JP2016088993A5 - - Google Patents

Download PDF

Info

Publication number
JP2016088993A5
JP2016088993A5 JP2014223126A JP2014223126A JP2016088993A5 JP 2016088993 A5 JP2016088993 A5 JP 2016088993A5 JP 2014223126 A JP2014223126 A JP 2014223126A JP 2014223126 A JP2014223126 A JP 2014223126A JP 2016088993 A5 JP2016088993 A5 JP 2016088993A5
Authority
JP
Japan
Prior art keywords
acid
epoxy resin
flux
hydroxycarboxylic
hydroxycarboxylic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014223126A
Other languages
English (en)
Japanese (ja)
Other versions
JP6374298B2 (ja
JP2016088993A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2014223126A external-priority patent/JP6374298B2/ja
Priority to JP2014223126A priority Critical patent/JP6374298B2/ja
Priority to PCT/JP2015/079026 priority patent/WO2016067919A1/ja
Priority to KR1020177014328A priority patent/KR20170077187A/ko
Priority to CN201580059362.0A priority patent/CN107109071A/zh
Priority to US15/522,883 priority patent/US10160827B2/en
Priority to EP15855383.4A priority patent/EP3214138A4/en
Priority to TW104134164A priority patent/TWI668259B/zh
Publication of JP2016088993A publication Critical patent/JP2016088993A/ja
Publication of JP2016088993A5 publication Critical patent/JP2016088993A5/ja
Publication of JP6374298B2 publication Critical patent/JP6374298B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014223126A 2014-10-31 2014-10-31 フラックス及びフラックスを用いた接合方法 Active JP6374298B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2014223126A JP6374298B2 (ja) 2014-10-31 2014-10-31 フラックス及びフラックスを用いた接合方法
US15/522,883 US10160827B2 (en) 2014-10-31 2015-10-14 Resin composition and flux
KR1020177014328A KR20170077187A (ko) 2014-10-31 2015-10-14 수지 조성물 및 플럭스
CN201580059362.0A CN107109071A (zh) 2014-10-31 2015-10-14 树脂组合物及助焊剂
PCT/JP2015/079026 WO2016067919A1 (ja) 2014-10-31 2015-10-14 樹脂組成物及びフラックス
EP15855383.4A EP3214138A4 (en) 2014-10-31 2015-10-14 Resin composition and flux
TW104134164A TWI668259B (zh) 2014-10-31 2015-10-19 Resin composition and flux

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014223126A JP6374298B2 (ja) 2014-10-31 2014-10-31 フラックス及びフラックスを用いた接合方法

Publications (3)

Publication Number Publication Date
JP2016088993A JP2016088993A (ja) 2016-05-23
JP2016088993A5 true JP2016088993A5 (https=) 2017-06-01
JP6374298B2 JP6374298B2 (ja) 2018-08-15

Family

ID=55857260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014223126A Active JP6374298B2 (ja) 2014-10-31 2014-10-31 フラックス及びフラックスを用いた接合方法

Country Status (7)

Country Link
US (1) US10160827B2 (https=)
EP (1) EP3214138A4 (https=)
JP (1) JP6374298B2 (https=)
KR (1) KR20170077187A (https=)
CN (1) CN107109071A (https=)
TW (1) TWI668259B (https=)
WO (1) WO2016067919A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111655421B (zh) * 2018-01-16 2022-07-26 千住金属工业株式会社 助焊剂和焊膏
WO2021161963A1 (ja) * 2020-02-12 2021-08-19 昭和電工マテリアルズ株式会社 導電性接着剤組成物、及び、接続構造体を製造する方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2646394B2 (ja) 1989-06-15 1997-08-27 千住金属工業株式会社 水溶性はんだ付け用フラックス
US4988395A (en) 1989-01-31 1991-01-29 Senju Metal Industry Co., Ltd. Water-soluble soldering flux and paste solder using the flux
US5177134A (en) 1990-12-03 1993-01-05 Motorola, Inc. Tacking agent
CA2196024A1 (en) * 1996-02-28 1997-08-28 Craig N. Ernsberger Multilayer electronic assembly utilizing a sinterable composition and related method of forming
US7037399B2 (en) * 2002-03-01 2006-05-02 National Starch And Chemical Investment Holding Corporation Underfill encapsulant for wafer packaging and method for its application
US20060194064A1 (en) 2002-03-01 2006-08-31 Xiao Allison Y Underfill encapsulant for wafer packaging and method for its application
JP4211828B2 (ja) 2006-09-12 2009-01-21 株式会社日立製作所 実装構造体
CN101062536A (zh) * 2007-06-01 2007-10-31 中南大学 无铅焊锡用无卤素免清洗助焊剂
JP5842084B2 (ja) * 2010-09-27 2016-01-13 パナソニックＩｐマネジメント株式会社 半導体部品実装基板
JP5588287B2 (ja) * 2010-09-27 2014-09-10 パナソニック株式会社 熱硬化性樹脂組成物及び半導体部品実装基板
JP4897932B1 (ja) * 2011-05-25 2012-03-14 ハリマ化成株式会社 はんだペースト用フラックスおよびはんだペースト
JP5853146B2 (ja) * 2011-08-24 2016-02-09 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物及び回路基板
JP2013256584A (ja) * 2012-06-12 2013-12-26 Panasonic Corp 熱硬化性樹脂組成物およびフラックス組成物とそれを用いた半導体装置

Similar Documents

Publication Publication Date Title
MY193426A (en) Adhesive for temporary bonding, adhesive layer, wafer work piece and method for manufacturing semiconductor device using same, rework solvent, polyimide copolymer, polyimide mixed resin, and resin composition
JP2019526717A5 (https=)
MY205097A (en) High reliability lead-free solder alloys for harsh environment electronics applications
PH12017500372A1 (en) Conductive adhesive composition
MX2017000726A (es) Composiciones aglutinantes mejoradas y usos de las mismas.
TW201614027A (en) Low dielectric adhesive composition
JP2015045848A5 (https=)
MY183244A (en) Solder paste and solder joint
PH12016502152B1 (en) Lead-free solder alloy
MX2017008136A (es) Sal de l-tartrato de pridopidina.
JP2015182125A5 (https=)
HK1255163A1 (zh) 作为apj受体激动剂的杂芳基羟基嘧啶酮
MY190140A (en) Electrically conductive adhesive film and dicing die bonding film
JP2016513744A5 (https=)
EP4509622A3 (en) High reliability lead-free solder alloys for harsh environment electronics applications
JP2016088993A5 (https=)
WO2017196953A8 (en) Polysulfonamide redistribution compositions and methods of their use
WO2013105813A3 (ko) 전자소자용 절연재
JP2015030778A5 (https=)
JP2015180726A5 (https=)
WO2016081936A3 (en) Presintered brazing
SG11202004069QA (en) High reliability lead-free solder alloy for electronic applications in extreme environments
JP2016088993A (ja) 樹脂組成物及びフラックス
SA518391663B1 (ar) استخدام حمض أميني كربوكسيلي معين لتقييد تكون و/ أو تكتل هيدرات الغاز
CN104312515B (zh) 提高压电蜂鸣器焊接点强度的方法