JP2016085182A - Electronic device, electronic apparatus and movable body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic device capable of reducing a reduction in detection accuracy of physical quantity, and further to provide an electronic apparatus and a movable body.SOLUTION: An electronic device 1 includes: a vibration element 6 having a detection signal electrode and a driving signal electrode; an IC 3 disposed so as to face the vibration element 6; first wiring being positioned between the IC 3 and the vibration element 6 and electrically connected to the driving signal electrode; and shield wiring 742 being positioned closer to a vibration element 6 side than the first wiring and electrically connected to constant potential (ground).SELECTED DRAWING: Figure 6

Description

  The present invention relates to an electronic device, an electronic apparatus, and a moving object.

  Conventionally, an electronic device as disclosed in Patent Document 1 is known as an electronic device for detecting angular velocity. The electronic device described in Patent Literature 1 is electrically connected to a semiconductor substrate, a stress relaxation layer disposed on the active surface side of the semiconductor substrate, a wiring disposed on the stress relaxation layer, and the wiring. And a vibration element provided on the stress relaxation layer. Thus, by arranging the vibration element on the semiconductor substrate via the stress relaxation layer, the height of the electronic device can be reduced. However, in such an electronic device, a capacitance is generated between the electrode of the vibration element and the wiring on the stress relaxation layer, and noise due to this is generated. For this reason, the electronic device disclosed in Patent Document 1 has a problem in that the detection accuracy of the angular velocity is lowered.

JP 2012-79751 A

  An object of the present invention is to provide an electronic device, an electronic apparatus, and a moving body that can reduce a decrease in detection accuracy of a physical quantity.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

[Application Example 1]
An electronic device according to this application example includes a vibrating element, and a vibrating element having an electrode disposed on the vibrating body,
A substrate disposed opposite to the vibration element;
A first wiring located between the substrate and the vibration element and electrically connected to a different potential from the electrode;
It has a 1st shield wiring located in the vibration element side rather than the 1st wiring, and being electrically connected to constant potential.
Thereby, the electronic device which can reduce the fall of the detection accuracy of a physical quantity can be provided.

[Application Example 2]
In the electronic device of this application example, the vibrating body includes a driving vibration unit and a detection vibration unit,
A drive signal electrode electrically connected to the first wiring is disposed on the drive vibration unit,
It is preferable that a detection signal electrode as the electrode is disposed in the detection vibration unit.
Thereby, mixing of noise into the detection signal electrode and the drive signal electrode is reduced.

[Application Example 3]
In the electronic device of this application example, the vibrating body includes a driving vibration unit and a detection vibration unit,
In the drive vibration unit, a drive signal electrode as the electrode is disposed,
It is preferable that a detection signal electrode electrically connected to the first wiring is disposed on the detection vibration unit.
Thereby, mixing of noise into the detection signal electrode and the drive signal electrode is reduced.

[Application Example 4]
In the electronic device of this application example, it is preferable that the first shield wiring is grounded.
This simplifies the device configuration.

[Application Example 5]
In the electronic device of this application example, a second wiring that is located closer to the substrate than the first wiring and is electrically connected to a different potential from the first wiring;
It is preferable to have a second shield wiring located between the first wiring and the second wiring and electrically connected to a constant potential.
Thereby, the fall of the detection accuracy of a physical quantity can be reduced more.

[Application Example 6]
An electronic apparatus according to this application example includes the electronic device according to the application example described above.
As a result, a highly reliable electronic device can be obtained.

[Application Example 7]
The moving body of this application example includes the electronic device of the above application example.
Thereby, a mobile body with high reliability is obtained.

It is sectional drawing which shows the electronic device concerning 1st Embodiment of this invention. It is sectional drawing of IC which the electronic device shown in FIG. 1 has. It is a top view of the vibration element which the electronic device shown in FIG. 1 has. It is a figure which shows electrode arrangement | positioning of the vibration element shown in FIG. 3, (a) is a top view, (b) is a permeation | transmission figure. It is a schematic diagram explaining operation | movement of the vibration element shown in FIG. It is sectional drawing of the stress relaxation layer which the electronic device shown in FIG. 1 has. It is a top view of the stress relaxation layer shown in FIG. It is a top view of the stress relaxation layer shown in FIG. It is sectional drawing for demonstrating the effect of shield wiring. It is sectional drawing of the stress relaxation layer which the electronic device which concerns on 2nd Embodiment of this invention has. It is a top view of the stress relaxation layer shown in FIG. It is a top view of the stress relaxation layer shown in FIG. It is a top view of the stress relaxation layer shown in FIG. It is sectional drawing for demonstrating the effect of shield wiring. It is sectional drawing of IC which the electronic device which concerns on 3rd Embodiment of this invention has. It is a top view of a vibration element which an electronic device concerning a 4th embodiment of the present invention has. It is a perspective view which shows the electronic device which concerns on 5th Embodiment of this invention. It is a top view of the electronic device shown in FIG. FIG. 18 is a plan view illustrating a modification of the electronic device illustrated in FIG. 17. FIG. 14 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer to which an electronic apparatus including the electronic device of the invention is applied. It is a perspective view which shows the structure of the mobile telephone (PHS is also included) to which the electronic device provided with the electronic device of this invention is applied. It is a perspective view which shows the structure of the digital still camera to which the electronic device provided with the electronic device of this invention is applied. It is a perspective view which shows the structure of the motor vehicle which applied the mobile body provided with the electronic device of this invention.

  Hereinafter, an electronic device, an electronic apparatus, and a moving body of the present invention will be described in detail based on embodiments shown in the accompanying drawings.

<First Embodiment>
FIG. 1 is a sectional view showing an electronic device according to the first embodiment of the present invention. FIG. 2 is a cross-sectional view of an IC included in the electronic device shown in FIG. FIG. 3 is a plan view of a vibration element included in the electronic device shown in FIG. 4A and 4B are diagrams showing the electrode arrangement of the vibration element shown in FIG. 3, in which FIG. 4A is a top view and FIG. FIG. 5 is a schematic diagram for explaining the operation of the vibration element shown in FIG. 3. 6 is a cross-sectional view of a stress relaxation layer included in the electronic device shown in FIG. 7 and 8 are plan views of the stress relaxation layer shown in FIG. 6, respectively. FIG. 9 is a cross-sectional view for explaining the effect of the shield wiring. In the following, for convenience of explanation, the upper side of FIG. 1 is also referred to as “upper side” and the lower side is also referred to as “lower side”. Further, as shown in FIG. 1, the three axes orthogonal to each other are assumed to be the X axis, the Y axis, and the Z axis, and the thickness direction of the electronic device coincides with the Z axis.

  The electronic device 1 shown in FIG. 1 is an angular velocity sensor that can detect an angular velocity ωz around the Z axis. Such an electronic device 1 is arranged on the package 2 having the accommodation space S therein, the IC 3 accommodated in the accommodation space S, the stress relaxation layer 7 disposed on the IC 3, and the stress relaxation layer 7. And a vibration element 6.

Hereinafter, each of these units will be described in order.
≪Package≫
The package 2 includes a box-shaped base 21 having a recess 211 opened on the upper surface, a plate-shaped lid 22 that closes the opening of the recess 211, and a seam ring that is interposed between the base 21 and the lid 22 and joins them. 23. The IC 3 and the vibration element 6 are housed in the housing space S formed by closing the opening of the recess 211 with the lid 22. The atmosphere of the accommodation space S is not particularly limited, but for example, a vacuum state (a reduced pressure state of 10 Pa or less) is set. Thereby, viscous resistance is reduced and the vibration element 6 can be driven efficiently.

-Base 21-
The base 21 has a substantially square plan view shape. The recess 211 has a first recess 211a that opens to the top surface of the base 21 and a second recess 211b that opens to the center of the first recess 211a except for the edge of the bottom surface. In addition, it does not specifically limit as a planar view shape of the base 21, For example, a rectangle and circular may be sufficient. Such a base 21 can be formed, for example, by sintering a laminate of a plurality of ceramic green sheets such as aluminum oxide, aluminum nitride, silicon carbide, mullite, glass / ceramic. .

  A plurality of internal terminals 241 electrically connected to the IC 3 via the bonding wires BW are arranged on the bottom surface of the first recess 211a, and a plurality of external terminals 242 are arranged on the bottom surface of the base 21. Yes. The internal terminal 241 and the external terminal 242 are electrically connected via an internal wiring (not shown) disposed on the base 21. The configuration of the internal terminal 241 and the external terminal 242 is not particularly limited. For example, the base layer made of tungsten (W), molybdenum (Mo), manganese (Mg), or the like is plated with gold (Au) or the like. It can be set as the structure which coat | covered the metal layer.

  The lid 22 has a plate shape and is joined to the upper surface of the base 21 through a seam ring 23. The constituent material of the lid 22 is not particularly limited, but for example, an alloy such as Kovar is preferably used. The lid 22 may be electrically connected to the ground wiring via the seam ring 23, for example. Thereby, the lid 22 can function as a shield part that blocks noise from the outside of the package 2.

≪IC≫
IC3 is fixed to the bottom surface of the second recess 211b with silver paste or the like. The IC 3 includes, for example, an interface unit 3 i that communicates with an external host device, and a drive / detection circuit 3 z that drives the vibration element 6 and detects an angular velocity ωz applied to the vibration element 6. .

  For example, as shown in FIG. 2, the IC 3 includes a silicon substrate (substrate) 31 having an active surface 311 provided with circuit elements such as transistors, and a wiring layer 32 stacked on the active surface 311 of the silicon substrate 31. And a passivation film 38 disposed on the wiring layer 32. The wiring layer 32 includes a first insulating layer 321 disposed on the silicon substrate 31, a first wiring layer 322 disposed on the first insulating layer 321, and the first insulating layer 321 and the first wiring layer 322. Second insulating layer 323 disposed on top, second wiring layer 324 disposed on second insulating layer 323, and third insulating layer 325 disposed on second insulating layer 323 and second wiring layer 324 A third wiring layer 326 disposed on the third insulating layer 325, a fourth insulating layer 327 disposed on the third insulating layer 325 and the third wiring layer 326, and a fourth insulating layer 327. The fourth wiring layer 328 is provided. However, the configuration of the wiring layer 32 is not limited to this. For example, the number of laminated insulating layers and wiring layers may be 3 or less, or 5 or more.

The IC 3 has a plurality of connection terminals 37 and 39 on the upper surface, the connection terminals 37 are electrically connected to the vibration element 6 via the stress relaxation layer 7, and the connection terminals 39 are connected via the bonding wires BW. Are electrically connected to the internal terminal 241. Accordingly, the IC 3 can transmit and receive signals to and from the vibration element 6 and can communicate with the host device via the external terminal 242. The communication method of IC3 is not particularly limited, and for example, SPI (registered trademark) (Serial Peripheral Interface) or I ² C (registered trademark) (Inter-Integrated Circuit) can be used. Further, the IC 3 may have a select function for selecting a communication method, and the communication method may be selected from SPI and I ² C. Thereby, it becomes the highly convenient electronic device 1 corresponding to a plurality of communication methods.

≪Vibration element≫
As shown in FIGS. 3 and 4, the vibrating element 6 includes a vibrating piece 60 made of crystal and an electrode on which the vibrating piece 60 is disposed. However, the material of the resonator element 60 is not limited to quartz, and for example, a piezoelectric material such as lithium tantalate or lithium niobate can also be used.

  The resonator element 60 has a plate shape having a spread in the xy plane defined by the x-axis (electrical axis) and the y-axis (mechanical axis) which are crystal axes of the crystal and having a thickness in the z-axis (optical axis) direction. There is no. Such a vibrating piece 60 includes a base 61, detection vibration arms 621 and 622 as a pair of detection vibration parts extending from the base 61 to both sides in the y-axis direction, and a pair extending from the base 61 to both sides in the x-axis direction. Connecting arms 631, 632, driving vibration arms 641, 642 as a pair of driving vibration parts extending from the tip of the connecting arm 631 to both sides in the y-axis direction, and from the tip of the connecting arm 632 to both sides in the y-axis direction Driving vibration arms 643 and 644 as a pair of extending driving vibration parts, a pair of support parts 651 and 652 that support the base part 61, and a pair of beam parts 661 and 662 that connect the support part 651 and the base part 61, And a pair of beam portions 663 and 664 for connecting the support portion 652 and the base portion 61 to each other. In such a vibrating piece 60, the vibrating body 600 is configured by the base 61, the detection vibrating arms 621 and 622, the connecting arms 631 and 632, and the driving vibrating arms 641 to 644.

  Further, grooves extending along the y-axis direction are formed on both main surfaces (upper surface and lower surface) of the detection vibrating arms 621 and 622, and the detection vibrating arms 621 and 622 have a substantially H-shaped cross-sectional shape. have. Further, a wide hammer head is provided at the tip of the detection vibration arms 621 and 622 and the drive vibration arms 641, 642, 643 and 644. Note that the configuration of the vibrating piece 60 is not limited to this. For example, the grooves may be omitted from the detection vibrating arms 621 and 622, or the detection vibrating arms 621 and 622 and the driving vibrating arms 641, 642, 643, The hammer head may be omitted from 644. Moreover, it is good also as a substantially H-shaped cross-sectional shape by forming a groove | channel in both main surfaces of the drive vibration arms 641, 642, 643, 644.

  Next, the electrodes disposed on the vibrating piece 60 will be described. As shown in FIG. 4, the electrodes are a detection signal electrode 671a and a detection signal terminal 671b, a detection ground electrode 672a and a detection ground terminal 672b, a drive signal electrode 673a and a drive signal terminal 673b, a drive ground electrode 674a and a drive ground. Terminal 674b. In FIG. 4, for convenience of explanation, the detection signal electrode 671a and the detection signal terminal 671b, the detection ground electrode 672a and the detection ground terminal 672b, the drive signal electrode 673a and the drive signal terminal 673b, the drive ground electrode 674a and the drive ground terminal 674b are shown. These are illustrated with different hatchings. In addition, electrodes, wirings, terminals, and the like formed on the side surface of the vibrating piece 60 are illustrated by bold lines.

-Drive signal electrode and drive signal terminal-
The drive signal electrode 673a is disposed on the upper and lower surfaces of the drive vibration arms 641 and 642 and on both side surfaces of the drive vibration arms 643 and 644. Such a drive signal electrode 673a is an electrode for exciting the drive vibration of the drive vibration arms 641 to 644.

  The drive signal terminal 673b is disposed at an end portion of the support portion 652 on the −X axis side. The drive signal terminal 673b is electrically connected to the drive signal electrode 673a disposed on the drive vibrating arms 641 to 644 via the drive signal wiring disposed on the beam portion 664.

-Drive ground electrode and drive ground terminal-
The drive ground electrode 674a is disposed on the upper and lower surfaces of the drive vibration arms 643 and 644 and on both side surfaces of the drive vibration arms 641 and 642. Such a driving ground electrode 674a has a constant potential (reference potential) with respect to the driving signal electrode 673a.

  The drive ground terminal 674b is disposed at the end of the support portion 651 on the −X axis side. The drive ground terminal 674b is electrically connected to the drive ground electrode 674a disposed on the drive vibrating arms 641 to 644 via the drive ground wiring disposed on the beam portion 662.

  By arranging the drive signal electrode 673a and the drive signal terminal 673b, the drive ground electrode 674a and the drive ground terminal 674b in this way, by applying a drive signal between the drive signal terminal 673b and the drive ground terminal 674b, An electric field is generated between the drive signal electrode 673a and the drive ground electrode 674a disposed on the drive vibration arms 641 to 644, and the drive vibration arms 641 to 644 can be driven to vibrate.

-Detection signal electrode and detection signal terminal-
The detection signal electrode 671a is disposed on the upper and lower surfaces (inner surfaces of the grooves) of the detection vibrating arms 621 and 622. Such a detection signal electrode 671a is an electrode for detecting charges generated by the detection vibration when the detection vibration of the detection vibration arms 621 and 622 is excited.

  One detection signal terminal 671b is disposed on each of the support portions 651 and 652. The detection signal terminal 671b disposed in the support portion 651 is disposed at the end of the support portion 651 on the + x axis side, and is disposed on the detection vibration arm 621 via the detection signal wiring formed on the beam portion 661. The detection signal electrode 671a is electrically connected. On the other hand, the detection signal terminal 671b disposed in the support portion 652 is disposed at the end of the support portion 652 on the + X axis side, and is connected to the detection vibration arm 622 via the detection signal wiring disposed in the beam portion 663. It is electrically connected to the arranged detection signal electrode 671a.

-Detection ground electrode and detection ground terminal-
The detection ground electrode 672a is disposed on both side surfaces of the detection vibrating arms 621 and 622. Such a detection ground electrode 672a has a constant potential (reference potential) with respect to the detection signal electrode 671a.

  The detection ground terminal 672b is disposed on the support portions 651 and 652, respectively. The detection ground terminal 672 b disposed on the support portion 651 is disposed at the center of the support portion 651, and the detection ground disposed on the detection vibration arm 621 via the detection ground wiring disposed on the beam portion 662. The electrode 672a is electrically connected. On the other hand, the detection ground terminal 672b disposed in the support portion 652 is disposed in the center portion of the support portion 652, and is disposed in the detection vibration arm 622 via the detection ground wiring disposed in the beam portion 664. The detection ground electrode 672a is electrically connected.

  As described above, the detection vibration generated in the detection vibration arm 621 is arranged in the detection vibration arm 621 by arranging the detection signal electrode 671a and the detection signal terminal 671b and the detection ground electrode 672a and the detection ground terminal 672b. It appears as a charge between the detection signal electrode 671a and the detection ground electrode 672a, and can be taken out as a signal from between the detection signal terminal 671b and the detection ground terminal 672b arranged on the support portion 651. Further, the detection vibration generated in the detection vibration arm 622 appears as a charge between the detection signal electrode 671a and the detection ground electrode 672a disposed on the detection vibration arm 622, and the detection signal terminal 671b disposed on the support portion 652 and It can be taken out as a signal from between the detection ground terminal 672b.

  The configuration of the electrode as described above is not particularly limited as long as it has conductivity. For example, Ni (nickel), Au (metal) layer such as Cr (chromium), W (tungsten), etc. (Gold), Ag (silver), Cu (copper), etc. can be comprised by the metal film which laminated | stacked each film.

  Such a vibration element 6 is fixed to the stress relaxation layer 7 at the support portions 651 and 652. Further, the vibration element 6 is fixed to the stress relaxation layer 7 by using a conductive fixing member (connection member) 8, and the vibration element 6 and the IC 3 are interposed via the fixing member 8 and the stress relaxation layer 7. And are electrically connected. The fixing member 8 is not particularly limited, and for example, a metal brazing material, a metal bump, a conductive adhesive, or the like can be used.

Next, the operation of the vibration element 6 will be described.
When an electric field is generated between the drive signal electrode 673a and the drive ground electrode 674a by applying a drive signal between the drive signal terminal 673b and the drive ground terminal 674b in a state where no angular velocity is applied to the vibration element 6, FIG. As shown in FIG. 5A, each drive vibration arm 641, 642, 643, 644 performs bending vibration in the direction indicated by the arrow A. At this time, since the drive vibration arms 641 and 642 and the drive vibration arms 643 and 644 are oscillating symmetrically with respect to the base 61, the detection vibration arms 621 and 622 hardly vibrate.

  When an angular velocity ωz is applied to the vibration element 6 in a state where this drive vibration is performed, a detection vibration as shown in FIG. 5B is excited. Specifically, the Coriolis force in the direction of arrow B acts on the drive vibrating arms 641 to 644 and the connecting arms 631 and 632 to excite new vibration. In response to the vibration of the arrow B, the detection vibration in the direction of the arrow C is excited in the detection vibration arms 621 and 622. The electric charges generated in the detection vibrating arms 621 and 622 by this vibration are taken out as signals from the detection signal electrode 671a and the detection ground electrode 672a, and transmitted to the IC 3 from between the detection signal terminal 671b and the detection ground terminal 672b. Then, the angular velocity ωz is obtained by processing this signal by the IC 3.

≪Stress relaxation layer≫
As shown in FIG. 6, the stress relaxation layer 7 is located between the IC 3 and the vibration element 6 and is provided on the upper surface of the IC 3. By providing the stress relaxation layer 7, the impact received by the package 2 is reduced, and the impact is hardly transmitted to the vibration element 6. Further, the stress generated due to the difference in thermal expansion between the IC 3 and the vibration element 6 is relieved, and the vibration element 6 becomes difficult to bend. Therefore, the mechanical strength of the electronic device 1 can be increased, and the angular velocity ωz can be detected with higher accuracy.

  Such a stress relaxation layer 7 includes a first insulating layer 71 laminated on the upper surface of the IC 3 (on the passivation film 38), a first wiring layer 72 disposed on the first insulating layer 71, and a first insulating layer. 71 and the second wiring layer 74 disposed on the second insulating layer 73 and the second insulating layer 73 disposed on the first wiring layer 72.

  Further, the first and second insulating layers 71 and 73 each have elasticity. Therefore, the impact as described above can be reduced. Although it does not specifically limit as a constituent material of such 1st, 2nd insulating layers 71 and 73, For example, a polyimide, a silicone modified polyimide resin, an epoxy resin, a silicone modified epoxy resin, an acrylic resin, a phenol resin, a silicone resin, modified | denatured Resin materials such as polyimide resin, benzocyclobutene, and polybenzoxazole can be used. Thereby, the 1st, 2nd insulating layers 71 and 73 which have sufficient elasticity can be formed, and said effect can be exhibited more reliably.

  In addition, as shown in FIG. 7, the second wiring layer 74 includes six terminals (connection electrodes) 671 b to 674 b arranged on the support portions 651 and 652 of the vibration element 6. Connection pad) 741. The vibration element 6 is fixed to each terminal 741 through the fixing member 8. On the other hand, as shown in FIG. 8, the first wiring layer 72 has a wiring part 721 that electrically connects each terminal 741 of the second wiring layer 74 and the connection terminal 37 of the IC 3. Thereby, the IC 3 and the vibration element 6 are electrically connected via the fixing member 8 and the stress relaxation layer 7, and signals can be transmitted and received between them. Thus, the first and second wiring layers 72 and 74 function as wiring (rearrangement wiring) for electrically connecting the IC 3 and the vibration element 6. Therefore, for example, the connection terminal 37 of the IC 3 can be freely arranged without considering the positions of the terminals 671 b to 674 b of the vibration element 6. Therefore, the degree of freedom in designing the electronic device 1 is improved.

  Further, the second wiring layer 74 has a shield wiring (first shield wiring) 742 in addition to the terminal 741. The shield wiring 742 extends over the second insulating layer 73 as long as the arrangement of the terminals 741 is not hindered. Further, the shield wiring 742 is electrically connected to a constant potential, in particular, the ground in this embodiment. Here, the constant potential means a ground potential or a potential fixed to a constant potential. Such a shield wiring 742 is located between the vibration element 6 and the wiring portion 721 and is capacitively coupled between the electrode of the vibration element 6 and the wiring portion 721 (between the electrode of the vibration element 6 and the wiring portion 721. Function as a shield layer. Therefore, by arranging the shield wiring 742, the S / N ratio is improved, and the electronic device 1 can detect the angular velocity with higher accuracy. Further, even when the noise has temperature characteristics, this noise situation can be reduced, so that the electronic device 1 having excellent temperature characteristics is obtained.

  More specifically, as shown in FIG. 9A, the detection signal electrode 671a included in the vibration element 6 and the wiring that the first wiring layer 72 includes and is electrically connected to the drive signal terminal 673b. The shield wiring 742 is disposed between the portion (first wiring) 721a. For this reason, the mixing of noise from the wiring portion 721a to the detection signal electrode 671a is reduced, and a more accurate detection signal can be transmitted to the IC3. Similarly, as shown in FIG. 9B, the drive signal electrode 673a included in the vibration element 6 and the first wiring layer 72 included in the wiring portion (the first wiring portion electrically connected to the detection signal terminal 671b). Shield wiring 742 is arranged between the wiring 721b. Therefore, mixing of noise from the drive signal electrode 673a to the wiring portion 721b is reduced, and a more accurate detection signal can be transmitted to the IC3. Thus, by arranging the shield wiring 742, the electronic device 1 can detect the angular velocity with higher accuracy.

  Here, the method of connecting the shield wiring 742 to the ground is not particularly limited. For example, you may electrically connect with the ground wiring contained in IC3. According to this method, since the wiring originally arranged on the IC 3 can be used, it is effective in that the apparatus is not complicated (enlarged).

  As another method, a dedicated wiring for connecting the shield wiring 742 to the ground is provided on the upper surface (fourth wiring layer 328) of the IC 3, and the shield wiring 742 is electrically connected to the dedicated wiring and the dedicated wiring. And the ground internal terminal 241 may be electrically connected by a bonding wire BW. According to such a method, since the shield wiring 742 can be connected to the ground without going through the wiring inside the IC 3, the impedance to the shield wiring 742 can be reduced. Therefore, the shielding effect of the shield wiring 742 can be further enhanced. In this method, the internal terminal 241 for the ground may be shared with the IC 3, or the internal terminal 241 for the IC 3 and the internal terminal 241 for the shield wiring 742 may be provided separately. It is preferable that Thereby, the increase in components can be prevented, and the enlargement of a device and the fall of reliability can be prevented.

  As another method, the shield wiring 742 may be directly connected to the ground internal terminal 241 provided in the package 2 via a bonding wire or the like without passing through the wiring in the IC 3 or the wiring on the IC 3. . This makes the device configuration simpler. Further, the impedance to the shield wiring 742 can be further reduced.

Second Embodiment
FIG. 10 is a cross-sectional view of a stress relaxation layer included in an electronic device according to the second embodiment of the present invention. 11 to 13 are plan views of the stress relaxation layer shown in FIG. FIG. 14 is a cross-sectional view for explaining the effect of the shield wiring.

  Hereinafter, the second embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted.

  The second embodiment is the same as the first embodiment described above except that the configuration of the stress relaxation layer is different.

  As shown in FIG. 10, the stress relaxation layer 7 of the present embodiment includes a first insulating layer 71 stacked on the upper surface of the IC 3 (on the passivation film 38), and a first wiring disposed on the first insulating layer 71. Layer 72, first insulating layer 71 and second insulating layer 73 disposed on first wiring layer 72, second wiring layer 74 disposed on second insulating layer 73, second insulating layer 73 and A third insulating layer 75 disposed on the second wiring layer 74 and a third wiring layer 76 disposed on the third insulating layer 75 are included. In the stress relaxation layer 7 having such a configuration, the number of insulating layers having elasticity is larger than that of the first embodiment described above, for example, so that the impact relaxation characteristics are further improved.

  Further, as shown in FIG. 11, the third wiring layer 76 includes six terminals (connection electrodes) 671 b to 674 b arranged on the support portions 651 and 652 of the vibration element 6. Connection pad) 761. The vibration element 6 is fixed to each terminal 761 through the fixing member 8. The third wiring layer 76 has a shield wiring (first shield wiring) 762. The shield wiring 762 extends over the third insulating layer 75 as long as the arrangement of the terminals 761 is not hindered. Further, the shield wiring 762 is electrically connected to a constant potential, particularly in the present embodiment, to the ground. The effect of the shield wiring 762 is the same as that of the first embodiment described above.

  Further, as shown in FIG. 12, the second wiring layer 74 has a wiring portion 743 that is electrically connected to the terminal 761. Further, as shown in FIG. 13, the first wiring layer 72 includes a wiring portion 721 that electrically connects each wiring portion 743 of the second wiring layer 74 and the connection terminal 37 of the IC 3, and a shield wiring (second shield). Wiring) 722.

  Since the shield wiring 722 is located between the second wiring layer 74 and the IC 3, it functions as a shield wiring that reduces capacitive coupling between the second wiring layer 74 and the IC 3. Therefore, by arranging the shield wiring 762, the electronic device 1 can detect the angular velocity with higher accuracy. More specifically, as shown in FIG. 14A, the wiring portion (first wiring) 743a that the second wiring layer 74 has and is electrically connected to the detection signal terminal 671b, and the IC3 ( Since the shield wiring 722 is disposed between the wiring layer 32) and the wiring portion (second wiring) 32a that is electrically connected to the drive signal terminal 673b, the wiring portion 32a is connected to the wiring portion 743a. Noise can be reduced, and a more accurate detection signal can be transmitted to the IC 3. Similarly, the wiring portion 743b that the second wiring layer 74 has and is electrically connected to the drive signal terminal 673b, and the IC3 (wiring layer 32) has and is electrically connected to the detection signal terminal 671b. Since the shield wiring 722 is disposed between the wiring section (second wiring) 32b and the wiring section (second wiring) 32b, noise from the wiring section 743b to the wiring section 32b is reduced, and a more accurate detection signal is transmitted to the IC3. Can do. Thus, by arranging the shield wiring 722, the electronic device 1 can detect the angular velocity with higher accuracy.

  Also according to the second embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Third Embodiment>
FIG. 15 is a cross-sectional view of an IC included in an electronic device according to the third embodiment of the present invention.

  Hereinafter, the third embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted.

  The third embodiment is the same as the second embodiment described above except that the shield wiring (second shield wiring) is arranged in the IC.

  As shown in FIG. 15, in the electronic device 1 of the present embodiment, a shield wiring (second shield wiring) 328 a is disposed in the IC 3. Specifically, the shield wiring 328a is provided as a part of the fourth wiring layer 328 included in the wiring layer 32 of the IC3. Thus, by arranging the shield wiring 328a in the IC 3, the same effects as those of the second embodiment described above can be exhibited, and further the following effects can be exhibited. That is, by arranging the shield wiring 328a in the IC 3, the first insulating layer 71 and the first wiring layer 72 for arranging the second shield wiring can be omitted from the stress relaxation layer 7. Therefore, the stress relaxation layer 7 can be made thinner and the electronic device 1 can be reduced in height.

  Also according to the third embodiment, the same effects as those of the first embodiment described above can be exhibited.

<Fourth embodiment>
FIG. 16 is a plan view of a vibration element included in an electronic device according to the fourth embodiment of the invention.

  Hereinafter, the fourth embodiment will be described with a focus on differences from the above-described embodiment, and description of similar matters will be omitted.

  The fourth embodiment is the same as the first embodiment described above except that the configuration of the vibration element is different.

  The vibration element 5 included in the electronic device 1 of the present embodiment is a so-called “H type” gyro element, and can detect an angular velocity ωy around the Y axis. As shown in FIG. 16, such a vibrating element 5 includes a vibrating piece 50 made of crystal and an electrode disposed on the vibrating piece 50. However, the material of the resonator element 50 is not limited to quartz, and for example, a piezoelectric material such as lithium tantalate or lithium niobate can also be used.

  The resonator element 50 has a plate shape having a spread in the xy plane defined by the x-axis (electrical axis) and the y-axis (mechanical axis) which are crystal axes of the crystal and having a thickness in the z-axis (optical axis) direction. There is no. The vibrating piece 50 includes a base 51, a pair of drive vibrating arms 521 and 522 extending side by side from the base 51 on the −y axis side, and a pair of detection vibrations extending side by side from the base 51 to the + y axis side. A pair of adjustment vibrating arms 541 and 542 that extend from the base 51 to the + y-axis side and are located on both sides of the detection vibrating arms 531 and 532, a support portion 55 that supports the base 51, and a base 51 And a connecting portion 56 that connects the support portion 55. In such a vibrating piece 50, the vibrating body 500 is configured by the base 51, the driving vibrating arms 521 and 522, the detecting vibrating arms 531 and 532, and the adjusting vibrating arms 541 and 542.

  Such a vibration element 5 is fixed to the stress relaxation layer 7 by the support portion 55. Further, the vibration element 5 is fixed to the stress relaxation layer 7 by using the fixing member 8, and the vibration element 5 and the IC 3 are electrically connected via the fixing member 8 and the stress relaxation layer 7. ing.

  The drive vibration arms 521 and 522 are provided with drive signal electrodes (not shown), and the drive mode indicated by the arrow D is excited by applying an oscillation drive signal (alternating voltage) from the IC 3 to the drive signal electrodes. When the driving vibration arms 521 and 522 are vibrating in the driving mode, if an angular velocity ωy about the Y axis is applied, the detection mode indicated by the arrow E is excited, and thus the detection vibrating arms 531 and 532 vibrate. To do. The detection vibration arms 531 and 532 are provided with detection signal electrodes (not shown), and detection signals (charges) generated by vibrations of the detection vibration arms 531 and 532 are extracted from the detection signal electrodes. Then, the IC 3 detects the angular velocity ωy based on the extracted detection signal.

  According to the fourth embodiment, the same effect as that of the first embodiment described above can be exhibited.

<Fifth Embodiment>
FIG. 17 is a perspective view showing an electronic device according to the fifth embodiment of the present invention. 18 is a plan view of the electronic device shown in FIG. FIG. 19 is a plan view showing a modification of the electronic device shown in FIG.

  Hereinafter, the fifth embodiment will be described with a focus on differences from the above-described embodiments, and description of similar matters will be omitted.

  The fifth embodiment is the same as the first embodiment described above except that a plurality of vibration elements are provided.

  The electronic device 1 of this embodiment is a triaxial angular velocity sensor, and can independently detect an angular velocity ωx around the X axis, an angular velocity ωy around the Y axis, and an angular velocity ωz around the Z axis. Is. As shown in FIG. 17, such an electronic device 1 is arranged via a stress relaxation layer 7 on the package 2 in which the accommodation space S is formed, the IC 3 accommodated in the package 2, and the IC 3. Three vibration elements 4, 5 and 6 are provided. The vibration elements 5 and 6 have the same configuration as that described in the above-described embodiment, and the vibration element 4 has the same configuration as the vibration element 5 except that the vibration elements 4 are arranged in different directions.

≪IC≫
The IC 3 has a substantially rectangular plan view shape. As shown in FIG. 18, the outer shape of the plan view has a pair of outer edges 3a and 3b extending in the Y-axis direction and a pair of extensions extending in the X-axis direction. And outer edges 3c and 3d.

  The IC 3 includes, for example, an interface unit 3 i that communicates with an external host device, a driving element 4 that drives the vibration element 4, detects an angular velocity ωy applied to the vibration element 4, and drives the vibration element 5. In addition, a drive / detection circuit 3x that detects the angular velocity ωx applied to the vibration element 5 and a drive / detection circuit 3z that drives the vibration element 6 and detects the angular velocity ωz applied to the vibration element 6 are included. .

  Here, as shown in FIG. 18, the plurality of connection terminals 39 are divided into three regions set on the upper surface of the IC 3, a first terminal arrangement region SS1, a second terminal arrangement region SS2, and a third terminal arrangement region SS3. Are arranged. The first terminal arrangement region SS1 is arranged along the outer edge 3c and offset toward the outer edge 3a, and the second terminal arrangement region SS2 is arranged along the outer edge 3d and offset toward the outer edge 3a. The third terminal arrangement region SS3 is arranged along the outer edge 3b and closer to the outer edge 3d side.

  In the first terminal arrangement area SS1, for example, a digital signal terminal for a slave select signal SS for selecting a communication method, a digital signal terminal for a data input signal MOSI, a digital signal terminal for a clock signal SCLK, and a data output signal Digital signal terminals such as MISO digital signal terminals are arranged together. The second terminal arrangement area SS2 and the third terminal arrangement area SS3 include, for example, a ground terminal for the ground GND, a power supply signal terminal for the power supply VDDI of the interface unit 3i, and power supplies for the drive / detection circuits 3x, 3y, and 3z. Analog signal terminals such as a power supply signal terminal for VDD and a test signal terminal for test are arranged together.

  As described above, by arranging the digital signal terminal and the analog signal terminal in different regions, mixing of the digital signal into the analog signal terminal (wiring) can be reduced. Therefore, it becomes the electronic device 1 which can reduce a noise and can perform more exact drive. In particular, in the present embodiment, since the first terminal arrangement region SS1 is arranged as far as possible from the second and third terminal arrangement regions SS2, SS3, the above effects can be more effectively exhibited.

≪Arrangement of vibration element≫
Vibrating element 4, as shown in FIG. 18, the detection axis J ₄ are arranged to coincide with the Y-axis. Thereby, the angular velocity ωy can be detected by the vibration element 4. Further, the vibration element 4 is disposed at a position offset from the outer edge 3b side and the outer edge 3d side of the upper surface of the IC 3. The third terminal arrangement region SS3 is located on the + X axis side of the vibration element 4 (between the vibration element 4 and the outer edge 3b), and on the −X axis side of the vibration element 4 (between the vibration element 4 and the outer edge 3a). ) Is the second terminal arrangement region SS2. Further, in the vibration element 4, the detection vibration arms 431 and 432 and the adjustment vibration arms 441 and 442 are disposed so as to protrude from the outer edge 3d of the IC 3 to the + Y side in a plan view. That is, the vibration element 4 is arranged such that the detection vibration arms 431 and 432 and the adjustment vibration arms 441 and 442 do not overlap with the IC 3 in plan view.

Next, the arrangement of the vibration element 5 will be described. Vibrating element 5, as shown in FIG. 18, the detection axis J ₅ are arranged to coincide with the X axis. Thereby, the angular velocity ωx can be detected by the vibration element 5. The vibration element 5 is disposed at a position offset from the outer edge 3b side and the outer edge 3c side of the upper surface of the IC3. Therefore, the vibration element 5 is located on the −Y axis side (between the vibration element 4 and the outer edge 3 c) with respect to the vibration element 4. The first terminal arrangement region SS1 is located on the −X axis side (between the vibration element 5 and the outer edge 3a) of the vibration element 5. Further, the vibration element 5 is arranged such that the detection vibration arms 531 and 532 and the adjustment vibration arms 541 and 542 protrude from the outer edge 3b of the IC 3 to the + X side in a plan view.

Next, the arrangement of the vibration element 6 will be described. Vibrating element 6, as shown in FIG. 18, the detection axis J ₆ is arranged to coincide with the Z-axis. Thereby, the angular velocity ωz can be detected by the vibration element 6. Further, the vibration element 6 is disposed at a position offset toward the outer edge 3 a side of the upper surface of the IC 3. Therefore, the vibration element 6 is located on the −X axis side (between the vibration elements 4 and 5 and the outer edge 3 a) with respect to the vibration elements 4 and 5. The first terminal arrangement region SS1 is located on the −Y axis side (between the vibration element 6 and the outer edge 3c) of the vibration element 6, and the first terminal arrangement region SS1 is located on the + Y axis side (between the vibration element 6 and the outer edge 3d). A two-terminal arrangement region SS2 is located.

Further, the vibration element 6 is arranged closer to the second terminal arrangement area SS2 than the first terminal arrangement area SS1. In other words, the vibration element 6 is disposed such that the separation distance D _SS2 from the second terminal arrangement region SS2 is shorter than the separation distance D _SS1 from the first terminal arrangement region SS1. Thereby, the vibration element 6 can be separated as much as possible from the first terminal arrangement region SS1, and mixing of digital signals into the vibration element 6 is reduced. Therefore, it is possible to reduce the mixing of noise into the drive signal and the detection signal, and the electronic device 1 can be driven more accurately.

  In addition, the vibration element 6 is arranged so that the alignment direction of the support portions 651 and 652 coincides with the X-axis direction. The vibration element 6 is arranged in this manner because the length in the direction in which the support portions 651 and 652 are arranged is longer than the length in the direction perpendicular to the direction (the extending direction of the connecting arms 631 and 632). The space on the upper surface of the IC 3 can be used effectively. Therefore, for example, the distance between the outer edges 3a and 3c can be shortened, and the IC 3 can be downsized.

  As described above, the vibration elements 4 and 5 are arranged in the x-axis direction in the region on the outer edge 3b side of the upper surface of the IC 3, and the vibration element 6 is disposed in the region on the outer edge 3a side of the upper surface of the IC 3, These three vibrating elements 4, 5, 6 can be arranged in a relatively small space. For this reason, the IC 3 can be reduced in size, and accordingly, the electronic device 1 can be reduced in size.

≪Stress relaxation layer≫
The stress relaxation layer 7 is provided between the IC 3 and the vibration element 4. The stress relaxation layer 7 is provided between the IC 3 and the vibration element 5 with the first stress relaxation layer 7 A having the vibration element 4 disposed on the upper surface. It has the 2nd stress relaxation layer 7B in which the element 5 is arrange | positioned, and the 3rd stress relaxation layer 7C which was provided between IC3 and the vibration element 6, and the vibration element 6 was arrange | positioned on the upper surface. As described above, by dividing the stress relaxation layer 7 for each of the vibration elements 4, 5, and 6, vibrations between the vibration elements 4, 5, and 6 are hardly transmitted to each other. Therefore, the angular velocity can be detected with higher accuracy by the vibration elements 4, 5, 6. The configuration of the first, second, and third stress relaxation layers 7A, 7B, and 7C is the same as the configuration of the stress relaxation layer 7 described in the first and second embodiments described above. Omitted.

  According to the fifth embodiment, the same effect as that of the first embodiment described above can be exhibited.

  In this embodiment, the stress relaxation layer 7 is divided into first, second, and third stress relaxation layers 7A, 7B, and 7C. For example, as shown in FIG. The third stress relaxation layers 7A, 7B, and 7C may be integrally formed. In other words, three vibration elements 4, 5, 6 may be disposed on one stress relaxation layer 7. This eliminates the gap between the first, second, and third stress relaxation layers 7A, 7B, and 7C as compared to the present embodiment, thereby preventing noise from entering from the gap and further enhancing the shielding effect. Can do.

[Electronics]
Next, an electronic apparatus to which the electronic device 1 is applied will be described in detail with reference to FIGS.

  FIG. 20 is a perspective view illustrating a configuration of a mobile (or notebook) personal computer to which an electronic apparatus including the electronic device of the present invention is applied.

  In this figure, a personal computer 1100 includes a main body portion 1104 provided with a keyboard 1102 and a display unit 1106 provided with a display portion 1108. The display unit 1106 is rotated with respect to the main body portion 1104 via a hinge structure portion. It is supported movably. Such a personal computer 1100 incorporates an electronic device 1 that functions as angular velocity detection means (gyro sensor). Therefore, the personal computer 1100 can exhibit higher performance and higher reliability.

  FIG. 21 is a perspective view illustrating a configuration of a mobile phone (including PHS) to which an electronic apparatus including the electronic device of the invention is applied.

  In this figure, a cellular phone 1200 includes a plurality of operation buttons 1202, an earpiece 1204, and a mouthpiece 1206, and a display unit 1208 is disposed between the operation buttons 1202 and the earpiece 1204. Such a cellular phone 1200 incorporates an electronic device 1 that functions as angular velocity detection means (gyro sensor). Therefore, the cellular phone 1200 can exhibit higher performance and higher reliability.

  FIG. 22 is a perspective view showing a configuration of a digital still camera to which an electronic apparatus including the electronic device of the present invention is applied. In this figure, connection with an external device is also simply shown.

  The digital still camera 1300 generates an imaging signal (image signal) by photoelectrically converting an optical image of a subject using an imaging element such as a CCD (Charge Coupled Device). A display unit 1310 is provided on the back of a case (body) 1302 in the digital still camera 1300, and is configured to perform display based on an imaging signal from the CCD. The display unit 1310 displays a subject as an electronic image. Functions as a viewfinder. A light receiving unit 1304 including an optical lens (imaging optical system), a CCD, and the like is provided on the front side (the back side in the drawing) of the case 1302. When the photographer confirms the subject image displayed on the display unit 1310 and presses the shutter button 1306, the CCD image pickup signal at that time is transferred and stored in the memory 1308.

  In this digital still camera 1300, a video signal output terminal 1312 and an input / output terminal 1314 for data communication are provided on the side surface of the case 1302. As shown in the figure, a television monitor 1430 is connected to the video signal output terminal 1312 and a personal computer 1440 is connected to the input / output terminal 1314 for data communication as necessary. Further, the imaging signal stored in the memory 1308 is output to the television monitor 1430 or the personal computer 1440 by a predetermined operation.

  Such a digital still camera 1300 incorporates an electronic device 1 that functions as an angular velocity detection means (gyro sensor). Therefore, the digital still camera 1300 can exhibit higher performance and higher reliability.

  In addition to the personal computer (mobile personal computer) of FIG. 20, the mobile phone of FIG. 21, and the digital still camera of FIG. Inkjet printers), laptop personal computers, televisions, video cameras, video tape recorders, car navigation devices, pagers, electronic notebooks (including those with communication functions), electronic dictionaries, calculators, electronic game devices, word processors, workstations, televisions Telephone, crime prevention TV monitor, electronic binoculars, POS terminal, medical equipment (for example, electronic thermometer, blood pressure monitor, blood glucose meter, electrocardiogram measuring device, ultrasonic diagnostic device, electronic endoscope), fish detector, various measuring devices, instruments Class (eg, vehicle, navigation Aircraft, gauges of a ship), can be applied to a flight simulator or the like.

[Moving object]
Next, a moving body to which the electronic device 1 shown in FIG. 1 is applied will be described in detail based on FIG.

  FIG. 23 is a perspective view showing a configuration of an automobile to which a moving object including the electronic device of the present invention is applied.

  The automobile 1500 incorporates an electronic device 1 that functions as angular velocity detection means (gyro sensor), and the attitude of the vehicle body 1501 can be detected by the electronic device 1. The detection signal of the electronic device 1 is supplied to the vehicle body posture control device 1502, and the vehicle body posture control device 1502 detects the posture of the vehicle body 1501 based on the signal and controls the stiffness of the suspension according to the detection result. The brakes of the individual wheels 1503 can be controlled. In addition, such posture control can be used by a biped robot or a radio control helicopter. As described above, the electronic device 1 is incorporated in realizing the attitude control of various moving objects.

  As mentioned above, although the electronic device, the electronic apparatus, and the moving body of the present invention have been described based on the illustrated embodiments, the present invention is not limited to this, and the configuration of each unit is an arbitrary configuration having the same function Can be substituted. In addition, any other component may be added to the present invention. Further, the present invention may be a combination of any two or more configurations (features) of the above embodiments.

  In the above-described embodiment, the configuration in which one vibration element is provided on the IC has been described. However, the number of vibration elements is not particularly limited, and for example, an angular velocity around the X axis can be detected. A vibration element, a vibration element that can detect an angular velocity around the Y axis, and a vibration element that can detect an angular velocity around the Z axis may be arranged.

  In the above-described embodiments, the angular velocity sensor as an electronic device has been described. However, the electronic device is not limited to the angular velocity sensor, and may be, for example, an oscillator that outputs a signal of a predetermined frequency, or an angular velocity. It may be a physical quantity sensor that can detect physical quantities (acceleration, atmospheric pressure), etc.

  In the above-described embodiment, the vibration element has a configuration in which electrodes are arranged on a vibration piece made of a quartz substrate (piezoelectric substrate). However, the configuration of the vibration element is not limited to this. For example, even if the piezoelectric element is arranged on a vibration piece obtained by patterning a silicon substrate and a voltage is applied to the piezoelectric element to expand and contract the piezoelectric element, the vibration element is configured to vibrate the vibration piece. Good.

DESCRIPTION OF SYMBOLS 1 ... Electronic device 2 ... Package 21 ... Base 211 ... Recess 211a ... 1st recessed part 211b ... 2nd recessed part 241 ... Internal terminal 242 ... External terminal 22 ... Lid 23 ... Seam ring 3 ... ... IC
3a, 3b, 3c, 3d ... outer edge 3i ... interface part 3x, 3y, 3z ... drive / detection circuit 31 ... silicon substrate 311 ... active surface 32 ... wiring layer 32a, 32b ... wiring part 321 ... ... 1st insulating layer 322 ... 1st wiring layer 323 ... 2nd insulating layer 324 ... 2nd wiring layer 325 ... 3rd insulating layer 326 ... 3rd wiring layer 327 ... 4th insulating layer 328 ... Fourth wiring layer 328a …… Shield wiring 37 …… Connection terminal 38 …… Passivation film 39 …… Connection terminal 4 …… Vibration element 431, 432 …… Detection vibration arm 441,442 …… Adjustment vibration arm 5 …… Vibration element 50 …… Vibrating piece 500 …… Vibrating body 51 …… Base portion 521, 522 …… Drive vibrating arm 531,532… Detection vibrating arm 541,542… Adjusting vibrating arm 55 …… Supporting portion 56 …… Connecting portion 6 …… Vibrating element 60 …… Vibrating piece 600 …… Vibrating body 61 …… Base 621, 622 ...... Detecting vibrating arm 631, 632. Support portion 661, 662, 663, 664... Beam portion 671a... Detection signal electrode 671b... Detection signal terminal 672a .. detection ground electrode 672b .. detection ground terminal 673a. Drive ground electrode 674b Drive ground terminal 7 Stress relaxation layer 7A First stress relaxation layer 7B Second stress relaxation layer 7C Third stress relaxation layer 71 First insulation layer 72 ... 1st wiring layer 721, 721a, 721b ... Wiring part 722 ... Shield wiring 73 ... 2nd insulating layer 74 ... 2nd wiring layer 741 ... Terminal 742 ... Shield Wiring 743, 743 a, 743 b... Wiring portion 75... Third insulating layer 76... Third wiring layer 761 .. terminal 762 .. shield wiring 8 .. fixing member 1100 ... personal computer 1102. Main unit 1106... Display unit 1108... Display unit 1200... Mobile phone 1202 .. Operation buttons 1204 .. Earpiece 1206 .. Mouthpiece 1208 .. Display unit 1300. Light receiving unit 1306 …… Shutter button 1308 …… Memory 1310 …… Display 1312 …… Video signal output terminal 1314 …… Input / output terminal 1430 …… TV monitor 1440 …… Personal computer 1500 …… Automobile 1501 …… Body 1502… …car Attitude control system 1503 ...... wheel BW ...... bonding wire D _SS1, D SS2 _...... distance _{J 4, J 5, J 6} ...... detection axis S ...... housing space SS1 ...... first terminal arrangement region SS2 ...... first Two-terminal arrangement area SS3 ... Third terminal arrangement area ωx, ωy, ωz ... Angular velocity

Claims (7)

A vibrating element having a vibrating body and an electrode disposed on the vibrating body;
A substrate disposed opposite to the vibration element;
A first wiring located between the substrate and the vibration element and electrically connected to a different potential from the electrode;
An electronic device comprising: a first shield wiring that is located closer to the vibration element than the first wiring and is electrically connected to a constant potential. The vibrator has a drive vibration unit and a detection vibration unit,
A drive signal electrode electrically connected to the first wiring is disposed on the drive vibration unit,
The electronic device according to claim 1, wherein a detection signal electrode as the electrode is disposed in the detection vibration unit. The vibrator has a drive vibration unit and a detection vibration unit,
In the drive vibration unit, a drive signal electrode as the electrode is disposed,
The electronic device according to claim 1, wherein a detection signal electrode that is electrically connected to the first wiring is disposed in the detection vibration unit.   The electronic device according to claim 1, wherein the first shield wiring is grounded. A second wiring located closer to the substrate than the first wiring and electrically connected to a different potential from the first wiring;
5. The device according to claim 1, further comprising: a second shield wiring that is located between the first wiring and the second wiring and is electrically connected to a constant potential. 6. Electronic devices.   An electronic apparatus comprising the electronic device according to claim 1.   A moving body comprising the electronic device according to claim 1.

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