JP2016072372A - 研磨装置 - Google Patents

研磨装置 Download PDF

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Publication number
JP2016072372A
JP2016072372A JP2014198804A JP2014198804A JP2016072372A JP 2016072372 A JP2016072372 A JP 2016072372A JP 2014198804 A JP2014198804 A JP 2014198804A JP 2014198804 A JP2014198804 A JP 2014198804A JP 2016072372 A JP2016072372 A JP 2016072372A
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JP
Japan
Prior art keywords
polishing
substrate
wafer
release
polishing head
Prior art date
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Pending
Application number
JP2014198804A
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English (en)
Japanese (ja)
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JP2016072372A5 (cg-RX-API-DMAC7.html
Inventor
篠崎　弘行
Hiroyuki Shinozaki
弘行 篠崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP2014198804A priority Critical patent/JP2016072372A/ja
Priority to US14/833,727 priority patent/US9539699B2/en
Publication of JP2016072372A publication Critical patent/JP2016072372A/ja
Publication of JP2016072372A5 publication Critical patent/JP2016072372A5/ja
Pending legal-status Critical Current

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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2014198804A 2014-08-28 2014-09-29 研磨装置 Pending JP2016072372A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014198804A JP2016072372A (ja) 2014-09-29 2014-09-29 研磨装置
US14/833,727 US9539699B2 (en) 2014-08-28 2015-08-24 Polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014198804A JP2016072372A (ja) 2014-09-29 2014-09-29 研磨装置

Publications (2)

Publication Number Publication Date
JP2016072372A true JP2016072372A (ja) 2016-05-09
JP2016072372A5 JP2016072372A5 (cg-RX-API-DMAC7.html) 2017-07-13

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ID=55864928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014198804A Pending JP2016072372A (ja) 2014-08-28 2014-09-29 研磨装置

Country Status (1)

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JP (1) JP2016072372A (cg-RX-API-DMAC7.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018032714A (ja) * 2016-08-24 2018-03-01 信越半導体株式会社 研磨装置及びウェーハの研磨方法
US11517996B2 (en) 2019-09-10 2022-12-06 Kioxia Corporation Polishing apparatus
JP2023097469A (ja) * 2021-12-28 2023-07-10 北越工業株式会社 圧縮機のドレン混入防止構造
CN120002493A (zh) * 2025-04-18 2025-05-16 中国标准化研究院 一种半导体封装结构及其封装方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002075916A (ja) * 2000-08-25 2002-03-15 Canon Inc 試料の分離装置及び分離方法
JP2011258639A (ja) * 2010-06-07 2011-12-22 Ebara Corp 研磨装置および方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002075916A (ja) * 2000-08-25 2002-03-15 Canon Inc 試料の分離装置及び分離方法
JP2011258639A (ja) * 2010-06-07 2011-12-22 Ebara Corp 研磨装置および方法

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018032714A (ja) * 2016-08-24 2018-03-01 信越半導体株式会社 研磨装置及びウェーハの研磨方法
WO2018037878A1 (ja) * 2016-08-24 2018-03-01 信越半導体株式会社 研磨装置及びウェーハの研磨方法
CN109478506A (zh) * 2016-08-24 2019-03-15 信越半导体株式会社 研磨装置以及晶圆的研磨方法
KR20190040963A (ko) * 2016-08-24 2019-04-19 신에쯔 한도타이 가부시키가이샤 연마장치 및 웨이퍼의 연마방법
TWI673138B (zh) * 2016-08-24 2019-10-01 日商信越半導體股份有限公司 晶圓的研磨方法
KR102382807B1 (ko) * 2016-08-24 2022-04-05 신에쯔 한도타이 가부시키가이샤 연마장치 및 웨이퍼의 연마방법
US11517996B2 (en) 2019-09-10 2022-12-06 Kioxia Corporation Polishing apparatus
JP2023097469A (ja) * 2021-12-28 2023-07-10 北越工業株式会社 圧縮機のドレン混入防止構造
JP7729773B2 (ja) 2021-12-28 2025-08-26 株式会社Airman 圧縮機のドレン混入防止構造
CN120002493A (zh) * 2025-04-18 2025-05-16 中国标准化研究院 一种半导体封装结构及其封装方法

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