JP2016072264A5 - - Google Patents
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- Publication number
- JP2016072264A5 JP2016072264A5 JP2014196467A JP2014196467A JP2016072264A5 JP 2016072264 A5 JP2016072264 A5 JP 2016072264A5 JP 2014196467 A JP2014196467 A JP 2014196467A JP 2014196467 A JP2014196467 A JP 2014196467A JP 2016072264 A5 JP2016072264 A5 JP 2016072264A5
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- sample
- plasma processing
- processing method
- coating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 210000002381 Plasma Anatomy 0.000 claims description 37
- 238000003672 processing method Methods 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 14
- 238000004140 cleaning Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims 4
- 238000009832 plasma treatment Methods 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 3
- 238000001514 detection method Methods 0.000 claims 2
- 210000004303 Peritoneum Anatomy 0.000 claims 1
- 229910003902 SiCl 4 Inorganic materials 0.000 claims 1
- 239000000203 mixture Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014196467A JP6275610B2 (ja) | 2014-09-26 | 2014-09-26 | プラズマ処理方法およびプラズマ処理装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014196467A JP6275610B2 (ja) | 2014-09-26 | 2014-09-26 | プラズマ処理方法およびプラズマ処理装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016072264A JP2016072264A (ja) | 2016-05-09 |
| JP2016072264A5 true JP2016072264A5 (es) | 2017-02-09 |
| JP6275610B2 JP6275610B2 (ja) | 2018-02-07 |
Family
ID=55864905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014196467A Active JP6275610B2 (ja) | 2014-09-26 | 2014-09-26 | プラズマ処理方法およびプラズマ処理装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6275610B2 (es) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6630649B2 (ja) * | 2016-09-16 | 2020-01-15 | 株式会社日立ハイテクノロジーズ | プラズマ処理方法 |
| US11355324B2 (en) * | 2017-03-27 | 2022-06-07 | Hitachi High-Tech Corporation | Plasma processing method |
| JP6845773B2 (ja) | 2017-09-15 | 2021-03-24 | 株式会社日立ハイテク | プラズマ処理方法 |
| WO2020050124A1 (ja) * | 2018-09-05 | 2020-03-12 | 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ | クリーニング方法、半導体装置の製造方法、プログラムおよび基板処理装置 |
| JP7357182B1 (ja) * | 2021-12-22 | 2023-10-05 | 東京エレクトロン株式会社 | 基板処理装置のメンテナンス方法及び基板処理装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW422892B (en) * | 1997-03-27 | 2001-02-21 | Applied Materials Inc | Technique for improving chucking reproducibility |
| JP2008244292A (ja) * | 2007-03-28 | 2008-10-09 | Hitachi High-Technologies Corp | プラズマ処理装置の処理性能安定化方法 |
| JP5450187B2 (ja) * | 2010-03-16 | 2014-03-26 | 株式会社日立ハイテクノロジーズ | プラズマ処理装置およびプラズマ処理方法 |
| JP5642427B2 (ja) * | 2010-05-24 | 2014-12-17 | 株式会社日立ハイテクノロジーズ | プラズマ処理方法 |
| JP2013214584A (ja) * | 2012-04-02 | 2013-10-17 | Hitachi High-Technologies Corp | プラズマ処理装置及びプラズマ処理方法 |
| JP6071514B2 (ja) * | 2012-12-12 | 2017-02-01 | 東京エレクトロン株式会社 | 静電チャックの改質方法及びプラズマ処理装置 |
-
2014
- 2014-09-26 JP JP2014196467A patent/JP6275610B2/ja active Active
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