JP2022509963A - アルミニウム-ヒ素およびインジウム-リンベースのヘテロ接合による光起電セル、関連する多接合セル、および関連する方法 - Google Patents
アルミニウム-ヒ素およびインジウム-リンベースのヘテロ接合による光起電セル、関連する多接合セル、および関連する方法 Download PDFInfo
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- GPXJNWSHGFTCBW-UHFFFAOYSA-N Indium phosphide Chemical compound [In]#P GPXJNWSHGFTCBW-UHFFFAOYSA-N 0.000 title claims abstract description 6
- MDPILPRLPQYEEN-UHFFFAOYSA-N aluminium arsenide Chemical compound [As]#[Al] MDPILPRLPQYEEN-UHFFFAOYSA-N 0.000 title claims abstract description 6
- 238000000034 method Methods 0.000 title claims description 16
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 67
- 239000000956 alloy Substances 0.000 claims abstract description 67
- 230000003647 oxidation Effects 0.000 claims abstract description 8
- 238000007254 oxidation reaction Methods 0.000 claims abstract description 8
- 238000002161 passivation Methods 0.000 claims abstract description 6
- FTWRSWRBSVXQPI-UHFFFAOYSA-N alumanylidynearsane;gallanylidynearsane Chemical compound [As]#[Al].[As]#[Ga] FTWRSWRBSVXQPI-UHFFFAOYSA-N 0.000 claims description 42
- 229910052782 aluminium Inorganic materials 0.000 claims description 32
- 229910052790 beryllium Inorganic materials 0.000 claims description 29
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 28
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 claims description 27
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 24
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 23
- 229910052710 silicon Inorganic materials 0.000 claims description 21
- 239000010703 silicon Substances 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 19
- 239000000203 mixture Substances 0.000 claims description 19
- 239000011669 selenium Substances 0.000 claims description 18
- 239000011701 zinc Substances 0.000 claims description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 15
- 239000002019 doping agent Substances 0.000 claims description 12
- 230000005684 electric field Effects 0.000 claims description 12
- 229910052799 carbon Inorganic materials 0.000 claims description 11
- 229910052711 selenium Inorganic materials 0.000 claims description 9
- 229910052714 tellurium Inorganic materials 0.000 claims description 9
- 229910052725 zinc Inorganic materials 0.000 claims description 9
- 229910005540 GaP Inorganic materials 0.000 claims description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910000980 Aluminium gallium arsenide Inorganic materials 0.000 claims 3
- 230000006798 recombination Effects 0.000 abstract description 6
- 238000005215 recombination Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 description 19
- 239000002184 metal Substances 0.000 description 19
- 230000008569 process Effects 0.000 description 11
- 238000005530 etching Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 229910000967 As alloy Inorganic materials 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 239000010931 gold Substances 0.000 description 4
- 238000001465 metallisation Methods 0.000 description 4
- 238000001451 molecular beam epitaxy Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- 239000000969 carrier Substances 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 230000005693 optoelectronics Effects 0.000 description 3
- 238000001228 spectrum Methods 0.000 description 3
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- 229910001096 P alloy Inorganic materials 0.000 description 2
- CQBLUJRVOKGWCF-UHFFFAOYSA-N [O].[AlH3] Chemical compound [O].[AlH3] CQBLUJRVOKGWCF-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 235000008694 Humulus lupulus Nutrition 0.000 description 1
- 229910000846 In alloy Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- -1 aluminum-indium-phosphorus Chemical compound 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000002803 fossil fuel Substances 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
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Abstract
Description
-次のドーパント:
-シリコン「Si」、
-セレン「Se」、
-テルル「Te」、
のいずれかが5.1018cm-3~5.1019cm-3に含まれるドーピング濃度で、ドープされたガリウム-ヒ素「GaAs」合金で作製され、
かつ150nm~300nmに含まれる厚さを有する、フロントコンタクト層と、
-次のドーパント:
-シリコン「Si」、
-セレン「Se」、
-テルル「Te」、
のいずれかが5.1018cm-3~1.1019cm-3に含まれるドーピング濃度で、ドープされたアルミニウム-インジウム-リン化物「AlInP」合金で作製され、
かつ20nm~70nmに含まれる厚さを有する、窓層と、
-次のドーパント:
-シリコン「Si」、
-セレン「Se」、
-テルル「Te」、
のいずれかを1.1016cm-3~2.1018cm-3に含まれるドーピング濃度で、ドープすることができるインジウム-ガリウム-リン化物「InGaP」合金で作製され、
かつ20nm~100nmに含まれる厚さを有する、エミッタ層と、
-xが0~0.37に含まれ、かつ次のドーパント:
-ベリリウム「Be」、
-炭素「C」、
-亜鉛「Zn」、
のいずれかが2.1016cm-3~5.1017cm-3に含まれるドーピング濃度で、ドープされたアルミニウム-ガリウム-ヒ素「AlxGa1-xAs」合金で作製され、
かつ200nm~2000nmに含まれる厚さを有する、ベース層と、
-xが0.4~0.8に含まれ、かつ次のドーパント:
-ベリリウム「Be」、
-炭素「C」、
-亜鉛「Zn」、
のいずれかが5.1018cm-3~1.1019cm-3に含まれるドーピング濃度で、ドープされたアルミニウム-ガリウム-ヒ素「AlxGa1-xAs」合金で作製され、
かつ20nm~120nmに含まれる厚さを有する、裏面電界と、
-次のドーパント:
-ベリリウム「Be」、
-炭素「C」、
-亜鉛「Zn」、
のいずれかが5.1018cm-3~1.1019cm-3に含まれるドーピング濃度で、ドープされたガリウム-ヒ素「GaAs」合金で作製され、
かつ150nm~300nmに含まれる厚さを有する、バックコンタクト層と、を備える。
-5.1018cm-3~2.1019cm-3に含まれるドーピング濃度で、シリコン「Si」がドープされたガリウム-ヒ素「GaAs」合金で作製され、かつ150~320nmに含まれる厚さを有する、フロントコンタクト層と、
-5.1018cm-3~2.1019cm-3に含まれるドーピング濃度で、シリコン「Si」がドープされたアルミニウム-インジウム-リン化物「AlInP」合金で作製され、かつ20nm~50nmに含まれる厚さを有する、窓層と、
-40~60nmに含まれる厚さを有するインジウム-ガリウム-リン化物「InGaP」で作製されたアンドープのエミッタ層と、
-1.1016cm-3~2.1017cm-3に含まれるドーピング濃度で、ベリリウム「Be」がドープされたアルミニウム-ガリウム-ヒ素「Al0.25GaAs」合金で作製され、かつ400nm~2000nmに含まれる厚さを有する、ベース層と、
-4.1018cm-3~1.1019cm-3に含まれるドーピング濃度で、ベリリウム「Be」がドープされたアルミニウム-ガリウム-ヒ素「Al0.51GaAs」合金で作製され、かつ20nm~80nmに含まれる厚さを有する、裏面電界と、
-5.1018cm-3~2.1019cm-3に含まれるドーピング濃度で、ベリリウム「Be」がドープされたガリウム-ヒ素「GaAs」合金で作製され、かつ150nm~300nmに含まれる厚さを有する、バックコンタクト層と、を備える。
-アルミニウムの傾斜濃度が25%~37%で変動するアンドープのアルミニウム-ガリウム-ヒ素「AlxGa1-xAs」で作製され、かつ80~120nmに含まれる厚さを有する、フロント追加副層(L41)と、
-アルミニウムの傾斜濃度が25%~51%で変動し、4.1018cm-3~6.1018cm-3に含まれるドーピング濃度で、ベリリウム「Be」がドープされたアルミニウム-ガリウム-ヒ素「AlxGa1-xAs」で作製され、かつ80~120nmに含まれる厚さを有する、バック追加副層(L43)と、を備える。
-アルミニウムの傾斜濃度が51%~0%で変動し、4.1018cm-3~6.1018cm-3に含まれるドーピング濃度で、ベリリウム「Be」がドープされたアルミニウム-ガリウム-ヒ素「AlxGa1-xAs」で作製され、かつ80~120nmに含まれる厚さを有する、フロント追加副層(L61)を備える。
-矢印3で表される光が層L1に入る側に対応する前面と、前面に対向する裏面と、を備えるフロントコンタクト層L1。フロントコンタクト層L1は、電流を収集し、かつフロントコンタクト層L1の上部に配置された金属グリッド(図1には表されていない)とのオーミックコンタクトを形成することを可能にする。グリッドの下にないフロントコンタクト層L1の部分(光起電セルが、異なる層が水平方向(重力方向に対応する垂直方向)になるように配列されることを考慮し、層の前面は、層の裏面の上に配列される)は、その後、エッチングプロセスによって除去される。
-フロントコンタクト層L1の裏面と接触する前面と、前面に対向する裏面と、を備える窓層L2。窓層L2は、多数キャリア(n型層の場合は電子)を通過させてフロントコンタクト層L1に収集し、少数キャリア(n型層の場合は正孔)を遮断することによって、表面再結合を低減するための障壁として使用される。
-窓層L2の裏面と接触する前面と、前面に対向する裏面と、を備えるエミッタ層L3。
-エミッタ層L3の裏面と接触する前面と、前面に対向する裏面と、を備えるベース層L4。
-ベース層L4の裏面と接触する前面と、前面に対向する裏面と、を備える裏面電界層L5。裏面電界層L5は、バンドギャップ障壁を作り、電子を遮断することにより、電子と正孔との再結合を低減することを可能にする。
-裏面電界層L5の裏面と接触する前面と、前面に対向する裏面と、を備えるバックコンタクト層L6。バックコンタクト層L6は、正孔を収集し、かつバックコンタクト層L6のバックに配置された金属コンタクト(図1には表されていない)とのオーミックコンタクトを形成することを可能にする。
-1.1019のドーピング濃度で、シリコン(Si)がドープされたガリウム-μヒ素(GaAs)合金で作製され、かつ300nmの厚さを有する、フロントコンタクト層と、
-1.1019のドーピング濃度で、シリコン(Si)がドープされたアルミニウム-インジウム-リン(AlInP)合金で作製され、かつ20nmの厚さを有する、窓層と、
-50nmの厚さを有する真性インジウム-ガリウム-リン(InGaP)合金のエミッタ層と、
-2.1016のドーピング濃度で、ベリリウム(Be)がドープされた、アルミニウム組成xのパーセンテージが0.25であるアルミニウム-ガリウム-ヒ素(AlxGa1-xAs)合金で作製され、かつ1000nmの厚さを有する、ベース層と、
-5.1018のドーピング濃度で、ベリリウム(Be)がドープされた、アルミニウム組成xのパーセンテージが0.51であるアルミニウム-ガリウム-ヒ素(AlxGa1-xAs)合金で作製され、かつ70nmの厚さを有する、裏面電界層と、
-1.1019のドーピング濃度で、ベリリウム(Be)がドープされたガリウム-ヒ素(GaAs)合金で作製され、かつ300nmの厚を有する、バックコンタクト層と、を備える。
図8において、第1のステップ101は、Siベースの光起電サブセルの異なる層を得るための成長プロセスを指す。先に示したように、Siベースの光起電セルの異なる層は、化学気相成長法(CVD)または他の堆積技術に基づいて成長させ得る。
図9において、第1の1001および第2の1002ステップは、図8に基づいて説明された結合プロセスと同一である。図7の左側部分は、同時にまたは任意の順序で達成することができるこれらのステップ1001および1002を表す。
Claims (14)
- アルミニウム-ヒ素ベースの合金から作製されたベース層(L4、L4’、L4’’)およびインジウム-リンベースの合金から作製されたエミッタ層(L3、L3’)のヘテロ接合を備える光起電セル(1)であって、前記エミッタ層(L3、L3’)が、100nm未満の厚さを有し、かつ前記ベース層の酸化を防止し、表面再結合(L4、L4’、L4’’)を低減するためのパッシベーション層として機能する、光起電セル(1)。
- 前記ヘテロ接合が、p-i-nヘテロ接合であり、前記ベース層(L4、L4’、L4’’)と前記エミッタ層(L3、L3’)との間の界面に少なくとも1つの真性副層を備える、請求項1に記載の光起電セル(1)。
- 前記ベース層(L4、L4’、L4’’)が、アルミニウム-ガリウム-ヒ素「AlGaAs」合金で作製される、請求項1または2に記載の光起電セル(1)。
- 前記エミッタ層(L3、L3’)が、インジウム-ガリウム-リン化物「InGaP」合金で作製される、請求項1~3のいずれか一項に記載の光起電セル(1)。
- 前記ベース層(L4’’)が、アルミニウムパーセンテージ組成が20~55%の範囲で変動する傾斜アルミニウムベースの合金を含む、請求項1~4のいずれか一項に記載の光起電セル。
- 前記ベース層(L4’’)が、25%のアルミニウムがベリリウムまたは炭素でドープされたAlGaAsで作製された第1の副層と、アルミニウム組成のパーセンテージが25%~30%で変動する真性傾斜AlGaAsで作製された第2の副層と、を備える、請求項5に記載の光起電セル(1)。
- 前記ベース層(L4、L4’、L4’’)が、1.7eVのバンドギャップを有し、前記エミッタ層が、1.9eVのバンドギャップを有する、請求項1~6のいずれか一項に記載の光起電セル(1)。
- -次のドーパント:
-シリコン「Si」、
-セレン「Se」、
-テルル「Te」、
のいずれかが5.1018cm-3~5.1019cm-3に含まれるドーピング濃度で、ドープされたガリウム-ヒ素「GaAs」合金で作製され、
かつ150nm~300nmに含まれる厚さを有する、フロントコンタクト層(L1、L1’)と、
-次のドーパント:
-シリコン「Si」、
-セレン「Se」、
-テルル「Te」、
のいずれかが5.1018cm-3~1.1019cm-3に含まれるドーピング濃度で、ドープされたアルミニウム-インジウム-リン化物「AlInP」合金で作製され、
かつ20nm~70nmに含まれる厚さを有する、窓層(L2、L2’)と、
-次のドーパント:
-シリコン「Si」、
-セレン「Se」、
-テルル「Te」、
のいずれかを1.1016cm-3~2.1018cm-3に含まれるドーピング濃度で、ドープすることができるインジウム-ガリウム-リン化物「InGaP」合金で作製され、
かつ20nm~100nmに含まれる厚さを有する、エミッタ層(L3、L3’)と、
-xが0~0.37に含まれ、かつ次のドーパント:
-ベリリウム「Be」、
-炭素「C」、
-亜鉛「Zn」、
のいずれかが2.1016cm-3~5.1017cm-3に含まれるドーピング濃度で、ドープされたアルミニウム-ガリウム-ヒ素「AlxGa1-xAs」合金で作製され、
かつ200nm~2000nmに含まれる厚さを有する、ベース層(L4、L4’、L4’’)と、
-xが0.4~0.8に含まれ、かつ次のドーパント:
-ベリリウム「Be」、
-炭素「C」、
-亜鉛「Zn」、
のいずれかが5.1018cm-3~1.1019cm-3に含まれるドーピング濃度で、ドープされたアルミニウム-ガリウム-ヒ素「AlxGa1-xAs」合金で作製され、
かつ20nm~120nmに含まれる厚さを有する、裏面電界(L5、L5’)と、
-次のドーパント:
-ベリリウム「Be」、
-炭素「C」、
-亜鉛「Zn」、
のいずれかが5.1018cm-3~1.1019cm-3に含まれるドーピング濃度で、ドープされたガリウム-ヒ素「GaAs」合金で作製され、
かつ150nm~300nmに含まれる厚さを有する、バックコンタクト層(L6、L6’)と、を備える、請求項1~7のいずれか一項に記載の光起電セル(1)。 - -5.1018cm-3~2.1019cm-3に含まれるドーピング濃度で、シリコン「Si」がドープされたガリウム-ヒ素「GaAs」合金で作製され、
かつ150~320nmに含まれる厚さを有する、フロントコンタクト層(L1)と、
-5.1018cm-3~2.1019cm-3に含まれるドーピング濃度で、シリコン「Si」がドープされたアルミニウム-インジウム-リン化物「AlInP」合金で作製され、
かつ20nm~50nmに含まれる厚さを有する、窓層(L2)と、
-40nm~60nmに含まれる厚さを有するインジウム-ガリウム-リン化物「InGaP」で作製されたアンドープのエミッタ層(L3)と、
-1.1016cm-3~2.1017cm-3に含まれるドーピング濃度で、ベリリウム「Be」がドープされたアルミニウム-ガリウム-ヒ素「Al0.25GaAs」合金で作製され、
かつ400nm~2000nmに含まれる厚さを有する、ベース層(L4)と、
-4.1018cm-3~1.1019cm-3に含まれるドーピング濃度で、ベリリウム「Be」がドープされたアルミニウム-ガリウム-ヒ素「Al0.51GaAs」合金で作製され、
かつ20nm~80nmに含まれる厚さを有する、裏面電界(L5)と、
-5.1018cm-3~2.1019cm-3に含まれるドーピング濃度で、ベリリウム「Be」がドープされたガリウム-ヒ素「GaAs」合金で作製され、
かつ150nm~300nmに含まれる厚さを有する、バックコンタクト層(L6)と、を備える、請求項1~8のいずれか一項に記載の光起電セル(1)。 - 前記ベース層(L4、L4’’)が、
-アルミニウムの傾斜濃度が25%~37%で変動するアンドープのアルミニウム-ガリウム-ヒ素「AlxGa1-xAs」で作製され、かつ80~120nmに含まれる厚さを有する、フロント追加副層(L41)と、
-アルミニウムの傾斜濃度が25%~51%で変動し、4.1018cm-3~6.1018cm-3に含まれるドーピング濃度で、ベリリウム「Be」がドープされたアルミニウム-ガリウム-ヒ素「AlxGa1-xAs」で作製され、かつ80~120nmに含まれる厚さを有する、バック追加副層(L43)と、を備える、請求項8または9に記載の光起電セル(1)。 - 前記バックコンタクト層(L6、L6’’)が、
-アルミニウムの傾斜濃度が51%~0%で変動し、4.1018cm-3~6.1018cm-3に含まれるドーピング濃度で、ベリリウム「Be」がドープされたアルミニウム-ガリウム-ヒ素「AlxGa1-xAs」で作製され、かつ80~120nmに含まれる厚さを有する、フロント追加副層(L61)と、を備える、請求項9または10に記載の光起電セル(1)。 - 少なくとも第1および第2の光起電セルのスタックを備える多接合光起電セル(10、20、30)であって、第1のバンドギャップを有するフロント光起電セルおよび第1のバンドギャップより低い第2のバンドギャップを有する第2の光起電セルを有し、少なくとも前記フロント光起電セルが、請求項1~11のいずれか一項に記載の光起電セルである、多接合光起電セル(10、20、30)。
- 前記第2の光起電セルが、1.1eVのバンドギャップを有するシリコンベースのセルである2つの光起電セルを備える、請求項12に記載の多接合光起電セル(20、30)。
- 前記タンデム光起電セルの少なくともいくつかの層が、分子線エピタキシー「MBE」プロセスまたは有機金属化学気相成長法「MOCVD」プロセスに基づいて得られる、請求項1~13のいずれか一項に記載の光起電セルまたはタンデム光起電セルを製造するための方法。
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