JP2016100153A5 - - Google Patents

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Publication number
JP2016100153A5
JP2016100153A5 JP2014235578A JP2014235578A JP2016100153A5 JP 2016100153 A5 JP2016100153 A5 JP 2016100153A5 JP 2014235578 A JP2014235578 A JP 2014235578A JP 2014235578 A JP2014235578 A JP 2014235578A JP 2016100153 A5 JP2016100153 A5 JP 2016100153A5
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JP
Japan
Prior art keywords
charged particle
particle beam
sample
cross
analyzing
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JP2014235578A
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English (en)
Japanese (ja)
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JP6379018B2 (ja
JP2016100153A (ja
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Priority to JP2014235578A priority Critical patent/JP6379018B2/ja
Priority claimed from JP2014235578A external-priority patent/JP6379018B2/ja
Priority to US14/948,167 priority patent/US9659744B2/en
Publication of JP2016100153A publication Critical patent/JP2016100153A/ja
Publication of JP2016100153A5 publication Critical patent/JP2016100153A5/ja
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JP2014235578A 2014-11-20 2014-11-20 荷電粒子線装置および検査方法 Active JP6379018B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014235578A JP6379018B2 (ja) 2014-11-20 2014-11-20 荷電粒子線装置および検査方法
US14/948,167 US9659744B2 (en) 2014-11-20 2015-11-20 Charged particle beam apparatus and inspection method using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014235578A JP6379018B2 (ja) 2014-11-20 2014-11-20 荷電粒子線装置および検査方法

Publications (3)

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JP2016100153A JP2016100153A (ja) 2016-05-30
JP2016100153A5 true JP2016100153A5 (enExample) 2017-04-13
JP6379018B2 JP6379018B2 (ja) 2018-08-22

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JP2014235578A Active JP6379018B2 (ja) 2014-11-20 2014-11-20 荷電粒子線装置および検査方法

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US (1) US9659744B2 (enExample)
JP (1) JP6379018B2 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9372078B1 (en) * 2014-06-20 2016-06-21 Western Digital (Fremont), Llc Detecting thickness variation and quantitative depth utilizing scanning electron microscopy with a surface profiler
JP6379018B2 (ja) * 2014-11-20 2018-08-22 株式会社日立ハイテクノロジーズ 荷電粒子線装置および検査方法
KR20170067002A (ko) * 2015-12-07 2017-06-15 울산과학기술원 전자 빔을 이용한 도전성 나노와이어 네트워크의 제조방법, 이를 적용한 투명 전극 및 전자 장치
JP6937254B2 (ja) * 2018-02-08 2021-09-22 株式会社日立ハイテク 検査システム、画像処理装置、および検査方法
KR102478945B1 (ko) 2018-04-25 2022-12-19 주식회사 히타치하이테크 하전 입자선 장치의 조사 조건 결정 방법, 및 하전 입자선 장치
KR20240018686A (ko) 2018-08-28 2024-02-13 에이에스엠엘 네델란즈 비.브이. 시간 의존적 결함 검사 장치
TWI854195B (zh) 2018-09-18 2024-09-01 荷蘭商Ａｓｍｌ荷蘭公司 用於偵測快速充電裝置中時間相依缺陷的設備及方法
JP7271358B2 (ja) * 2019-07-25 2023-05-11 株式会社日立ハイテク 電気特性を導出するシステム及び非一時的コンピューター可読媒体
JP7250642B2 (ja) * 2019-08-08 2023-04-03 株式会社日立ハイテク 荷電粒子線装置および荷電粒子線検査システム
JP7458292B2 (ja) * 2020-10-20 2024-03-29 東京エレクトロン株式会社 プラズマ処理装置
WO2022189085A1 (en) * 2021-03-08 2022-09-15 Asml Netherlands B.V. System and method for inspection by deflector control in a charged particle system
JP7481574B2 (ja) 2021-03-29 2024-05-10 株式会社日立ハイテク 検査システム
JP7490832B2 (ja) 2022-03-14 2024-05-27 日本電子株式会社 荷電粒子線装置および荷電粒子線装置の制御方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3917411A1 (de) * 1989-05-29 1990-12-06 Brust Hans Detlef Verfahren und anordnung zur schnellen spektralanalyse eines signals an einem oder mehreren messpunkten
JP4015352B2 (ja) * 2000-02-22 2007-11-28 株式会社日立製作所 荷電粒子ビームを用いた検査方法
JP5098229B2 (ja) * 2006-06-21 2012-12-12 ソニー株式会社 表面改質方法
CN103465525B (zh) * 2006-12-27 2015-10-21 日立化成株式会社 凹版和使用该凹版的带有导体层图形的基材
KR101411119B1 (ko) * 2010-09-25 2014-06-25 가부시키가이샤 히다치 하이테크놀로지즈 하전 입자 빔 현미경
JP5744629B2 (ja) * 2011-06-03 2015-07-08 株式会社日立ハイテクノロジーズ 電子顕微鏡及び電子線を用いた撮像方法
JP6379018B2 (ja) * 2014-11-20 2018-08-22 株式会社日立ハイテクノロジーズ 荷電粒子線装置および検査方法

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