JP2016096334A - 電気的接続構造と製造方法 - Google Patents
電気的接続構造と製造方法 Download PDFInfo
- Publication number
- JP2016096334A JP2016096334A JP2015215577A JP2015215577A JP2016096334A JP 2016096334 A JP2016096334 A JP 2016096334A JP 2015215577 A JP2015215577 A JP 2015215577A JP 2015215577 A JP2015215577 A JP 2015215577A JP 2016096334 A JP2016096334 A JP 2016096334A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- electrical connection
- copper
- connection structure
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 117
- 239000010949 copper Substances 0.000 claims abstract description 75
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 72
- 229910052802 copper Inorganic materials 0.000 claims abstract description 71
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 58
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims abstract description 32
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 32
- 238000000034 method Methods 0.000 claims abstract description 24
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 239000002184 metal Substances 0.000 claims abstract description 20
- 239000002131 composite material Substances 0.000 claims abstract description 16
- 238000009713 electroplating Methods 0.000 claims description 16
- 238000007740 vapor deposition Methods 0.000 claims description 10
- 238000004381 surface treatment Methods 0.000 claims description 9
- 239000003929 acidic solution Substances 0.000 claims description 5
- 239000002904 solvent Substances 0.000 claims description 4
- 239000013078 crystal Substances 0.000 claims description 3
- 238000005498 polishing Methods 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 229910000765 intermetallic Inorganic materials 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000002736 metal compounds Chemical class 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- -1 0.8 wt% gallium Chemical compound 0.000 description 1
- 241000080590 Niso Species 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- ZOMNIUBKTOKEHS-UHFFFAOYSA-L dimercury dichloride Chemical class Cl[Hg][Hg]Cl ZOMNIUBKTOKEHS-UHFFFAOYSA-L 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- CKHJYUSOUQDYEN-UHFFFAOYSA-N gallium(3+) Chemical compound [Ga+3] CKHJYUSOUQDYEN-UHFFFAOYSA-N 0.000 description 1
- 238000007542 hardness measurement Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- LAIZPRYFQUWUBN-UHFFFAOYSA-L nickel chloride hexahydrate Chemical compound O.O.O.O.O.O.[Cl-].[Cl-].[Ni+2] LAIZPRYFQUWUBN-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229940053662 nickel sulfate Drugs 0.000 description 1
- RRIWRJBSCGCBID-UHFFFAOYSA-L nickel sulfate hexahydrate Chemical compound O.O.O.O.O.O.[Ni+2].[O-]S([O-])(=O)=O RRIWRJBSCGCBID-UHFFFAOYSA-L 0.000 description 1
- 229940116202 nickel sulfate hexahydrate Drugs 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- UJFARQSHFFWJHD-UHFFFAOYSA-M sodium [4-[[2-[4-bromo-3-(3-chloro-5-cyanophenoxy)-2-fluorophenyl]acetyl]amino]-3-chlorophenyl]sulfonyl-propanoylazanide Chemical compound [Na+].ClC1=CC(S(=O)(=O)[N-]C(=O)CC)=CC=C1NC(=O)CC1=CC=C(Br)C(OC=2C=C(C=C(Cl)C=2)C#N)=C1F UJFARQSHFFWJHD-UHFFFAOYSA-M 0.000 description 1
- 239000001509 sodium citrate Substances 0.000 description 1
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/002—Alloys based on nickel or cobalt with copper as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/481—Internal lead connections, e.g. via connections, feedthrough structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/4827—Materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01028—Nickel [Ni]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01031—Gallium [Ga]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12944—Ni-base component
Abstract
【解決手段】
電気的接続構造は、第1銅層、第2銅層、該第1銅層と該第2銅層の間に配置される複合金属層を含み、該複合金属層は0.01重量%≦ガリウム≦20重量%、0.01重量%≦銅≦50重量%、30重量%≦ニッケル≦99.98重量%である。本発明は電気的接続構造の製造方法を更に提供し、(1)第1銅層と第2銅層を提供するステップ、(2)該第1銅層に第1ニッケル層を形成するステップ、(3)該第2銅層に第2ニッケル層を形成するステップ、(4)該第1ニッケル層にガリウム層を形成するステップ、(5)該第2ニッケル層と該ガリウム層を接触させて、熱圧着接合を行うことにより、前記該電気的接続構造を形成するステップ、を含む。
【選択図】図1
Description
11 第1銅層
12 第2銅層
21 第1ニッケル層
22 第2ニッケル層
31 ガリウム層
41 複合金属層
Claims (12)
- 電気的接続構造であって、
第1銅層と、
第2銅層と、
前記第1銅層と前記第2銅層の間に配置される複合金属層と、を含み、
前記複合金属層は0.01重量%≦ガリウム≦20重量%であり、0.01重量%≦銅≦50重量%であり、30重量%≦ニッケル≦99.98重量%である、電気的接続構造。 - 前記複合金属層は面心立方結晶構造を有する、請求項1に記載の電気的接続構造。
- 前記複合金属層は0.01〜10重量%のガリウム、0.01〜10重量%の銅と80〜99.98重量%のニッケルを含む、請求項1に記載の電気的接続構造。
- 電気的接続構造の製造方法であって、
第1銅層と第2銅層を提供するステップ(1)と
第1ニッケル層に前記第1銅層を形成するステップ(2)と、
第2ニッケル層に第2銅層を形成するステップ(3)と、
前記第1ニッケル層にガリウム層を形成するステップ(4)と、
前記第2ニッケル層と前記ガリウム層を接触させて、熱圧着接合を行うことにより、電気的接続構造を形成するステップ(5)、を含む、電気的接続構造の製造方法。 - ステップ(2)の前のステップで、前記第1銅層に対して表面処理を行うステップ(1a)を含む、請求項4に記載の電気的接続構造の製造方法。
- ステップ(3)の前のステップで、前記第2銅層に対して表面処理を行うステップ(1b)を含む、請求項4に記載の電気的接続構造の製造方法。
- 前記表面処理は、前記第1銅層または前記第2銅層を研磨、または酸性溶液と溶剤を用いて前記第1銅層または前記第2銅層を洗浄することである、請求項5または請求項6に記載の電気的接続構造の製造方法。
- ステップ(2)は、電気めっきまたは蒸着法を用いて前記第1ニッケル層を形成することである、請求項4に記載の電気的接続構造の製造方法。
- ステップ(3)は、電気めっきまたは蒸着法を用いて前記第2ニッケル層を形成することである、請求項4に記載の電気的接続構造の製造方法。
- ステップ(4)は、電気めっきまたは蒸着法を用いて前記ガリウム層を形成することである、請求項4に記載の電気的接続構造の製造方法。
- ステップ(5)の熱圧着接合における温度は300-400℃であり、圧力は4-8バールである、請求項4に記載の電気的接続構造の製造方法。
- 前記第1ニッケル層、前記第2ニッケル層と前記ガリウム層の厚さの比は0.5〜20:0.5〜20:0.01〜5である、請求項4に記載の電気的接続構造の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103138070 | 2014-11-03 | ||
TW103138070A TWI667758B (zh) | 2014-11-03 | 2014-11-03 | 電性連接結構及其製備方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016096334A true JP2016096334A (ja) | 2016-05-26 |
JP6290156B2 JP6290156B2 (ja) | 2018-03-07 |
Family
ID=55851657
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015215577A Active JP6290156B2 (ja) | 2014-11-03 | 2015-11-02 | 電気的接続構造と製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US10213986B2 (ja) |
JP (1) | JP6290156B2 (ja) |
CN (1) | CN105575929B (ja) |
TW (1) | TWI667758B (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10032702B2 (en) * | 2016-12-09 | 2018-07-24 | Dyi-chung Hu | Package structure and manufacturing method thereof |
CN112867239A (zh) * | 2021-01-12 | 2021-05-28 | 深圳市鑫诺诚科技有限公司 | 一种超厚、低电阻铜箔材料 |
CN113471163B (zh) * | 2021-07-23 | 2023-06-20 | 重庆平创半导体研究院有限责任公司 | 一种晶圆互连结构及工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01220840A (ja) * | 1988-02-29 | 1989-09-04 | Nec Corp | 半導体素子の接続構造 |
JP2001501256A (ja) * | 1996-10-01 | 2001-01-30 | シーメンス アクチエンゲゼルシヤフト | ニッケル基合金及びその製品 |
JP2011166066A (ja) * | 2010-02-15 | 2011-08-25 | Napura:Kk | 電子デバイスの製造方法 |
JP2012506628A (ja) * | 2008-10-21 | 2012-03-15 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | 基板上にはんだ堆積物を形成する方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4785137A (en) * | 1984-04-30 | 1988-11-15 | Allied Corporation | Novel nickel/indium/other metal alloy for use in the manufacture of electrical contact areas of electrical devices |
US5519192A (en) * | 1995-01-17 | 1996-05-21 | Cardell Corporation | Method and apparatus for inductively soldering electrical connector elements |
US5964966A (en) * | 1997-09-19 | 1999-10-12 | Lockheed Martin Energy Research Corporation | Method of forming biaxially textured alloy substrates and devices thereon |
JP2002134806A (ja) * | 2000-10-19 | 2002-05-10 | Canon Inc | 圧電膜型アクチュエータおよび液体噴射ヘッドとその製造方法 |
US8981211B2 (en) * | 2008-03-18 | 2015-03-17 | Zetta Research and Development LLC—AQT Series | Interlayer design for epitaxial growth of semiconductor layers |
EP2285926A1 (de) | 2008-12-05 | 2011-02-23 | Tesa Se | Verstreckte thermoplaste zur verklebung von metallteilen auf kunststoffen, gläsern und metallen und verfahren zu ihrer herstellung |
-
2014
- 2014-11-03 TW TW103138070A patent/TWI667758B/zh active
-
2015
- 2015-11-02 JP JP2015215577A patent/JP6290156B2/ja active Active
- 2015-11-03 CN CN201510735735.3A patent/CN105575929B/zh not_active Expired - Fee Related
- 2015-11-03 US US14/930,768 patent/US10213986B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01220840A (ja) * | 1988-02-29 | 1989-09-04 | Nec Corp | 半導体素子の接続構造 |
JP2001501256A (ja) * | 1996-10-01 | 2001-01-30 | シーメンス アクチエンゲゼルシヤフト | ニッケル基合金及びその製品 |
JP2012506628A (ja) * | 2008-10-21 | 2012-03-15 | アトテツク・ドイチユラント・ゲゼルシヤフト・ミツト・ベシユレンクテル・ハフツング | 基板上にはんだ堆積物を形成する方法 |
JP2011166066A (ja) * | 2010-02-15 | 2011-08-25 | Napura:Kk | 電子デバイスの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN105575929A (zh) | 2016-05-11 |
CN105575929B (zh) | 2018-06-08 |
JP6290156B2 (ja) | 2018-03-07 |
TWI667758B (zh) | 2019-08-01 |
TW201618260A (zh) | 2016-05-16 |
US10213986B2 (en) | 2019-02-26 |
US20160121582A1 (en) | 2016-05-05 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106663663B (zh) | 接合体及其制造方法、自带散热器的功率模块用基板及其制造方法、散热器及其制造方法 | |
JP6290156B2 (ja) | 電気的接続構造と製造方法 | |
JP2014199852A (ja) | 接合方法及び半導体モジュールの製造方法 | |
KR102118271B1 (ko) | 세라믹스/알루미늄 접합체, 절연 회로 기판, 파워 모듈, led 모듈, 열전 모듈 | |
EP3196930B1 (en) | Bonded body, power module substrate with heat sink, use of the bonded body as a heat sink, method for manufacturing bonded body | |
TW201816952A (zh) | 功率模組用基板 | |
Wang et al. | Novel transient liquid phase bonding method using In-coated Cu sheet for high-temperature die attach | |
JP2019153415A (ja) | 異方導電性部材、異方導電性部材の製造方法、および接合体の製造方法 | |
CN102324409B (zh) | 具有散热结构的半导体封装及其制造方法 | |
JP2013166998A (ja) | 無電解Niめっき被膜を有する構造物、半導体ウェハ及びその製造方法 | |
TW201349368A (zh) | 半導體裝置及其製造方法 | |
Tian et al. | Copper pulse-reverse current electrodeposition to fill blind vias for 3-D TSV integration | |
Osborn et al. | Electroless copper deposition with PEG suppression for all-copper flip-chip connections | |
JP6787662B2 (ja) | シールリング、電子部品収納用パッケージ、電子デバイスおよびこれらの製造方法 | |
Shahane et al. | Modeling, design and demonstration of low-temperature, low-pressure and high-throughput thermocompression bonding of copper interconnections without solders | |
CN102244062A (zh) | 半导体封装结构以及半导体封装工艺 | |
Lin et al. | Microvia Filling with Nickel-Tungsten Alloy to Decrease the Coefficient of Thermal Expansion of Electronic Circuit Interconnections | |
US20140061921A1 (en) | Gold bonding in semiconductor devices using porous gold | |
TWM481486U (zh) | 倒裝封裝裝置 | |
US10461050B2 (en) | Bonding pad structure of a semiconductor device | |
TW201230265A (en) | Package structure, packaging substrate and chip | |
Lu et al. | Through-silicon via submount for flip-chip LEDs | |
KR102535483B1 (ko) | 금속 전해도금막을 이용한 구리 대 구리 직접 접합 방법, 이를 이용한 웨이퍼 레벨 패키징 방법 및 이를 이용하여 제조된 반도체 소자 | |
Zenin et al. | Coatings of contact areas of crystals and the traverse of packages for microwelding of internal outputs of 3D wares | |
CN219642826U (zh) | 一种高温厚膜hic电源用多层金属过渡片 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20160725 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160906 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161130 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20170606 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20171005 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20171016 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20180109 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20180207 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6290156 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |