JP2016085984A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2016085984A5 JP2016085984A5 JP2015211452A JP2015211452A JP2016085984A5 JP 2016085984 A5 JP2016085984 A5 JP 2016085984A5 JP 2015211452 A JP2015211452 A JP 2015211452A JP 2015211452 A JP2015211452 A JP 2015211452A JP 2016085984 A5 JP2016085984 A5 JP 2016085984A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive film
- anisotropic conductive
- conductive particles
- lattice points
- less
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002245 particle Substances 0.000 claims 39
- 230000001070 adhesive Effects 0.000 claims 9
- 239000000853 adhesive Substances 0.000 claims 9
- 238000004519 manufacturing process Methods 0.000 claims 8
- 238000000034 method Methods 0.000 claims 6
- 238000004220 aggregation Methods 0.000 claims 3
- 230000002776 aggregation Effects 0.000 claims 3
- 230000014509 gene expression Effects 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 230000000875 corresponding Effects 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014219790 | 2014-10-28 | ||
| JP2014219790 | 2014-10-28 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020088028A Division JP7067586B2 (ja) | 2014-10-28 | 2020-05-20 | 異方性導電フィルム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016085984A JP2016085984A (ja) | 2016-05-19 |
| JP2016085984A5 true JP2016085984A5 (hu) | 2018-11-29 |
| JP6707835B2 JP6707835B2 (ja) | 2020-06-10 |
Family
ID=55973228
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015211452A Active JP6707835B2 (ja) | 2014-10-28 | 2015-10-28 | 異方性導電フィルム |
| JP2020088028A Active JP7067586B2 (ja) | 2014-10-28 | 2020-05-20 | 異方性導電フィルム |
| JP2022074596A Active JP7348563B2 (ja) | 2014-10-28 | 2022-04-28 | 異方性導電フィルム |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020088028A Active JP7067586B2 (ja) | 2014-10-28 | 2020-05-20 | 異方性導電フィルム |
| JP2022074596A Active JP7348563B2 (ja) | 2014-10-28 | 2022-04-28 | 異方性導電フィルム |
Country Status (1)
| Country | Link |
|---|---|
| JP (3) | JP6707835B2 (hu) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018006160A (ja) * | 2016-07-01 | 2018-01-11 | 古河電気工業株式会社 | 端子付き電線およびその製造方法 |
| US10957462B2 (en) | 2016-12-01 | 2021-03-23 | Dexerials Corporation | Anisotropic conductive film |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010008169A1 (en) | 1998-06-30 | 2001-07-19 | 3M Innovative Properties Company | Fine pitch anisotropic conductive adhesive |
| JP3694825B2 (ja) | 1999-11-18 | 2005-09-14 | 日本航空電子工業株式会社 | 導体パターンの形成方法及びコネクタ、フレキシブルプリント配線板、異方導電性部材 |
| JP4865144B2 (ja) | 2001-05-08 | 2012-02-01 | 旭化成株式会社 | 接着剤層への粒子の配置方法 |
| JP4130747B2 (ja) * | 2002-03-28 | 2008-08-06 | 旭化成エレクトロニクス株式会社 | 異方導電性接着シートおよびその製造方法 |
| JP2010033793A (ja) | 2008-07-28 | 2010-02-12 | Tokai Rubber Ind Ltd | 粒子転写膜の製造方法 |
-
2015
- 2015-10-28 JP JP2015211452A patent/JP6707835B2/ja active Active
-
2020
- 2020-05-20 JP JP2020088028A patent/JP7067586B2/ja active Active
-
2022
- 2022-04-28 JP JP2022074596A patent/JP7348563B2/ja active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2016092004A5 (hu) | ||
| JP2016103476A5 (hu) | ||
| JP6494695B2 (ja) | 異方性導電フィルム、接続構造体、及び接続構造体の製造方法 | |
| JP6024623B2 (ja) | 異方性導電フィルム及びその製造方法 | |
| JP2020202185A5 (hu) | ||
| JP6190528B2 (ja) | 導電性接着フィルム、プリント回路基板、及び、電子機器 | |
| US20170309590A1 (en) | Anisotropic conductive film and connection structure | |
| JP2016131245A5 (hu) | ||
| WO2015056518A1 (ja) | 異方性導電フィルム | |
| KR102326117B1 (ko) | 이방성 도전 필름, 그 제조 방법, 및 접속 구조체 | |
| CN107431294A (zh) | 各向异性导电性膜及连接构造体 | |
| JP2015146379A5 (ja) | 接続体、接続体の製造方法、電子機器 | |
| JP2011082346A5 (hu) | ||
| JP2016085984A5 (hu) | ||
| JP2015198350A5 (hu) | ||
| JP6435627B2 (ja) | 異方性導電フィルム及びその製造方法 | |
| JP2016131242A5 (hu) | ||
| JP2022097589A (ja) | 異方性導電フィルム | |
| TW201947614A (zh) | 異向性導電膜、連接結構體、及連接結構體之製造方法 | |
| JP2016085986A5 (hu) | ||
| JP2016085987A5 (hu) | ||
| JP2017175092A5 (hu) | ||
| JP2016085985A5 (hu) | ||
| WO2013064592A3 (en) | Wafer scale technique for interconnecting vertically stacked semiconductor dies | |
| JP2023001188A5 (hu) |