JP2016066540A - Light emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve workability of holding a light emitting panel with a holding member.SOLUTION: A light emitting panel 100 comprises a substrate 110, a light emitting part 120, and a coating member 140. The light emitting part 120 is formed on a first surface of the substrate 110. The coating member 140 is also formed on the first surface of the substrate 110 and coats the light emitting part 120. The light emitting panel 100 is held by a holding member 200 in a direction where the coating member 140 faces the holding member 200. The coating member 140 has a projection part 142. The projection part 142 is located closer to a center of the substrate 110 than to an edge 112 of the substrate 110.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a light emitting device.

  Development of a light-emitting device using an organic layer as a light-emitting layer is in progress. Such a light emitting device can be bent when a substrate that can be bent is used.

  Patent Documents 1 to 3 describe a holding member for holding a display panel in a bent state in a display device such as a liquid crystal display device. These holding members have curved portions that hold the display panel.

JP 2009-086560 A JP 2010-145731 A JP 2007-272107 A

  When a light emitting panel such as a display panel is held by a holding member, it is necessary to slide the light emitting panel on one surface of the holding member. The present inventor studied to improve the workability of this process.

  An example of a problem to be solved by the present invention is to improve workability when the light emitting panel is held by the holding member.

The invention according to claim 1 is a light emitting panel;
A holding member for holding the light emitting panel;
With
The light emitting panel
A substrate,
A light emitting part formed on the first surface of the substrate;
A covering member that is formed on the first surface of the substrate and covers the light emitting portion;
With
The light emitting panel is held by the holding member in a direction in which the covering member faces the holding member,
The said covering member is a light-emitting device which has a convex part in the part near the center of the said board | substrate rather than the edge of the said board | substrate.

It is a perspective view which shows the structure of the light-emitting device which concerns on embodiment. It is AA sectional drawing of FIG. FIG. 3 is a view obtained by removing a holding member from an enlarged view of a region surrounded by a dotted line α in FIG. 2. It is BB sectional drawing of FIG. It is a figure for demonstrating the manufacturing method of a light-emitting device.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same reference numerals are given to the same components, and the description will be omitted as appropriate.

  FIG. 1 is a perspective view illustrating a configuration of a light emitting device 10 according to the embodiment. 2 is a cross-sectional view taken along the line AA of FIG. 1, and FIG. 3 is a diagram obtained by removing the holding member 200 from the enlarged view of the region surrounded by the dotted line α in FIG. 4 is a cross-sectional view taken along the line BB of FIG. The light emitting device 10 according to this embodiment includes a light emitting panel 100 and a holding member 200. As shown in FIG. 2, the light emitting panel 100 includes a substrate 110, a light emitting unit 120, and a covering member 140. The light emitting unit 120 is formed on the first surface of the substrate 110. The covering member 140 is also formed on the first surface of the substrate 110 and covers the light emitting unit 120. The light emitting panel 100 is held by the holding member 200 such that the covering member 140 faces the holding member 200. The covering member 140 has a convex portion 142. The convex portion 142 is located closer to the center of the substrate 110 than the edge 112 of the substrate 110. Details will be described below.

  First, the light emitting panel 100 and the holding member 200 will be described with reference to FIG. The light emitting panel 100 has an elongated shape (for example, a rectangle), and overlaps the holding portion 220 of the holding member 200 except for a part (one end side in the example shown in the figure). A terminal portion is formed in a region of the light emitting panel 100 that does not overlap the holding portion 220. The terminal portion is connected to the light emitting unit 120 via a lead wiring provided on the light emitting panel 100. The terminal portion is connected to a conductive member 300 such as a flexible printed circuit (FPC) or a lead frame. The conductive member 300 connects the light emitting panel 100 to the control circuit.

  The holding member 200 includes a base part 210 and a holding part 220. The base portion 210 is a plate-like member and has an elongated shape. The base part 210 is curved. And the surface which opposes the light emission panel 100 among the base parts 210 is a curved surface. Further, the width of the base portion 210 is slightly wider than the width of the light emitting panel 100. The base unit 210 is provided with a holding unit 220. The holding part 220 has a shape in which the cross section is L upside down, and is provided at least on each of the two long sides of the base part 210. In the example shown in this drawing, the holding part 220 is formed along two long sides and one short side of the edge of the light emitting panel 100.

  The base portion 210 is made of a metal such as stainless steel (SUS) or aluminum, or a resin, and the holding portion 220 is made of a metal such as SUS or aluminum, or a resin, for example. The holding part 220 may be formed by, for example, pressing the edge of the base part 210, or may be formed by attaching a member different from the base part 210 to the base part 210.

  Then, as will be described in detail later, by moving the light emitting panel 100 along the curved surface of the base portion 210 while sandwiching the edge of the light emitting panel 100 between the holding portion 220 and the base portion 210, the light emitting panel 100 is It is held by the holding member 200 in a curved state. At this time, the light emitting panel 100 is inserted between the base portion 210 and the holding portion 220 from a portion of the holding member 200 where the holding portion 220 is not formed, that is, the remaining short side of the base portion 210.

  Next, a cross-sectional structure of the light-emitting panel 100 will be described with reference to FIGS. FIG. 3 is an enlarged view of a main part of FIG. The light emitting panel 100 includes a substrate 110, a light emitting unit 120, a sealing film 130, and a covering member 140.

The substrate 110 is a transparent substrate such as a glass substrate or a resin substrate. The light emitting panel 100 has flexibility, and the thickness is, for example, not less than 10 μm and not more than 1000 μm. When the substrate 110 is a resin substrate, the substrate 110 is formed using, for example, PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), or polyimide. In the case where the substrate 110 is a resin substrate, a barrier made of an inorganic material such as SiN _x or SiON is provided on at least one surface (preferably both surfaces) of the substrate 110 in order to prevent moisture and oxygen from passing through the substrate 110. A layer is formed.

  As illustrated in FIG. 3, the light emitting unit 120 includes a first electrode 122, an organic layer 124, and a second electrode 126. The second electrode 126 overlaps the first electrode 122. The organic layer 124 is located between the first electrode 122 and the second electrode 126.

  The first electrode 122 is a transparent electrode having optical transparency. The material of the transparent electrode is a metal-containing material, for example, a metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide), or ZnO (Zinc Oxide). The thickness of the first electrode 122 is, for example, not less than 10 nm and not more than 500 nm. The first electrode 122 is formed using, for example, a sputtering method or a vapor deposition method. The first electrode 122 may be a carbon nanotube or a conductive organic material such as PEDOT / PSS.

  The organic layer 124 has a light emitting layer. The organic layer 124 has, for example, a configuration in which a hole injection layer, a light emitting layer, and an electron injection layer are stacked in this order. A hole transport layer may be formed between the hole injection layer and the light emitting layer. In addition, an electron transport layer may be formed between the light emitting layer and the electron injection layer. The organic layer 124 may be formed by a vapor deposition method. In addition, at least one layer of the organic layer 124, for example, a layer in contact with the first electrode 122 may be formed by a coating method such as an inkjet method, a printing method, or a spray method. In this case, the remaining layers of the organic layer 124 are formed by vapor deposition. Further, all the layers of the organic layer 124 may be formed by using a coating method.

  The second electrode 126 is made of, for example, a metal selected from the first group consisting of Al, Au, Ag, Pt, Mg, Sn, Zn, and In, or an alloy of a metal selected from the first group. Contains a metal layer. In this case, the second electrode 126 has a light shielding property. The thickness of the second electrode 126 is, for example, not less than 10 nm and not more than 500 nm. However, the second electrode 126 may be formed using the material exemplified as the material of the first electrode 122. The second electrode 126 is formed using, for example, a sputtering method or a vapor deposition method.

  Further, the edge of the first electrode 122 is covered with an insulating layer 128. The insulating layer 128 is made of a photosensitive resin such as polyimide. An organic layer 124 is formed inside a region surrounded by the insulating layer 128 in the first electrode 122. For this reason, the light emitting region of the light emitting unit 120 is determined by the insulating layer 128. The provision of the insulating layer 128 can prevent the first electrode 122 and the second electrode 126 from being short-circuited at the edge of the light emitting unit 120.

The sealing film 130 is formed on the first surface of the substrate 110 and seals the light emitting unit 120. The sealing film 130 is formed using a film forming method such as an ALD (Atomic Layer Deposition) method or a CVD method. In the case of being formed by the ALD method, the sealing film 130 is formed of a metal oxide film such as aluminum oxide, for example, and the thickness thereof is, for example, not less than 10 nm and not more than 200 nm, preferably not less than 50 nm and not more than 100 nm. When formed by the CVD method, the sealing film 130 is formed of an inorganic insulating film such as a silicon oxide film, and the film thickness thereof is, for example, not less than 0.1 μm and not more than 10 μm. By providing the sealing film 130, the light-emitting element 102 is protected from moisture and the like. The sealing film 130 may be formed by a sputtering method. In this case, the sealing film 130 is formed of an insulating film such as SiO ₂ or SiN. In that case, the film thickness is 10 nm or more and 1000 nm or less.

  The covering member 140 is formed on the first surface of the substrate 110 and covers the sealing film 130 and the light emitting unit 120. The covering member 140 also has a role of protecting the sealing film 130 and the light emitting unit 120 from physical scratches and dirt. The covering member 140 is made of a resin such as an epoxy resin or an acrylic resin. The thickness of the covering member 140 is, for example, 50 μm or more and 200 μm or less. The covering member 140 is formed by, for example, applying a resin to a desired region using a mask or applying a resin to a desired region using a needle.

  The covering member 140 has a convex portion 142. The height of the protrusion 142 is, for example, not less than 50 μm and not more than 150 μm. The convex portion 142 is located closer to the center of the substrate 110 than the edge 112 of the substrate 110. More specifically, the upper surface of the convex portion 142 is a curved surface. When viewed from a direction perpendicular to the substrate 110, the upper end 143 of the convex portion 142 is located between the edge 112 and the organic layer 124. However, the upper end 143 of the convex portion 142 may be a flat surface. In this case, the entire surface is preferably located between the edge 112 and the organic layer 124. In addition, the convex part 142 is formed by making the part which should become the convex part 142 thicker than another part when apply | coating resin used as the coating | coated member 140. FIG.

  Next, a cross-sectional structure in the longitudinal direction (first direction) of the light emitting device 10 will be described with reference to FIG. As shown in FIG. 1 and this figure, the surface of the base portion 210 that faces the light emitting panel 100 is a curved surface. Therefore, the holding member 200 holds the light emitting panel 100 in a state where bending stress is applied. On the other hand, since the light emitting panel 100 has elasticity, the light emitting panel 100 tries to return to a straight line shape. For this reason, the end of the light emitting panel 100 in the longitudinal direction is in contact with the holding portion 220 of the holding member 200. On the other hand, the central portion of the light emitting panel 100 in the longitudinal direction is in contact with the base portion 210 of the holding member 200. Specifically, at the end of the light emitting panel 100 in the longitudinal direction, the surface of the substrate 110 opposite to the light emitting portion 120 is in contact with the holding portion 220, but the convex portion 142 of the covering member 140 is the base. It is not in contact with the part 210. Further, in the central portion of the light emitting panel 100 in the longitudinal direction, the convex portion 142 of the covering member 140 is in contact with the base portion 210, but the surface of the substrate 110 opposite to the light emitting portion 120 is in contact with the holding portion 220. Absent. However, the convex portion 142 may be in contact with the base portion 210 at any location, or all three sides of the substrate 110 may be in contact with the holding portion 220.

  FIG. 5 is a diagram for explaining a method of manufacturing the light emitting device 10. First, the light emitting panel 100 and the holding member 200 are prepared.

  Next, as shown in FIG. 5A, a force is applied to the base portion 210 of the holding member 200 to bring the curved surface of the base portion 210 closer to a flat surface.

  Next, as illustrated in FIG. 5B, the light emitting panel 100 is inserted into the holding member 200 while maintaining the curved surface of the base portion 210 close to a flat surface. At this time, since the convex portion 142 is formed on the covering member 140 of the light emitting panel 100, the contact area between the base portion 210 of the holding member 200 and the light emitting panel 100 is reduced. For this reason, the work load when inserting the light emitting panel 100 into the holding member 200 is reduced. Further, since the convex portion 142 of the covering member 140 is located inside the edge 112 of the substrate 110, the contact area between the covering member 140 and the holding portion 220 and the contact area between the covering member 140 and the holding member 200 are further reduced. . Therefore, the work load when the light emitting panel 100 is inserted into the holding member 200 is further reduced.

  When viewed from a direction perpendicular to the substrate 110, the upper end 143 of the covering member 140 is located between the edge 112 of the substrate 110 and the organic layer 124. Therefore, it is possible to prevent the light emitting unit 120 from being damaged due to the force applied to the upper end 143 when the light emitting panel 100 is inserted into the holding member 200.

  Then, as shown in FIG.5 (c), the base part 210 of the holding member 200 is open | released. Thereby, the base part 210 curves and the light emission panel 100 also curves in connection with this.

  As described above, according to the present embodiment, since the convex portion 142 is formed on the covering member 140 of the light emitting panel 100, when the light emitting panel 100 is inserted into the holding member 200, the base portion 210 of the holding member 200 and the light emitting panel 100. The contact area with is small. For this reason, the work load when inserting the light emitting panel 100 into the holding member 200 is reduced.

  As mentioned above, although embodiment and the Example were described with reference to drawings, these are illustrations of this invention and can also employ | adopt various structures other than the above.

DESCRIPTION OF SYMBOLS 10 Light-emitting device 100 Light-emitting panel 110 Substrate 120 Light-emitting part 122 First electrode 124 Organic layer 126 Second electrode 130 Sealing film 140 Covering member 142 Protruding part 143 Upper end 200 Holding member 210 Base part 220 Holding part

Claims (6)

A light emitting panel;
A holding member for holding the light emitting panel;
With
The light emitting panel
A substrate,
A light emitting part formed on the first surface of the substrate;
A covering member that is formed on the first surface of the substrate and covers the light emitting portion;
With
The light emitting panel is held by the holding member in a direction in which the covering member faces the holding member,
The light emitting device, wherein the covering member has a convex portion in a portion closer to the center of the substrate than an edge of the substrate. The light-emitting device according to claim 1.
The holding member is a light-emitting device that holds the light-emitting panel in a state where bending stress is applied. The light-emitting device according to claim 2.
The holding member applies the bending stress so as to curve the light-emitting panel along a first direction;
The convex portion extends along the first direction;
In the first direction, the light emitting device in which the convex portion located at the center of the light emitting panel is in contact with the holding member. The light emitting device according to claim 3.
In the first direction, the convex portion located at the end of the light emitting panel is not in contact with the holding member. In the light-emitting device as described in any one of Claims 1-4,
The light emitting unit
A first electrode;
A second electrode;
An organic layer positioned between the first electrode and the second electrode;
With
The upper end of the convex part is a light-emitting device located between the organic layer and the edge of the substrate. The light emitting device according to claim 5.
A light-emitting device provided with the sealing film located between the said light emission part and the said coating | coated member.

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