JP2016087713A5 - - Google Patents

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Publication number
JP2016087713A5
JP2016087713A5 JP2014221600A JP2014221600A JP2016087713A5 JP 2016087713 A5 JP2016087713 A5 JP 2016087713A5 JP 2014221600 A JP2014221600 A JP 2014221600A JP 2014221600 A JP2014221600 A JP 2014221600A JP 2016087713 A5 JP2016087713 A5 JP 2016087713A5
Authority
JP
Japan
Prior art keywords
polishing
wafer
surface plate
detection sensor
head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014221600A
Other languages
English (en)
Japanese (ja)
Other versions
JP6141814B2 (ja
JP2016087713A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2014221600A external-priority patent/JP6141814B2/ja
Priority to JP2014221600A priority Critical patent/JP6141814B2/ja
Priority to US15/512,939 priority patent/US10414017B2/en
Priority to KR1020177010046A priority patent/KR102318648B1/ko
Priority to SG11201702302QA priority patent/SG11201702302QA/en
Priority to PCT/JP2015/004842 priority patent/WO2016067518A1/ja
Priority to DE112015004589.9T priority patent/DE112015004589T5/de
Priority to CN201580059114.6A priority patent/CN107107308B/zh
Priority to TW104134404A priority patent/TWI633972B/zh
Publication of JP2016087713A publication Critical patent/JP2016087713A/ja
Publication of JP2016087713A5 publication Critical patent/JP2016087713A5/ja
Publication of JP6141814B2 publication Critical patent/JP6141814B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014221600A 2014-10-30 2014-10-30 研磨装置 Active JP6141814B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2014221600A JP6141814B2 (ja) 2014-10-30 2014-10-30 研磨装置
CN201580059114.6A CN107107308B (zh) 2014-10-30 2015-09-24 研磨装置
KR1020177010046A KR102318648B1 (ko) 2014-10-30 2015-09-24 연마장치
SG11201702302QA SG11201702302QA (en) 2014-10-30 2015-09-24 Polishing apparatus
PCT/JP2015/004842 WO2016067518A1 (ja) 2014-10-30 2015-09-24 研磨装置
DE112015004589.9T DE112015004589T5 (de) 2014-10-30 2015-09-24 Poliervorrichtung
US15/512,939 US10414017B2 (en) 2014-10-30 2015-09-24 Polishing apparatus
TW104134404A TWI633972B (zh) 2014-10-30 2015-10-20 硏磨裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014221600A JP6141814B2 (ja) 2014-10-30 2014-10-30 研磨装置

Publications (3)

Publication Number Publication Date
JP2016087713A JP2016087713A (ja) 2016-05-23
JP2016087713A5 true JP2016087713A5 (enExample) 2017-05-18
JP6141814B2 JP6141814B2 (ja) 2017-06-07

Family

ID=55856888

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014221600A Active JP6141814B2 (ja) 2014-10-30 2014-10-30 研磨装置

Country Status (8)

Country Link
US (1) US10414017B2 (enExample)
JP (1) JP6141814B2 (enExample)
KR (1) KR102318648B1 (enExample)
CN (1) CN107107308B (enExample)
DE (1) DE112015004589T5 (enExample)
SG (1) SG11201702302QA (enExample)
TW (1) TWI633972B (enExample)
WO (1) WO2016067518A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10050008B1 (en) * 2017-01-24 2018-08-14 Asm Technology Singapore Pte Ltd Method and system for automatic bond arm alignment
JP7305178B2 (ja) * 2019-09-19 2023-07-10 株式会社ブイ・テクノロジー 研磨装置
JP7406980B2 (ja) * 2019-12-24 2023-12-28 株式会社荏原製作所 研磨ユニット、基板処理装置、および研磨方法
CN111805410A (zh) * 2020-06-01 2020-10-23 长江存储科技有限责任公司 研磨系统
US20220126418A1 (en) * 2020-10-26 2022-04-28 Illinois Tool Works Inc. Grinding/polishing systems and methods having proximity sensors
CN112692721B (zh) * 2020-12-23 2022-07-05 华虹半导体(无锡)有限公司 Cmp工艺晶圆定位装置和划痕追踪方法
CN113579989B (zh) * 2021-08-13 2024-01-26 西安奕斯伟材料科技股份有限公司 滑片检测装置和抛光系统

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5733171A (en) * 1996-07-18 1998-03-31 Speedfam Corporation Apparatus for the in-process detection of workpieces in a CMP environment
JP2716653B2 (ja) 1993-11-01 1998-02-18 不二越機械工業株式会社 ウェーハの研磨装置および研磨方法
US5938504A (en) * 1993-11-16 1999-08-17 Applied Materials, Inc. Substrate polishing apparatus
JPH08247721A (ja) * 1995-03-15 1996-09-27 Omron Corp 寸法測定装置
US20010012108A1 (en) * 1996-07-26 2001-08-09 Paul Holzapfel Methods and apparatus for the in-process measurement of thin film layers
JP3761673B2 (ja) * 1997-06-17 2006-03-29 株式会社荏原製作所 ポリッシング装置
US6045434A (en) * 1997-11-10 2000-04-04 International Business Machines Corporation Method and apparatus of monitoring polishing pad wear during processing
JP2000127033A (ja) * 1998-10-27 2000-05-09 Speedfam-Ipec Co Ltd 研磨装置
JP2001096455A (ja) * 1999-09-28 2001-04-10 Ebara Corp 研磨装置
JP2001133217A (ja) * 1999-11-05 2001-05-18 Keyence Corp 光学式変位計
JP2003059876A (ja) * 2001-08-16 2003-02-28 Ebara Corp 目的物の検知器及び検知方法、及びポリッシング装置
JP2006011434A (ja) * 2002-03-29 2006-01-12 Hoya Corp マスクブランク用基板、マスクブランクおよび転写用マスクの製造方法
DE10314212B4 (de) 2002-03-29 2010-06-02 Hoya Corp. Verfahren zur Herstellung eines Maskenrohlings, Verfahren zur Herstellung einer Transfermaske
CN100387396C (zh) * 2004-04-01 2008-05-14 上海宏力半导体制造有限公司 化学机械研磨机台滑片检测方法
JP2008093811A (ja) 2006-10-16 2008-04-24 Shin Etsu Handotai Co Ltd 研磨ヘッド及び研磨装置
JP5491273B2 (ja) * 2010-05-11 2014-05-14 ダイトエレクトロン株式会社 ウェーハの面取り装置
US9862070B2 (en) 2011-11-16 2018-01-09 Applied Materials, Inc. Systems and methods for substrate polishing end point detection using improved friction measurement
CN103831710B (zh) * 2012-11-27 2017-07-25 盛美半导体设备（上海）有限公司 具有晶圆检测装置的研磨头

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