JP2016072372A5 - - Google Patents

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Publication number
JP2016072372A5
JP2016072372A5 JP2014198804A JP2014198804A JP2016072372A5 JP 2016072372 A5 JP2016072372 A5 JP 2016072372A5 JP 2014198804 A JP2014198804 A JP 2014198804A JP 2014198804 A JP2014198804 A JP 2014198804A JP 2016072372 A5 JP2016072372 A5 JP 2016072372A5
Authority
JP
Japan
Prior art keywords
push
retainer ring
pin
polishing head
lowered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014198804A
Other languages
English (en)
Japanese (ja)
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JP2016072372A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2014198804A priority Critical patent/JP2016072372A/ja
Priority claimed from JP2014198804A external-priority patent/JP2016072372A/ja
Priority to US14/833,727 priority patent/US9539699B2/en
Publication of JP2016072372A publication Critical patent/JP2016072372A/ja
Publication of JP2016072372A5 publication Critical patent/JP2016072372A5/ja
Pending legal-status Critical Current

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JP2014198804A 2014-08-28 2014-09-29 研磨装置 Pending JP2016072372A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014198804A JP2016072372A (ja) 2014-09-29 2014-09-29 研磨装置
US14/833,727 US9539699B2 (en) 2014-08-28 2015-08-24 Polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014198804A JP2016072372A (ja) 2014-09-29 2014-09-29 研磨装置

Publications (2)

Publication Number Publication Date
JP2016072372A JP2016072372A (ja) 2016-05-09
JP2016072372A5 true JP2016072372A5 (cg-RX-API-DMAC7.html) 2017-07-13

Family

ID=55864928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014198804A Pending JP2016072372A (ja) 2014-08-28 2014-09-29 研磨装置

Country Status (1)

Country Link
JP (1) JP2016072372A (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6575463B2 (ja) * 2016-08-24 2019-09-18 信越半導体株式会社 ウェーハの研磨方法
JP2021041485A (ja) 2019-09-10 2021-03-18 キオクシア株式会社 研磨装置
JP7729773B2 (ja) * 2021-12-28 2025-08-26 株式会社Airman 圧縮機のドレン混入防止構造
CN120002493A (zh) * 2025-04-18 2025-05-16 中国标准化研究院 一种半导体封装结构及其封装方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002075916A (ja) * 2000-08-25 2002-03-15 Canon Inc 試料の分離装置及び分離方法
JP5597033B2 (ja) * 2010-06-07 2014-10-01 株式会社荏原製作所 研磨装置および方法

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