JP2013211403A5 - - Google Patents
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- JP2013211403A5 JP2013211403A5 JP2012080481A JP2012080481A JP2013211403A5 JP 2013211403 A5 JP2013211403 A5 JP 2013211403A5 JP 2012080481 A JP2012080481 A JP 2012080481A JP 2012080481 A JP2012080481 A JP 2012080481A JP 2013211403 A5 JP2013211403 A5 JP 2013211403A5
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- JP
- Japan
- Prior art keywords
- intermediate layer
- semiconductor
- transfer step
- mask
- curvature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012080481A JP5897379B2 (ja) | 2012-03-30 | 2012-03-30 | 半導体面の加工方法 |
| US13/853,679 US8969208B2 (en) | 2012-03-30 | 2013-03-29 | Method to form convex structure on surface of semiconductor material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012080481A JP5897379B2 (ja) | 2012-03-30 | 2012-03-30 | 半導体面の加工方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013211403A JP2013211403A (ja) | 2013-10-10 |
| JP2013211403A5 true JP2013211403A5 (cg-RX-API-DMAC7.html) | 2015-05-07 |
| JP5897379B2 JP5897379B2 (ja) | 2016-03-30 |
Family
ID=49235587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012080481A Expired - Fee Related JP5897379B2 (ja) | 2012-03-30 | 2012-03-30 | 半導体面の加工方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US8969208B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP5897379B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2518228A3 (en) | 2011-04-26 | 2014-04-23 | WCM Industries, Inc. | Device for concealing a plate associated with overflow plumbing |
| US12206032B2 (en) * | 2020-07-31 | 2025-01-21 | Apple Inc. | Wideband back-illuminated electromagnetic radiation detectors |
| US12125865B2 (en) | 2021-03-31 | 2024-10-22 | Apple Inc. | Electromagnetic radiation detectors integrated with immersion lenses |
| CN114284377B (zh) * | 2021-12-31 | 2023-07-28 | 武汉锐科光纤激光技术股份有限公司 | 双面Si基AlGaN探测器及其制备方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63315600A (ja) * | 1987-06-18 | 1988-12-23 | Matsushita Electric Ind Co Ltd | 選択結晶埋込み成長法 |
| JPH03210506A (ja) * | 1990-01-16 | 1991-09-13 | Fujitsu Ltd | 光半導体装置 |
| JPH05136460A (ja) * | 1991-06-19 | 1993-06-01 | Matsushita Electric Ind Co Ltd | マイクロレンズ形成方法 |
| JPH06104480A (ja) | 1992-09-21 | 1994-04-15 | Nec Corp | 半導体光素子の製造方法 |
| JPH08195505A (ja) * | 1995-01-17 | 1996-07-30 | Toshiba Corp | 半導体発光素子及びその製造方法 |
| JPH09326511A (ja) | 1996-06-05 | 1997-12-16 | Toshiba Electron Eng Corp | 光半導体素子およびその製造方法 |
| KR100382723B1 (ko) * | 2000-11-13 | 2003-05-09 | 삼성전자주식회사 | 고체촬상소자 및 그 제조방법 |
| JP4830306B2 (ja) * | 2004-06-23 | 2011-12-07 | 凸版印刷株式会社 | 固体撮像素子の製造方法 |
| JP4207878B2 (ja) * | 2004-10-15 | 2009-01-14 | セイコーエプソン株式会社 | 面発光レーザ、面発光レーザの製造方法、デバイス及び電子機器 |
| KR101065077B1 (ko) * | 2008-11-05 | 2011-09-15 | 삼성전자주식회사 | 시료 검출용 기판, 이를 채용한 바이오칩, 시료 검출용 기판의 제조방법 및 바이오 물질 검출장치 |
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2012
- 2012-03-30 JP JP2012080481A patent/JP5897379B2/ja not_active Expired - Fee Related
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2013
- 2013-03-29 US US13/853,679 patent/US8969208B2/en active Active