JP7450077B2 - light emitting device - Google Patents

Description

The present invention relates to a light emitting device.

Development of light-emitting devices using organic layers as light-emitting layers is progressing. Such a light emitting device can be bent if a bendable substrate is used.

Note that Patent Documents 1 to 3 describe holding members for holding a display panel in a bent state in a display device such as a liquid crystal display device. These holding members have curved portions that hold the display panel.

JP2009-086560A Japanese Patent Application Publication No. 2010-145731 Japanese Patent Application Publication No. 2007-272107

When holding a light emitting panel such as a display panel on a holding member, it is necessary to slide the light emitting panel on one surface of the holding member. The present inventor considered improving the workability of this process.

An example of the problem to be solved by the present invention is to improve workability when holding a light emitting panel on a holding member.

The first invention includes a light emitting panel;
a holding member that holds the light emitting panel;
Equipped with
The light emitting panel is
A substrate and
a light emitting part formed on the first surface of the substrate;
a covering member formed on the first surface of the substrate and covering the light emitting part;
Equipped with
The light emitting panel is held by the holding member in a direction in which the covering member faces the holding member,
The covering member is a light emitting device having a convex portion closer to the center of the substrate than the edge of the substrate.

FIG. 1 is a perspective view showing the configuration of a light emitting device according to an embodiment. 2 is a sectional view taken along line AA in FIG. 1. FIG. FIG. 3 is an enlarged view of the area surrounded by the dotted line α in FIG. 2 with the holding member removed. 2 is a sectional view taken along line BB in FIG. 1. FIG. FIG. 3 is a diagram for explaining a method of manufacturing a light emitting device.

Embodiments of the present invention will be described below with reference to the drawings. Note that in all the drawings, similar components are denoted by the same reference numerals, and descriptions thereof will be omitted as appropriate.

FIG. 1 is a perspective view showing the configuration of a light emitting device 10 according to an embodiment. 2 is a sectional view taken along the line AA in FIG. 1, and FIG. 3 is an enlarged view of the area surrounded by the dotted line α in FIG. 2, with the holding member 200 removed. FIG. 4 is a sectional view taken along line BB in FIG. The light emitting device 10 according to this embodiment includes a light emitting panel 100 and a holding member 200. As shown in FIG. 2, the light emitting panel 100 includes a substrate 110, a light emitting section 120, and a covering member 140. The light emitting section 120 is formed on the first surface of the substrate 110. A covering member 140 is also formed on the first surface of the substrate 110 and covers the light emitting section 120. The light emitting panel 100 is held by the holding member 200 with the covering member 140 facing the holding member 200. The covering member 140 has a convex portion 142. Convex portion 142 is located closer to the center of substrate 110 than edge 112 of substrate 110 . This will be explained in detail below.

First, the light emitting panel 100 and the holding member 200 will be explained using FIG. 1. The light emitting panel 100 has an elongated shape (for example, a rectangle), and overlaps with the holding part 220 of the holding member 200 except for a part (in the example shown in this figure, one end side). A terminal portion is formed in a region of the light emitting panel 100 that does not overlap with the holding portion 220. The terminal section is connected to the light emitting section 120 via a lead wire provided on the light emitting panel 100. Further, the terminal portion is connected to a conductive member 300 such as a flexible printed circuit (FPC) or a lead frame. Conductive member 300 connects light emitting panel 100 to a control circuit.

The holding member 200 includes a base portion 210 and a holding portion 220. The base portion 210 is a plate-like member and has an elongated shape. Base portion 210 is curved. The surface of the base portion 210 that faces the light emitting panel 100 is a curved surface. Further, the width of the base portion 210 is slightly wider than the width of the light emitting panel 100. The base portion 210 is provided with a holding portion 220. The holding portion 220 has a cross-section shaped like an upside-down L, and is provided at least on each of the two long sides of the base portion 210 . In the example shown in this figure, the holding portions 220 are formed along two long sides and one short side of the edge of the light emitting panel 100.

The base portion 210 is made of a metal such as stainless steel (SUS) or aluminum, or resin, and the holding portion 220 is made of a metal such as SUS or aluminum, or resin. The holding portion 220 may be formed, for example, by pressing the edge of the base portion 210, or may be formed by attaching a member different from the base portion 210 to the base portion 210.

As will be described in detail later, the light emitting panel 100 is moved by moving the light emitting panel 100 along the curved surface of the base part 210 while sandwiching the edge of the light emitting panel 100 between the holding part 220 and the base part 210. It is held by the holding member 200 in a curved state. At this time, the light emitting panel 100 is inserted between the base part 210 and the holding part 220 from the part of the holding member 200 where the holding part 220 is not formed, that is, the remaining one short side of the base part 210.

Next, the cross-sectional structure of the light emitting panel 100 will be explained using FIGS. 2 and 3. FIG. 3 is an enlarged view of the main part of FIG. The light emitting panel 100 includes a substrate 110, a light emitting section 120, a sealing film 130, and a covering member 140.

The substrate 110 is a transparent substrate such as a glass substrate or a resin substrate. The light emitting panel 100 has flexibility, and has a thickness of, for example, 10 μm or more and 1000 μm or less. When the substrate 110 is a resin substrate, the substrate 110 is formed using, for example, PEN (polyethylene naphthalate), PES (polyether sulfone), PET (polyethylene terephthalate), or polyimide. Further, when the substrate 110 is a resin substrate, a barrier made of an inorganic material such as _SiN layers are formed.

The light emitting section 120 has a first electrode 122, an organic layer 124, and a second electrode 126, as shown in FIG. The second electrode 126 overlaps the first electrode 122. Organic layer 124 is located between first electrode 122 and second electrode 126.

The first electrode 122 is a transparent electrode having light transmittance. The material of the transparent electrode is a material containing metal, for example, a metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide), or ZnO (Zinc Oxide). It is. The thickness of the first electrode 122 is, for example, 10 nm or more and 500 nm or less. The first electrode 122 is formed using, for example, a sputtering method or a vapor deposition method. Note that the first electrode 122 may be a conductive organic material such as carbon nanotubes or PEDOT/PSS.

The organic layer 124 has a light emitting layer. The organic layer 124 has, for example, a structure in which a hole injection layer, a light emitting layer, and an electron injection layer are laminated in this order. A hole transport layer may be formed between the hole injection layer and the light emitting layer. Further, an electron transport layer may be formed between the light emitting layer and the electron injection layer. The organic layer 124 may be formed by a vapor deposition method. Further, at least one layer of the organic layer 124, for example, a layer in contact with the first electrode 122, may be formed by a coating method such as an inkjet method, a printing method, or a spray method. Note that in this case, the remaining layers of the organic layer 124 are formed by a vapor deposition method. Moreover, all layers of the organic layer 124 may be formed using a coating method.

The second electrode 126 is made of, for example, a metal selected from the first group consisting of Al, Au, Ag, Pt, Mg, Sn, Zn, and In, or an alloy of metals selected from the first group. It contains a metal layer. In this case, the second electrode 126 has a light blocking property. The thickness of the second electrode 126 is, for example, 10 nm or more and 500 nm or less. However, the second electrode 126 may be formed using the material exemplified as the material of the first electrode 122. The second electrode 126 is formed using, for example, a sputtering method or a vapor deposition method.

Further, the edge of the first electrode 122 is covered with an insulating layer 128. The insulating layer 128 is made of, for example, a photosensitive resin such as polyimide. An organic layer 124 is formed inside a region of the first electrode 122 surrounded by an insulating layer 128 . Therefore, the light emitting region of the light emitting section 120 is determined by the insulating layer 128. By providing the insulating layer 128, it is possible to prevent the first electrode 122 and the second electrode 126 from shorting at the edge of the light emitting section 120.

The sealing film 130 is formed on the first surface of the substrate 110 and seals the light emitting section 120. The sealing film 130 is formed using a film forming method, for example, an ALD (Atomic Layer Deposition) method or a CVD method. When formed by the ALD method, the sealing film 130 is formed of a metal oxide film such as aluminum oxide, and has a thickness of, for example, 10 nm or more and 200 nm or less, preferably 50 nm or more and 100 nm or less. When formed by the CVD method, the sealing film 130 is formed of an inorganic insulating film such as a silicon oxide film, and the film thickness thereof is, for example, 0.1 μm or more and 10 μm or less. By providing the sealing film 130, the light emitting element 102 is protected from moisture and the like. The sealing film 130 may be formed by a sputtering method. In this case, the sealing film 130 is formed of an insulating film such as SiO ₂ or SiN. In that case, the film thickness is 10 nm or more and 1000 nm or less.

The covering member 140 is formed on the first surface of the substrate 110 and covers the sealing film 130 and the light emitting section 120. The covering member 140 also has the role of protecting the sealing film 130 and the light emitting section 120 from physical scratches and dirt. The covering member 140 is made of resin such as epoxy resin or acrylic resin. The thickness of the covering member 140 is, for example, 50 μm or more and 200 μm or less. The covering member 140 is formed, for example, by applying resin to a desired area using a mask or by applying resin to a desired area using a needle.

Further, the covering member 140 has a convex portion 142. The height of the convex portion 142 is, for example, 50 μm or more and 150 μm or less. The convex portion 142 is located closer to the center of the substrate 110 than the edge 112 of the substrate 110 is. More specifically, the upper surface of the convex portion 142 is a curved surface. When viewed from a direction perpendicular to the substrate 110, the upper end 143 of the convex portion 142 is located between the edge 112 and the organic layer 124. However, the upper end 143 of the convex portion 142 may be a flat surface. In this case, the entire surface is preferably located between the edge 112 and the organic layer 124. Note that the convex portion 142 is formed by making the portion that is to become the convex portion 142 thicker than other portions when applying the resin that will become the covering member 140.

Next, the cross-sectional structure of the light emitting device 10 in the longitudinal direction (first direction) will be described using FIG. 4. As shown in FIG. 1 and this figure, the surface of the base portion 210 that faces the light emitting panel 100 is a curved surface. Therefore, the holding member 200 holds the light emitting panel 100 in a state where bending stress is applied. On the other hand, since the light emitting panel 100 has elasticity, the light emitting panel 100 tends to return to its straight shape. Therefore, the longitudinal end of the light emitting panel 100 contacts the holding portion 220 of the holding member 200. On the other hand, the longitudinal center portion of the light emitting panel 100 contacts the base portion 210 of the holding member 200. Specifically, at the longitudinal end of the light emitting panel 100, the surface of the substrate 110 on the opposite side from the light emitting part 120 is in contact with the holding part 220, but the convex part 142 of the covering member 140 is in contact with the base It is not in contact with the portion 210. Further, in the longitudinal center of the light emitting panel 100, the convex portion 142 of the covering member 140 is in contact with the base portion 210, but the surface of the substrate 110 on the opposite side from the light emitting portion 120 is in contact with the holding portion 220. do not have. However, the convex portion 142 may be in contact with the base portion 210 at any location, or all three sides of the substrate 110 may be in contact with the holding portion 220.

FIG. 5 is a diagram for explaining a method of manufacturing the light emitting device 10. First, the light emitting panel 100 and the holding member 200 are prepared.

Next, as shown in FIG. 5(a), force is applied to the base portion 210 of the holding member 200 to bring the curved surface of the base portion 210 closer to a flat surface.

Next, as shown in FIG. 5(b), the light emitting panel 100 is inserted into the holding member 200 while keeping the curved surface of the base portion 210 close to a flat surface. At this time, since the convex portion 142 is formed on the covering member 140 of the light emitting panel 100, the contact area between the base portion 210 of the holding member 200 and the light emitting panel 100 becomes small. Therefore, the workload when inserting the light emitting panel 100 into the holding member 200 is reduced. Further, since the convex portion 142 of the covering member 140 is located inside the edge 112 of the substrate 110, the contact area between the covering member 140 and the holding portion 220 and the contact area between the covering member 140 and the holding member 200 are further reduced. . Therefore, the workload when inserting the light emitting panel 100 into the holding member 200 is further reduced.

Further, when viewed from a direction perpendicular to the substrate 110, the upper end 143 of the covering member 140 is located between the edge 112 of the substrate 110 and the organic layer 124. Therefore, when the light emitting panel 100 is inserted into the holding member 200, damage to the light emitting section 120 due to the force applied to the upper end 143 can be suppressed.

Thereafter, as shown in FIG. 5(c), the base portion 210 of the holding member 200 is opened. As a result, the base portion 210 curves, and the light emitting panel 100 also curves accordingly.

As described above, according to the present embodiment, since the convex portion 142 is formed on the covering member 140 of the light emitting panel 100, when the light emitting panel 100 is inserted into the holding member 200, the base portion 210 of the holding member 200 and the light emitting panel 100 The contact area becomes smaller. Therefore, the workload when inserting the light emitting panel 100 into the holding member 200 is reduced.

Although the embodiments and examples have been described above with reference to the drawings, these are merely illustrative of the present invention, and various configurations other than those described above may be adopted.

10 Light emitting device 100 Light emitting panel 110 Substrate 120 Light emitting part 122 First electrode 124 Organic layer 126 Second electrode 130 Sealing film 140 Covering member 142 Convex part 143 Upper end 200 Holding member 210 Base part 220 Holding part

Claims (6)

A luminescent panel,
a holding member that holds the light emitting panel;
Equipped with
The light emitting panel is
A substrate and
a light emitting part formed on the first surface of the substrate;
a covering member formed on the first surface of the substrate and covering the light emitting part;
Equipped with
The covering member has a convex portion located inside the substrate from an edge of the substrate and extending in a first direction,
The holding member is
a base portion facing the covering member and having a curved surface curved in a cross section in the first direction;
a holding part provided on the base part;
Equipped with
an end portion of the light emitting panel in the first direction is located between the base portion and the holding portion,
The light emitting panel is curved along the first direction,
In a central portion of the light emitting panel in the first direction, the convex portion is in contact with the curved surface of the base portion,
At the end portion of the light emitting panel in the first direction, the convex portion is spaced apart from the curved surface of the base portion,
In the light emitting device, at the end of the light emitting panel in the first direction, a surface of the light emitting panel opposite to a surface facing the curved surface is in contact with the holding part. The light emitting device according to claim 1,
The light emitting device, wherein the holding portion includes a portion formed along the edge of the substrate. The light emitting device according to claim 1 or 2,
A light emitting device, wherein the light emitting section includes a first electrode, a second electrode, and an organic layer located between the first electrode and the second electrode. The light emitting device according to any one of claims 1 to 3,
The light emitting device further includes a sealing film that seals the light emitting part and is covered with the covering member. The light emitting device according to claim 4,
In the light emitting device, the sealing film is formed of an inorganic insulating film. The light emitting device according to any one of claims 1 to 5,
In the light emitting device, the covering member is made of resin.

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