JP2016105475A - 集光型太陽電池 - Google Patents
集光型太陽電池 Download PDFInfo
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- 230000005494 condensation Effects 0.000 title abstract 3
- 238000009833 condensation Methods 0.000 title abstract 3
- 238000006243 chemical reaction Methods 0.000 claims abstract description 263
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 100
- 239000000758 substrate Substances 0.000 claims description 64
- 239000000463 material Substances 0.000 claims description 52
- 239000004065 semiconductor Substances 0.000 claims description 37
- 150000001875 compounds Chemical class 0.000 claims description 23
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 21
- 230000007423 decrease Effects 0.000 claims description 7
- ORQBXQOJMQIAOY-UHFFFAOYSA-N nobelium Chemical compound [No] ORQBXQOJMQIAOY-UHFFFAOYSA-N 0.000 abstract 5
- 210000004027 cell Anatomy 0.000 description 486
- 239000010410 layer Substances 0.000 description 323
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 99
- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 description 99
- 229910000673 Indium arsenide Inorganic materials 0.000 description 42
- RPQDHPTXJYYUPQ-UHFFFAOYSA-N indium arsenide Chemical compound [In]#[As] RPQDHPTXJYYUPQ-UHFFFAOYSA-N 0.000 description 42
- 229910000530 Gallium indium arsenide Inorganic materials 0.000 description 41
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 37
- 239000012535 impurity Substances 0.000 description 22
- 239000000203 mixture Substances 0.000 description 16
- 238000010248 power generation Methods 0.000 description 15
- 229910052710 silicon Inorganic materials 0.000 description 13
- 238000000034 method Methods 0.000 description 10
- 238000001228 spectrum Methods 0.000 description 10
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 239000013078 crystal Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 9
- 230000003287 optical effect Effects 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 7
- 239000010408 film Substances 0.000 description 7
- 229910052698 phosphorus Inorganic materials 0.000 description 7
- 239000011574 phosphorus Substances 0.000 description 7
- 210000000678 band cell Anatomy 0.000 description 6
- 230000007246 mechanism Effects 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 229910052732 germanium Inorganic materials 0.000 description 5
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 5
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000010419 fine particle Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052714 tellurium Inorganic materials 0.000 description 1
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
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Abstract
Description
図1は、実施の形態1の集光型太陽電池モジュール100を示す図である。
実施の形態2の集光型太陽電池モジュールは、実施の形態1の集光型太陽電池モジュール100の光電変換セル120を変更したものである。その他の構成は同様であるため、同様の構成要素には同一符号を付し、その説明を省略する。
実施の形態3の集光型太陽電池モジュールは、実施の形態1の集光型太陽電池モジュール100の光電変換セル120を変更したものである。その他の構成は同様であるため、同様の構成要素には同一符号を付し、その説明を省略する。
実施の形態4の集光型太陽電池モジュールは、実施の形態1の集光型太陽電池モジュール100の光電変換セル120を変更したものである。その他の構成は同様であるため、同様の構成要素には同一符号を付し、その説明を省略する。
実施の形態5の集光型太陽電池モジュールは、実施の形態1の集光型太陽電池モジュール100の光電変換セル120を変更したものである。その他の構成は同様であるため、同様の構成要素には同一符号を付し、その説明を省略する。
100A、100A1〜100An、100B、100C 集光型太陽電池
101 筐体
101A ステー
102 集光レンズ
102C 集光ミラー
103 放熱板
110、110−1〜110−n、110B 光電変換セル
120、120−1〜120−n 光電変換セル
130 Geセル
131 p型のGe基板
132 n型のGe層
140 n型のGaInP層
141 n型のGaInAsバッファ層
150 トンネル接合層
151 n+型のGaAs層
152 p+型のGaAs層
160 GaInAsセル
161 p型のGa(x)InP層
162 p型のGa(x)InAs層
163 n型のGa(x)InAs層
164 n型の[Al(x)Ga](y)InP層
40A コンタクト層
50 電極
220 光電変換セル
230 GaAs基板
240 GaInNAsセル
241 p型のGaAs層
242 p型のGaInNAs層
243 i型のGaInNAs層
244 GaInNAs層
245 n型のGaAs層
260 GaAsセル
261 p型のGa(x)InP層
262 p型のGaAs層
263 n型のGaAs層
264 n型の[Al(x)Ga](y)InP層
320 光電変換セル
330 InP基板
340 GaInAsセル
341 p型のInP層
342 p型のGa(x)InAs層
343 n型のGa(x)InAs層
344 n型のInP層
350 トンネル接合層
360 GaInPAsセル
361 p型のInP層
362 p型のGa(x)InP(y)As層
363 n型のGa(x)InP(y)As層
364 n型の[Al(x)Ga](y)InAs層
370 トンネル接合層
371 n+型のInP層
372 p+型のAl(x)InAs層
380 InPセル
381 p型の[Al(x)Ga](y)InAs層
382 p型のInP層
383 n型のInP層
384 n型の[Al(x)Ga](y)InAs層
385 n型のGa(x)InP層
390A コンタクト層
420 光電変換セル
150A、150B トンネル接合層
520 光電変換セル
510 p型のSi基板
530 SiGeセル
531 p型のSiGe組成傾斜層
532 p型のSiGe層
533 n型のSiGe層
541 n型のGaAsバッファ層
Claims (13)
- 集光素子と、
前記集光素子の光入射面、前記集光素子の光出射面、又は、前記集光素子よりも光入射経路における奥側に配置され、第1バンドギャップを有する第1光電変換セルと、
前記第1光電変換セルよりも前記光入射経路における奥側に配置され、前記第1バンドギャップよりも小さい第2バンドギャップを有し、前記集光素子で集光される光が入射される第2光電変換セルと、
前記第1光電変換セルが出力する第1出力電流を出力する第1出力回路と、
前記第1出力回路とは独立して構成され、前記第2光電変換セルが出力する第2出力電流を出力する第2出力回路と
を含む、集光型太陽電池。 - 複数の集光素子と、
前記複数の集光素子の光入射面、前記集光素子の光出射面、又は、前記集光素子よりも光入射経路における奥側にそれぞれ配置され、第1バンドギャップを有する、複数の第1光電変換セルと、
前記複数の第1光電変換セルよりも前記光入射経路における奥側に配置され、前記第1バンドギャップよりも小さい第2バンドギャップを有し、前記集光素子で集光される光が入射される、複数の第2光電変換セルと、
前記複数の第1光電変換セルが出力する第1出力電流を出力する第1出力回路と、
前記第1出力回路とは独立して構成され、前記複数の第2光電変換セルが出力する第2出力電流を出力する第2出力回路と
を含む、集光型太陽電池。 - 前記第1出力回路は、前記複数の第1光電変換セルを直列に接続したものであり、
前記第2出力回路は、前記複数の第2光電変換セルを直列に接続したものである、請求項2記載の集光型太陽電池。 - 前記第2光電変換セルは、平面視で前記第1光電変換セルよりも小さい、請求項1乃至3のいずれか一項記載の集光型太陽電池。
- 前記第1出力回路と、前記第2出力回路とは、直流電力を交流電力に変換する電力変換器に互いに並列に接続される、請求項1乃至4のいずれか一項記載の集光型太陽電池。
- 前記第1出力回路は、昇圧装置を介して、前記第2出力回路と接続されている、請求項5記載の集光型太陽電池。
- 前記第1光電変換セルは、半導体材料で形成される半導体セルである、請求項1乃至6のいずれか一項記載の集光型太陽電池。
- 前記半導体セルは、アモルファスシリコンセルである、請求項7記載の集光型太陽電池。
- 前記第2光電変換セルは、
基板と、
前記基板の前記光入射経路における入射側に積層される複数のサブセルと
を含み、
前記複数のサブセルのバンドギャップは、前記光入射経路における入射側から奥側に向かって小さくなる、請求項1乃至8のいずれか一項記載の集光型太陽電池。 - 前記基板は、GaAs基板又はGe基板であり、前記複数のサブセルは、GaAs系のサブセルである、請求項9記載の集光型太陽電池。
- 前記基板は、InP基板であり、前記複数のサブセルは、InP系のサブセルである、請求項9記載の集光型太陽電池。
- 前記基板は、Si基板であり、前記複数のサブセルは、Siに格子整合しない半導体材料、又は、Siに格子整合しない化合物半導体材料で形成されるサブセルである、請求項9記載の集光型太陽電池。
- 前記集光素子は、集光レンズ又は集光ミラーである、請求項1乃至12のいずれか一項記載の集光型太陽電池。
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