JP2016072372A5 - - Google Patents

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Publication number
JP2016072372A5
JP2016072372A5 JP2014198804A JP2014198804A JP2016072372A5 JP 2016072372 A5 JP2016072372 A5 JP 2016072372A5 JP 2014198804 A JP2014198804 A JP 2014198804A JP 2014198804 A JP2014198804 A JP 2014198804A JP 2016072372 A5 JP2016072372 A5 JP 2016072372A5
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JP
Japan
Prior art keywords
push
retainer ring
pin
polishing head
lowered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014198804A
Other languages
English (en)
Japanese (ja)
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JP2016072372A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2014198804A priority Critical patent/JP2016072372A/ja
Priority claimed from JP2014198804A external-priority patent/JP2016072372A/ja
Priority to US14/833,727 priority patent/US9539699B2/en
Publication of JP2016072372A publication Critical patent/JP2016072372A/ja
Publication of JP2016072372A5 publication Critical patent/JP2016072372A5/ja
Pending legal-status Critical Current

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JP2014198804A 2014-08-28 2014-09-29 研磨装置 Pending JP2016072372A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014198804A JP2016072372A (ja) 2014-09-29 2014-09-29 研磨装置
US14/833,727 US9539699B2 (en) 2014-08-28 2015-08-24 Polishing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014198804A JP2016072372A (ja) 2014-09-29 2014-09-29 研磨装置

Publications (2)

Publication Number Publication Date
JP2016072372A JP2016072372A (ja) 2016-05-09
JP2016072372A5 true JP2016072372A5 (cg-RX-API-DMAC7.html) 2017-07-13

Family

ID=55864928

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014198804A Pending JP2016072372A (ja) 2014-08-28 2014-09-29 研磨装置

Country Status (1)

Country Link
JP (1) JP2016072372A (cg-RX-API-DMAC7.html)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6575463B2 (ja) * 2016-08-24 2019-09-18 信越半導体株式会社 ウェーハの研磨方法
JP2021041485A (ja) 2019-09-10 2021-03-18 キオクシア株式会社 研磨装置
JP7729773B2 (ja) * 2021-12-28 2025-08-26 株式会社Airman 圧縮機のドレン混入防止構造
CN120002493A (zh) * 2025-04-18 2025-05-16 中国标准化研究院 一种半导体封装结构及其封装方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002075916A (ja) * 2000-08-25 2002-03-15 Canon Inc 試料の分離装置及び分離方法
JP5597033B2 (ja) * 2010-06-07 2014-10-01 株式会社荏原製作所 研磨装置および方法

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