) | 2016-06-20 |
JP2016110066A5 true JP2016110066A5 (enrdf_load_stackoverflow) | 2018-08-30 |
JP6590599B2 JP6590599B2 (ja) | 2019-10-16 |
Family
ID=56122139
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015171202A Active JP6590599B2 (ja) | 2014-11-28 | 2015-08-31 | 位置決定装置、位置決定方法、リソグラフィ装置、および物品の製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6590599B2 (enrdf_load_stackoverflow) |
KR (1) | KR101993950B1 (enrdf_load_stackoverflow) |
CN (1) | CN105652611B (enrdf_load_stackoverflow) |
TW (1) | TWI620039B (enrdf_load_stackoverflow) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL2019007A (en) * | 2016-06-13 | 2017-12-20 | Asml Netherlands Bv | Methods and apparatus for determining the position of a target structure on a substrate, methods and apparatus for determining the position of a substrate |
JP6276449B1 (ja) * | 2017-03-30 | 2018-02-07 | 株式会社荏原製作所 | 基板処理装置、基板処理装置の制御方法、プログラムを格納した記憶媒体 |
JP6490771B1 (ja) * | 2017-09-27 | 2019-03-27 | 株式会社アルバック | 位置検出装置、位置検出方法、および、蒸着装置 |
CN109585351B (zh) * | 2018-10-29 | 2021-06-22 | 苏州腾晖光伏技术有限公司 | 一种提高晶硅双面太阳电池的背铝栅线对准精度的方法 |
CN111355541A (zh) * | 2020-04-02 | 2020-06-30 | Oppo广东移动通信有限公司 | 网络设备、搜寻网络信号的方法 |
JP7609676B2 (ja) | 2021-03-29 | 2025-01-07 | 東京エレクトロン株式会社 | 基板処理装置及び基板搬送位置調整方法 |
CN118641478B (zh) * | 2024-08-14 | 2024-11-05 | 江苏福拉特自动化设备有限公司 | Micro-LED拼接面磨边倒角多角度检测用工业相机自适应聚焦装置及方法 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5194743A (en) * | 1990-04-06 | 1993-03-16 | Nikon Corporation | Device for positioning circular semiconductor wafers |
TWI250556B (en) * | 2001-07-20 | 2006-03-01 | Asml Netherlands Bv | Lithographic apparatus, device manufacturing method, and device manufactured thereby |
EP1791169A4 (en) * | 2004-08-31 | 2011-03-02 | Nikon Corp | ALIGNMENT PROCESS, DEVELOPMENT SYSTEM, SUBSTRATED REPEATABILITY MEASURING METHOD, POSITION MEASURING METHOD, EXPOSURE METHOD, SUBSTRATE PROCESSING DEVICE, MEASURING METHOD AND MEASURING DEVICE |
US7626701B2 (en) * | 2004-12-27 | 2009-12-01 | Asml Netherlands B.V. | Lithographic apparatus with multiple alignment arrangements and alignment measuring method |
SG124407A1 (en) * | 2005-02-03 | 2006-08-30 | Asml Netherlands Bv | Method of generating a photolithography patterningdevice, computer program, patterning device, meth od of determining the position of a target image on or proximate a substrate, measurement device, and lithographic apparatus |
US7342642B2 (en) * | 2005-06-20 | 2008-03-11 | Asml Netherlands B.V. | Pre-aligning a substrate in a lithographic apparatus, device manufacturing method, and device manufactured by the manufacturing method |
DE102007042271B3 (de) * | 2007-09-06 | 2009-02-05 | Vistec Semiconductor Systems Gmbh | Verfahren zur Bestimmung der Lage der Entlackungskante eines scheibenförmigen Objekts |
JP5084558B2 (ja) * | 2008-02-28 | 2012-11-28 | キヤノン株式会社 | 表面形状計測装置、露光装置及びデバイス製造方法 |
JP5324231B2 (ja) * | 2009-01-08 | 2013-10-23 | 日東電工株式会社 | 半導体ウエハのアライメント装置 |
CN102402127B (zh) * | 2010-09-17 | 2014-01-22 | 上海微电子装备有限公司 | 一种硅片预对准装置及方法 |
JP5875335B2 (ja) * | 2011-11-15 | 2016-03-02 | キヤノン株式会社 | 位置検出装置および露光装置 |
TWI581055B (zh) * | 2012-10-02 | 2017-05-01 | 聯華電子股份有限公司 | 形成光罩的方法 |
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2015
- 2015-08-31 JP JP2015171202A patent/JP6590599B2/ja active Active
- 2015-11-25 TW TW104139186A patent/TWI620039B/zh active
- 2015-11-27 CN CN201510846079.4A patent/CN105652611B/zh active Active
- 2015-11-27 KR KR1020150167023A patent/KR101993950B1/ko active Active