JP2022121653A - Light-emitting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce emission unevenness while improving design of an organic EL.

SOLUTION: A light-emitting device 10 includes a light emitting portion 140 and a conductive layer 170. The light emitting portion 140 is located on a first surface 101 side of a substrate 100. In addition, the light emitting portion 140 has a stacked structure including a first electrode 110, an organic layer 120, and a second electrode 130. The conductive layer 170 includes a first conductive portion 171 and a second conductive portion 172. The conductive layer 170 includes a material having a higher conductivity than the material of the first electrode 110. The first conductive portion 171 and the second conductive portion 172 are located between the light emitting portion 140 and an end portion 109 of the substrate 100.

SELECTED DRAWING: Figure 1

COPYRIGHT: (C)2022,JPO&INPIT

Description

The present invention relates to light emitting devices.

In recent years, development of light-emitting devices using organic EL has progressed. This light-emitting device is used as a lighting device or a display device, and has a structure in which an organic layer is sandwiched between a first electrode and a second electrode. Organic EL can be made thin, flexible, surface-emitting, etc., and can be applied to various designs.

Japanese Patent Application Laid-Open No. 2002-200000 describes that when the peripheral portion of a pixel region is an irregular-shaped portion such as a curved portion, a driver circuit is arranged along the irregular-shaped portion.

JP 2009-122636 A

However, when one light emitting portion is large, there is a possibility that uneven light emission may occur due to potential unevenness in the light emitting portion. As a method for suppressing the potential unevenness, there is a method of providing a bus line connected to the electrode, but from the viewpoint of design, it is not preferable to provide the bus line within the light emitting area.

One example of the problem to be solved by the present invention is to suppress uneven light emission while improving the design of the organic EL.

The first invention is
a light-emitting portion located on the first surface side of the substrate and having a laminated structure including a first electrode, an organic layer, and a second electrode;
A conductive layer having a first conductive portion and a second conductive portion and containing a material having a higher conductivity than the material of the first electrode,
The first conductive part and the second conductive part are light emitting devices located between the light emitting part and the edge of the substrate.

1 is a cross-sectional view illustrating the structure of a light emitting device according to an embodiment; FIG. 1 is a cross-sectional view showing a first configuration example of a light emitting device according to Example 1; FIG. 4 is a cross-sectional view showing a second configuration example of the light emitting device according to Example 1. FIG. FIG. 10 is a cross-sectional view showing a third configuration example of the light emitting device according to Example 1; FIG. 10 is a cross-sectional view illustrating the configuration of a light-emitting device according to Example 2; FIG. 11 is a plan view illustrating the configuration of a conductive layer of a light-emitting device according to Example 3; (a) to (c) are plan views illustrating the configuration of a conductive layer of a light-emitting device according to Example 3. FIG. (a) and (b) are plan views illustrating the configuration of a conductive layer of a light-emitting device according to Example 3. FIG. (a) and (b) are plan views illustrating the configuration of a conductive layer of a light-emitting device according to Example 4. FIG. FIG. 11 is a plan view illustrating the configuration of a light emitting device according to Example 5; FIG. 11 is a plan view illustrating the configuration of a light emitting device according to Example 5; FIG. 11 is a plan view illustrating the configuration of a light emitting device according to Example 5; FIG. 11 is a plan view illustrating the configuration of a light emitting device according to Example 5;

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in all the drawings, the same constituent elements are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

FIG. 1 is a cross-sectional view illustrating the structure of a light emitting device 10 according to an embodiment. The light-emitting device 10 includes a light-emitting section 140 and a conductive layer 170 . The light emitting section 140 is located on the first surface 101 side of the substrate 100 . Also, the light emitting part 140 has a stacked structure including the first electrode 110 , the organic layer 120 and the second electrode 130 . The conductive layer 170 has a first conductive portion 171 and a second conductive portion 172 . Conductive layer 170 includes a material with higher conductivity than the material of first electrode 110 . The first conductive portion 171 and the second conductive portion 172 are located between the light emitting portion 140 and the edge portion 109 of the substrate 100 . A detailed description is given below.

The light emitting device 10 is a lighting device or a display device. Light-emitting device 10 may be attached to a vehicle, for example, and used as a brake lamp or the like.

In the light-emitting device 10 , electric power is supplied to the light-emitting section 140 through the conductive layer 170 . Here, in order to improve the design of the light emitting device 10, the arrangement of the conductive layer 170 may be limited. In that case, in order to improve the uniformity of luminance of the light emitting section 140, the conductive layer 170 needs to be thickened to some extent. Here, the structure in which the conductive layer 170 has the first conductive portion 171 and the second conductive portion 172 disperses the stress, reduces the stress concentration in the conductive layer 170, and suppresses the occurrence of cracks. Moreover, even if a crack occurs, the crack is prevented from extending between the first conductive portion 171 and the second conductive portion 172 . Furthermore, the first electrode 110 has higher adhesion to the substrate 100 than the conductive layer 170 . Therefore, when the conductive layer 170 is provided between the first electrode 110 and the substrate 100, the conductive layer The adhesion of the entire 170 to the substrate 100 can be enhanced.

Although the material of the substrate 100 is not particularly limited, the substrate 100 is, for example, a translucent substrate such as a glass substrate or a resin substrate. The substrate 100 may have flexibility. When flexible, the thickness of the substrate 100 is, for example, 10 μm or more and 1000 μm or less. The shape of the substrate 100 is not particularly limited, and may be, for example, a polygon such as a rectangle, or a circle. The edge 109 of the substrate 100 may be curved when viewed in a direction perpendicular to the first surface 101 . When the substrate 100 is a resin substrate, the substrate 100 is made of, for example, PEN (polyethylene naphthalate), PES (polyethersulfone), PET (polyethylene terephthalate), polyimide, PC (polycarbonate), or olefin resin. formed. The substrate 100 may be an inorganic-organic hybrid substrate in which an inorganic material and an organic material are combined. Further, when the substrate 100 is a resin substrate, it is preferable that an inorganic barrier film is formed on at least one surface (preferably both surfaces) of the substrate 100 in order to suppress permeation of moisture through the substrate 100 . Examples of inorganic barrier films include SiN _x films, SiON films, silicon oxide films such as SiO _x , SiOC, and SiOCN, alumina oxide films such as Al ₂ O ₃ , titanium oxide films such as TiO ₂ , ZTO films, and combinations thereof. The substrate 100 may be flat, or the first surface 101 may be curved. Note that the edge of the substrate 100 is the edge of the substrate 100 seen from the direction perpendicular to the first surface 101, and is the outer periphery.

A light-emitting portion 140 is formed on the first surface 101 of the substrate 100 . The light-emitting section 140 has a laminated structure in which a translucent first electrode 110, an organic layer 120, and a light-shielding second electrode 130 are laminated in this order. The first electrode 110 is positioned between the substrate 100 and the second electrode 130 . Therefore, among the light emitted from the light emitting section 140, the light output to the first electrode 110 side has a higher intensity than the light output to the second electrode 130 side. That is, the second surface 102 opposite to the first surface 101 of the substrate 100 serves as a light output surface.

The first electrode 110 is a transparent electrode having optical transparency. The material of the transparent electrode is a metal-containing material, such as metal oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide), and ZnO (Zinc Oxide). The thickness of the first electrode 110 is, for example, 10 nm or more and 500 nm or less. The first electrode 110 is formed using, for example, sputtering or vapor deposition. The first electrode 110 may be a carbon nanotube or a conductive organic material such as PEDOT/PSS.

The organic layer 120 has a light-emitting layer. The organic layer 120 has, for example, a structure in which a hole injection layer, a light emitting layer, and an electron injection layer are laminated in this order. A hole transport layer may be formed between the hole injection layer and the light emitting layer. An electron transport layer may be formed between the light emitting layer and the electron injection layer. The organic layer 120 may be formed by a vapor deposition method. At least one layer of the organic layer 120, for example, the layer in contact with the first electrode 110, may be formed by a coating method such as an inkjet method, a printing method, or a spray method. In this case, the remaining layers of the organic layer 120 may be formed by a vapor deposition method, or all the layers of the organic layer 120 may be formed by using a coating method. All layers of the organic layer 120 may be formed using a vapor deposition method.

The second electrode 130 is, for example, a metal layer made of a metal selected from the group consisting of Al, Au, Ag, Pt, Mg, Sn, Zn, and In, or an alloy of metals selected from this group. contains. In this case, the second electrode 130 has light shielding properties. The thickness of the second electrode 130 is, for example, 10 nm or more and 500 nm or less. The second electrode 130 is formed using, for example, sputtering or vapor deposition. In the example shown in this figure, the second electrode 130 is wider than the first electrode 110 . Therefore, when viewed from a direction perpendicular to the first surface 101 of the substrate 100 , the entire first electrode 110 overlaps and is covered with the second electrode 130 in the width direction. Note that the first electrode 110 is wider than the second electrode 130, and when viewed from a direction perpendicular to the first surface 101 of the substrate 100, the entire second electrode 130 is the first electrode 110 in the width direction. They may overlap.

In the example of this figure, the first electrode 110 is divided into a plurality of regions, and a plurality of light emitting units 140 are provided on the first surface 101 of the substrate 100. The first electrode 110 is located on the first surface 101. , and may be one. In that case, one light emitting part 140 may be formed on the first surface 101 . Also, in the example of this figure, the first electrode 110 is formed for each light emitting section 140 , but the first electrode 110 may be formed continuously over a plurality of light emitting sections 140 . In the example of this figure, the organic layer 120 and the second electrode 130 are continuously formed over the plurality of light emitting portions 140 . However, the present invention is not limited to this example, and at least one of the organic layer 120 and the second electrode 130 may be formed for each light emitting section 140 .

At least a portion of the edge of the first electrode 110 is covered with an insulating film 150 . The insulating film 150 is made of, for example, a photosensitive resin material such as polyimide, and surrounds a portion of the first electrode 110 that serves as the light emitting portion 140 . The insulating film 150 may contain an inorganic insulating material. Examples of inorganic insulating materials include silicon oxides such as _SiOx , silicon oxynitrides such as SiON, and silicon nitrides such as _SiNx . Note that the insulating film 150 may or may not be formed between the plurality of light emitting portions 140 . In addition, in the example of this figure, a part of the insulating film 150 protrudes from the second electrode 130 when viewed from the direction perpendicular to the first surface 101 of the substrate 100 . In the example shown in this figure, the second electrode 130 is also formed on the insulating film 150 . In addition, when viewed from a direction perpendicular to the first surface 101 of the substrate 100 , a portion of the organic layer 120 overlaps the insulating film 150 . In the example shown in this figure, the organic layer 120 is also formed on the insulating film 150 .

The light emitting device 10 according to this embodiment further includes a sealing film 180 . The sealing film 180 is formed so as to cover the entire light emitting section 140 . The light emitting part 140 is positioned between the sealing film 180 and the substrate 100 . As the sealing film 180, for example, an inorganic barrier film such as _SiNx , SiON, _{Al2O3 , TiO2} , _SiOx , SiOC, or SiOCN, a barrier laminated film containing them, or a mixed film thereof may be used. can be done. These can be formed, for example, by a vacuum film forming method such as a sputtering method, a CVD method, an ALD method, or an EB vapor deposition method. In the example of this figure, part of the sealing film 180 is in contact with the first surface 101 . The light-emitting device 10 may be sealed using a plate-shaped sealing member instead of or in addition to the sealing film 180 . In that case, the sealing member is fixed to the substrate 100 via the adhesive layer. Also, a desiccant may be inserted between the sealing member and the adhesive.

Conductive layer 170 may function as an auxiliary electrode for first electrode 110 . As noted above, the conductive layer 170 comprises a material with a higher electrical conductivity than the material of the first electrode 110 . Also, the electrical resistivity of the conductive layer 170 is lower than the electrical resistivity of the first electrode 110 . Conductive layer 170 includes, for example, a metal selected from the group consisting of Al, Ag, Mo, and alloys containing these. Specifically, the conductive layer 170 can be APC (AgPdCu) or the like. The conductive layer 170 has a structure in which a first metal layer such as Mo or Mo alloy, a second metal layer such as Al or Al alloy, and a third metal layer such as Mo or Mo alloy are laminated in this order. may be

The thickness of conductive layer 170 is, for example, 100 nm or more and 3000 nm or less, and preferably 1000 nm or less from the viewpoint of preventing peeling and cracking. By including the conductive layer 170 in the light emitting device 10, even when the electrical resistance of the first electrode 110 is relatively high, it is possible to supply sufficient power to the entire light emitting section 140 and suppress uneven light emission. In the example of this figure, the conductive layer 170 is located between the substrate 100 and the first electrode 110 . That is, between the light-emitting portion 140 and the first conductive portion 171 , between the first conductive portion 171 and the second conductive portion 172 , and between the second conductive portion 172 and the edge portion 109 of the substrate 100 , One electrode 110 contacts the substrate 100 . Note that the stacking order of the conductive layer 170 and the first electrode 110 is not limited to the example shown in this figure. The conductive layer 170 may be located on the opposite side of the substrate 100 with respect to the first electrode 110 .

The conductive layer 170 is electrically connected with the first electrode 110 . At least a portion of the conductive layer 170 overlaps the first electrode 110 , and more preferably, the entire conductive layer 170 overlaps the first electrode 110 when viewed in a direction perpendicular to the first surface 101 .

The conductive layer 170 is located between the light emitting part 140 and the edge of the substrate 100 . Specifically, when viewed from the direction perpendicular to the first surface 101 of the substrate 100, the outer circumference of the light emitting section 140 and the outer circumference of the substrate 100 are separated from each other. The conductive layer 170 is located between the outer circumference of the light emitting section 140 and the outer circumference of the substrate 100 and extends along the outer circumference of the light emitting section 140 and the outer circumference of the substrate 100 . More specifically, in the example of this figure, the conductive layer 170 is positioned between the end portion 109 and the portion along the end portion 109 closest to the end portion 109 among the outer peripheries of the plurality of light emitting portions 140 .

When a plurality of light emitting units 140 are provided on the first surface 101 of the substrate 100, the conductive layer 170 may not be provided between the light emitting units 140 adjacent to each other. By doing so, the design of the light emitting device 10 can be improved.

When the first electrode 110 is integrated on the first surface 101 , conductive layers 170 may be provided on both ends of the first electrode 110 in a cross section intersecting the first surface 101 . That is, when the light-emitting device 10 has only one light-emitting section 140 , the conductive layer 170 may be provided along the outer circumference of the light-emitting section 140 so as to surround the light-emitting section 140 .

Conductive layer 170 includes a first conductive portion 171 and a second conductive portion 172 . The first conductive portion 171 and the second conductive portion 172 are arranged in parallel. Specifically, in the example of this figure, the first conductive portion 171 and the second conductive portion 172 each extend along the outer periphery of the light emitting portion 140 . Also, the first conductive portion 171 and the second conductive portion 172 are separated from each other. The second conductive portion 172 is located between the first conductive portion 171 and the edge 109 of the substrate 100 . However, the structures of the first conductive portion 171 and the second conductive portion 172 are not limited to the example shown in this figure.

The first conductive portion 171 and the second conductive portion 172 may be integrally connected. However, a region 173 in which no conductive layer is formed is provided at least partly between the first conductive portion 171 and the second conductive portion 172 . In the example of this figure in which the substrate 100 , the conductive layer 170 , and the first electrode 110 are laminated in this order, the first electrode 110 and the substrate 100 are in contact with each other at the region 173 . In other words, in an example where one surface of the conductive layer 170 is in contact with the substrate 100 and the other surface is in contact with the first electrode 110 as shown in this figure, the first electrode 110 and the substrate 100 are in contact with each other in the region 173. in contact with

Next, a method for manufacturing the light emitting device 10 will be described. First, the conductive layer 170 is formed on the substrate 100 by, for example, film formation by sputtering and patterning by etching. Next, the first electrode 110 is formed using, for example, a sputtering method. Then, the first electrode 110 is formed into a predetermined pattern using, for example, photolithography. An insulating layer 150 is then formed on the edge of the first electrode 110 . For example, when the insulating film 150 is made of a photosensitive resin, the insulating film 150 is formed into a predetermined pattern through exposure and development processes. Next, the organic layer 120 and the second electrode 130 are formed in this order. When the organic layer 120 includes a layer formed by vapor deposition, this layer is formed in a predetermined pattern, for example using a mask. The second electrode 130 is also formed in a predetermined pattern by using a mask, for example. Next, a sealing film 180 is formed to seal the light emitting section 140 .

When the substrate 100, the conductive layer 170 and the first electrode 110 are stacked in this order as in the example of FIG. 1, damage to the first electrode 110 due to etching of the conductive layer 170 can be avoided. For example, when the film formation temperature of the first electrode 110 is lowered in consideration of the heat resistance of the substrate, the resistance of the first electrode 110 to the etching process of the conductive layer 170 may be reduced, but the patterning of the conductive layer 170 is possible. By forming the first electrode 110 later, damage to the first electrode 110 is avoided.

In addition, although the example of the bottom emission type light-emitting device 10 was shown in this embodiment, it is not limited to it. For example, light emitting device 10 may be of a top emission type.

As described above, according to the present embodiment, the conductive layer 170 has the first conductive portion 171 and the second conductive portion 172 . Therefore, the stress in the conductive layer 170 is dispersed, the occurrence of cracks is reduced, and the extension of the cracks is suppressed. Furthermore, even if the arrangement of the conductive layer 170 is limited for the purpose of improving the design, etc., the conductive layer 170 can be made thicker to suppress uneven light emission of the light emitting section 140 .

(Example 1)
FIG. 2 is a cross-sectional view showing a first configuration example of the light emitting device 10 according to the first embodiment. FIG. 3 is a cross-sectional view showing a second configuration example of the light emitting device 10 according to the first embodiment. FIG. 4 is a cross-sectional view showing a third configuration example of the light emitting device 10 according to the first embodiment. 2 to 4 are enlarged views of the periphery of the first conductive portion 171 and the second conductive portion 172 in the cross section shown in FIG.

The light emitting device 10 according to this example has the same configuration as the light emitting device 10 according to the embodiment. In addition, the light emitting device 10 according to this embodiment further includes an underlying layer 174 located between the substrate 100 and the first conductive portion 171 . The underlying layer 174 contains the same material as the material contained in the first electrode 110 . In addition, in the examples of FIGS. 2 to 4, the underlying layer 174 is also located between the substrate 100 and the second conductive portion 172 . However, at least one of between the substrate 100 and the first conductive portion 171 and between the substrate 100 and the second conductive portion 172 may not be provided with the base layer 174 . The base layer 174 can function as an adhesive layer that improves adhesion between the substrate 100 and the conductive layer 170 .

As the material of the underlying layer 174, similar to the material of the first electrode 110, a material containing a metal, such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IWZO (Indium Tungsten Zinc Oxide), ZnO (Zinc Oxide), can be used. ) and other metal oxides. The thickness of the underlying layer 174 is, for example, 5 nm or more and 50 nm or less. The underlying layer 174 is formed using, for example, a sputtering method or a vapor deposition method. Note that the underlayer 174 may be carbon nanotubes or a conductive organic material such as PEDOT/PSS. Note that the underlying layer 174 may contain the same material as the material contained in the first electrode 110, and may further contain impurities, for example. Since the base layer 174 contains the same material as the material contained in the first electrode 110, the adhesion of the conductive layer 170 to the substrate 100 is improved.

The underlying layer 174 is deposited using, for example, a sputtering method. The base layer 174 is formed in a predetermined pattern with a resist pattern that is the same as or different from that of the conductive layer 170 .

A first configuration example of the light emitting device 10 according to the present embodiment will be described in detail with reference to FIG. When viewed from the direction perpendicular to the first surface 101 of the substrate 100 , the edge of the underlying layer 174 overlaps the edge of the first conductive portion 171 . Also, the edge of the underlying layer 174 overlaps the edge of the second conductive portion 172 . That is, the contour of the base layer 174 and the contour of the conductive layer 170 match when viewed from the direction perpendicular to the first surface 101 . In the case of this configuration example, the base layer 174 and the conductive layer 170 can be formed by patterning using the same resist pattern or the like. Therefore, it is easy to manufacture the light emitting device 10 .

A second configuration example of the light emitting device 10 according to the present embodiment will be described in detail with reference to FIG. In this configuration example, when viewed from the direction perpendicular to the first surface 101 of the substrate 100 , the end portion of the underlying layer 174 does not overlap the first conductive portion 171 . In addition, when viewed from the direction perpendicular to the first surface 101 of the substrate 100 , the end portion of the base layer 174 does not overlap the second conductive portion 172 . The underlying layer 174 is in contact with the first electrode 110 . In other words, the underlying layer 174 protrudes from the first conductive portion 171 and the second conductive portion 172 when viewed from the direction perpendicular to the first surface 101 . In the example of this figure, the first conductive part 171 and the second conductive part 172 are surrounded by the first electrode 110 and the base layer 174 in the cross section perpendicular to the extending direction, that is, the cross section shown in this figure. In the case of this configuration example, at least part of the surface of the underlying layer 174 opposite to the first surface 101 side is in contact with the first electrode 110 . Therefore, the first electrode 110 and the base layer 174 are more strongly adhered to each other, and the separation of the first conductive portion 171 and the second conductive portion 172 from the substrate 100 is further suppressed. However, the present invention is not limited to this example, and the end portion of the underlying layer 174 may overlap with a portion of the first conductive portion 171 .

A third configuration example of the light emitting device 10 according to the present embodiment will be described in detail with reference to FIG. In this configuration example, the underlying layer 174 is narrower than the conductive layer 170 . Specifically, when viewed from the direction perpendicular to the first surface 101 of the substrate 100 , the end portion of the base layer 174 overlaps the first conductive portion 171 . Also, the end of the underlying layer 174 overlaps the second conductive portion 172 . On the other hand, the end portion of the conductive layer 170 does not overlap with the underlying layer 174 . When the underlying layer 174 and the conductive layer 170 are patterned using the same resist pattern or the like, and the etching resistance of the conductive layer 170 is higher than the etching resistance of the underlying layer 174, the underlying layer 174 and the conductive layer 170 are formed in this manner. structure.

Note that the underlying layer 174 may not be formed at least partly between the first conductive portion 171 and the substrate 100 . Also, the base layer 174 may not be formed at least partly between the second conductive part 172 and the substrate 100 . Further, the base layer 174 may be continuously provided between the first conductive portion 171 and the substrate 100 and between the second conductive portion 172 and the substrate 100 . In that case, the underlying layer 174 and the first electrode 110 are in contact with each other in the region 173 .

As described above, according to the present example, the conductive layer 170 has the first conductive portion 171 and the second conductive portion 172 as in the embodiment. Therefore, the stress in the conductive layer 170 is dispersed, the occurrence of cracks is reduced, and the extension of the cracks is suppressed. Furthermore, even if the arrangement of the conductive layer 170 is limited for the purpose of improving the design, etc., the conductive layer 170 can be made thicker to suppress uneven light emission of the light emitting section 140 .

In addition, according to this embodiment, the light emitting device 10 further comprises an underlying layer 174 containing the same material as the material contained in the first electrode 110 . Therefore, the adhesion of the conductive layer 170 to the substrate 100 can be enhanced.

(Example 2)
FIG. 5 is a cross-sectional view illustrating the configuration of the light emitting device 10 according to the second embodiment. Similar to FIGS. 2 to 4, this figure is an enlarged view of the periphery of the first conductive portion 171 and the second conductive portion 172. FIG.

The light emitting device 10 according to this example has the same configuration as the light emitting device 10 according to the embodiment. Also, in this embodiment, the substrate 100, the first electrode 110, and the conductive layer 170 are laminated in this order. That is, the first electrode 110 is positioned between the conductive layer 170 and the substrate 100 . In the example of this figure in which the substrate 100 , the first electrode 110 , the conductive layer 170 , and the insulating film 150 are laminated in this order, the insulating film 150 and the first electrode 110 are in contact with each other in the region 173 .

Since the adhesion of the conductive layer 170 to the first electrode 110 is relatively high, peeling of the conductive layer 170 is suppressed by laminating the substrate 100, the first electrode 110, and the conductive layer 170 in this order.

As described above, according to the present example, the conductive layer 170 has the first conductive portion 171 and the second conductive portion 172 as in the embodiment. Therefore, the stress in the conductive layer 170 is dispersed, the occurrence of cracks is reduced, and the extension of the cracks is suppressed. Furthermore, even if the arrangement of the conductive layer 170 is limited for the purpose of improving the design, etc., the conductive layer 170 can be made thicker to suppress uneven light emission of the light emitting section 140 .

(Example 3)
6, 7(a) to 7(c), 8(a), and 8(b) are plan views illustrating the configuration of the conductive layer 170 of the light emitting device 10 according to Example 3. FIG. These figures show the state seen from the direction perpendicular to the first surface 101 . In addition, only the substrate 100, the conductive layer 170 and the light emitting section 140 are shown in these figures.

The light-emitting device 10 according to this example has the same configuration as the light-emitting device 10 according to at least one of the embodiment, the first example, and the second example. In the light-emitting device 10, the conductive layer 170 only needs to have at least the first conductive portion 171 and the second conductive portion 172, and can take various shapes and patterns.

Conductive layer 170 extends on first surface 101 along edge 109 of substrate 100 and edge of light emitting section 140 . Also, the first conductive portion 171 and the second conductive portion 172 are arranged in parallel. 6 and FIGS. 7A to 7C, the first conductive portion 171 and the second conductive portion 172 extend parallel to the direction in which the conductive layer 170 extends. That is, the first conductive portion 171 and the second conductive portion 172 each extend along the outer circumference of the light emitting portion 140 . Therefore, power can be stably supplied to the light emitting section 140 through the path along the outer periphery of the light emitting section 140 . In addition, the durability against stress in the direction perpendicular to the outer circumference of the light emitting section 140 is improved. On the other hand, in the examples of FIGS. 8A and 8B, the first conductive portion 171 and the second conductive portion 172 extend in a direction perpendicular to the direction in which the conductive layer 170 extends. Therefore, durability against stress in a direction parallel to the outer circumference of the light emitting section 140 is improved. Note that the conductive layer 170 in FIGS. 7A to 7C simultaneously has a plurality of conductive portions extending in a direction perpendicular to the extending direction of the conductive layer 170, and these conductive portions are arranged in the first direction. It can also be regarded as the conductive portion 171a and the second conductive portion 172a.

The width of the first conductive portion 171 and the width of the second conductive portion 172 may be the same, or may be different from each other. Also, the width of the first conductive portion 171 and the width of the second conductive portion 172 may or may not be constant. Here, the width of the first conductive portion 171 is the width in the direction perpendicular to the extending direction of the first conductive portion 171, and the width of the second conductive portion 172 is the width in the direction perpendicular to the extending direction of the second conductive portion 172. Width in direction.

In the examples of FIGS. 6 and 8A, the first conductive portion 171 and the second conductive portion 172 are separated from each other. That is, the first conductive portion 171 and the second conductive portion 172 are not connected through other portions of the conductive layer 170 . On the other hand, in the examples of FIGS. 7A to 7C and 8B, the first conductive portion 171 and the second conductive portion 172 are connected to each other by other portions of the conductive layer 170. FIG.

As described above, the region 173 where no conductive layer is formed is provided at least partly between the first conductive portion 171 and the second conductive portion 172 . By doing so, stress on the conductive layer 170 is relieved, and peeling and cracking of the conductive layer 170 are suppressed. In addition, the conductive layer 170 becomes less visible, and the design of the light emitting device 10 is improved. Assuming that the total length along the extending direction of the _first conductive portion 171 is L1, at the end portion of the first conductive portion 171 on the second conductive portion 172 side that has _a length of 0.2×L1 or more, Preferably, the first conductive portion 171 faces the region 173 . When the total length along the extending direction of the _second conductive portion 172 is L2, at the end of the second conductive portion 172 on the first conductive portion 171 side, the length of 0.2×L2 or _more is: Second conductive portion 172 preferably faces region 173 .

In the examples of FIGS. 7A to 7C, the conductive layer 170 is provided with an opening 175 between the first conductive portion 171 and the second conductive portion 172 . The shape of opening 175 is not particularly limited, and may be circular, elliptical, or rectangular, for example. In the example of FIGS. 7(a)-(c), the conductive layer 170 is provided with a plurality of openings 175. FIG. The shapes of the plurality of openings 175 may all be the same, or the shape of one or more openings 175 may be different from the shape of the other one or more openings 175 . A plurality of openings 175 are arranged, for example, periodically. Specifically, the plurality of openings 175 are arranged in a row in the example of FIG. 7(a), are arranged in a zigzag pattern in the example of FIG. 7(b), and are arranged in two rows in the example of FIG. 7(c). , and are arranged in a grid. The periphery of each opening 175 is surrounded by the conductive layer 170 when viewed from the direction perpendicular to the first surface 101 . Since the conductive layer 170 is provided with the opening 175 , stress is relieved, and peeling and cracking of the conductive layer 170 are suppressed.

As described above, according to the present example, the conductive layer 170 has the first conductive portion 171 and the second conductive portion 172 as in the embodiment. Therefore, the stress in the conductive layer 170 is dispersed, the occurrence of cracks is reduced, and the extension of the cracks is suppressed. Furthermore, even if the arrangement of the conductive layer 170 is limited for the purpose of improving the design, etc., the conductive layer 170 can be made thicker to suppress uneven light emission of the light emitting section 140 .

(Example 4)
9A and 9B are plan views illustrating the configuration of the conductive layer 170 of the light emitting device 10 according to Example 4. FIG. FIGS. 9A and 9B show the state seen from the direction perpendicular to the first surface 101. FIG. 9A and 9B, only the substrate 100, the conductive layer 170 and the light emitting section 140 are shown.

The light-emitting device 10 according to this example has the same configuration as the light-emitting device 10 according to at least one of the embodiments and examples 1 to 3. FIG. In this embodiment, the first conductive portion 171 and the second conductive portion 172 each extend along the outer periphery of the light emitting portion 140 .

The shape of the light-emitting portion 140 in the light-emitting device 10 is not particularly limited, and is designed in consideration of design. A wide portion and a thin portion may be generated in the light emitting portion 140 . In that case, regardless of the width of the light-emitting portion 140, the distance between the light-emitting portion 140 and the first conductive portion 171, the distance between the first conductive portion 171 and the second conductive portion 172, and the distance between the second conductive portion 172 and the substrate 100 The distance to the edge 109 can be set, or these distances can be made constant. On the other hand, by adjusting these distances in relation to the width of the light emitting section 140, the design of the light emitting device 10 can be further improved.

FIG. 9A is a diagram showing a first example of the relationship between the light emitting section 140 and the conductive layer 170. FIG. The second conductive portion 172 is located between the first conductive portion 171 and the edge 109 of the substrate 100 . In the light emitting device 10 of this example, the light emitting section 140 has a first region 141 and a second region 142 . The width of the first region 141 is the first width _wL1 , and the width of the second region 142 is the second width _wL2 . Here, the second width _wL2 is greater than the first width _wL1 . The distance d2 between the first conductive portion 171 closest to the second region 142 and the second conductive portion 172 closest to the _second region 142 is the distance d2 between the first conductive portion 171 closest to the first region 141 and the second It is larger than the distance d ₁ between the second conductive portion 172 closest to the 1 area 141 . Specifically, the greater the width of the light emitting portion 140, the greater the distance between the first conductive portion 171 and the second conductive portion 172 located closest to the region of that width. Note that the first width w _L1 and the second width w _L2 are widths in a direction perpendicular to the extending direction of the conductive layer 170, respectively.

FIG. 9B is a diagram showing a second example of the relationship between the light emitting section 140 and the conductive layer 170. As shown in FIG. The light emitting device 10 of this example is the same as the light emitting device 10 of the _first example except that the distance d2 is smaller _than the distance d1. Specifically, the larger the width of the light-emitting portion 140, the smaller the distance between the first conductive portion 171 and the second conductive portion 172 located closest to the region of that width.

In both the first example and the second example described above, the distance between the first conductive portion 171 and the second conductive portion 172 changes according to the width of the light emitting portion 140 . Therefore, the design of the light emitting device 10 is improved.

Further, in the first example, the distance d _i2 between the first conductive portion 171 closest to the second region 142 and the second region 142 is is greater than the distance d _i1 between Also by doing so, the design of the light emitting device 10 can be improved. In addition, the distance d _o2 between the second conductive portion 172 closest to the second region 142 and the edge 109 of the substrate 100 is the distance between the second conductive portion 172 closest to the first region 141 and the first region 141 . greater than the distance d _o1 between Also by doing so, the design of the light emitting device 10 can be improved.

In a second example, distance d _i2 is smaller than distance d _i1 . Also by doing so, the design of the light emitting device 10 can be improved. In addition, the distance _do2 is smaller than the distance _do1 . Also by doing so, the design of the light emitting device 10 can be improved.

At least one of the distance between the light-emitting portion 140 and the first conductive portion 171, the distance between the first conductive portion 171 and the second conductive portion 172, and the distance between the second conductive portion 172 and the end portion 109 is used to emit light. It may be constant regardless of the width of the portion 140 or may be varied regardless of the width of the light emitting portion 140 .

In this embodiment, the width of the first conductive portion 171 is substantially constant regardless of the width of the light emitting portion 140 . Therefore, it is possible to prevent cracks or the like from occurring due to concentration of stress on a specific location of the first conductive portion 171 . Specifically, when the width of the first conductive portion 171 closest to the first region 141 is w _c11 and the width of the first conductive portion 171 closest to the second region 142 is w _c12 , |w _c11 −w _c12 |/w _c11 is preferably 0 or more and 0.1 or less. The width of the first conductive portion 171 is the width in the direction perpendicular to the extending direction of the first conductive portion 171 .

Also, in this embodiment, the width of the second conductive portion 172 is substantially constant regardless of the width of the light emitting portion 140 . Therefore, it is possible to prevent cracks or the like from occurring due to concentration of stress on a specific location of the second conductive portion 172 . Specifically, when the width of the second conductive portion 172 closest to the first region 141 is w _c21 and the width of the second conductive portion 172 closest to the second region 142 is w _c22 , |w _c21 −w _c22 |/w _c21 is preferably 0 or more and 0.1 or less. The width of the second conductive portion 172 is the width in the direction perpendicular to the extending direction of the second conductive portion 172 .

As described above, according to the present example, the conductive layer 170 has the first conductive portion 171 and the second conductive portion 172 as in the embodiment. Therefore, the stress in the conductive layer 170 is dispersed, the occurrence of cracks is reduced, and the extension of the cracks is suppressed. Furthermore, even if the arrangement of the conductive layer 170 is limited for the purpose of improving the design, etc., the conductive layer 170 can be made thicker to suppress uneven light emission of the light emitting section 140 .

(Example 5)
10 to 13 are plan views illustrating the configuration of the light emitting device 10 according to Example 5. FIG. 10 to 13 show the light emitting device 10 viewed from the first surface 101 side of the substrate 100, that is, the side opposite to the light output surface. In FIG. 10, the sealing film 180 is indicated by broken lines. FIG. 11 is a diagram excluding the sealing film 180 and the second electrode 130 from FIG. 10, and the outer periphery of the organic layer 120 is indicated by a dashed line. FIG. 12 is a diagram of FIG. 11 with the organic layer 120 and the insulating film 150 removed. FIG. 13 is a diagram of FIG. 12 with the first electrode 110 removed, and the outer periphery of the light emitting section 140 is indicated by a dashed line. FIG. 1 corresponds to the AA section of FIG.

In this embodiment, substrate 100 surrounds third region 106 . Further, the substrate 100 is cut off in a fourth region 107 connected to the third region 106 .

In other words, the fourth region 107 connects the third region 106 located inside the substrate 100 and the external region 108 located outside the substrate 100 . In other words, the third region 106 is the hollow portion of the substrate 100 and the fourth region 107 is the notch portion of the substrate 100 .

Also, in this embodiment, the edge 109 of the substrate 100 includes a first edge 103 , a second edge 104 and a third edge 105 . The maximum distance between the first ends 103 of the ends 109 of the substrate 100 that face each other with the third region 106 therebetween is the _third distance d3. The distance between the second ends 104 of the ends 109 of the substrate 100 facing each other with the fourth region 107 therebetween is a _fourth distance d4. And the _fourth distance d4 is smaller than the _third distance d3.

Further, in this embodiment, the substrate 100 has a first end 103a, a first end 103b and a third end 105a, and the first end 103a and the third end 105a are at the edges of the substrate 100. continuous along the Here, the first end portion 103a is one end portion of the substrate 100, and the first end portion 103b is an end portion facing the first end portion 103a with the third region 106 interposed therebetween. The third end 105a is the end of the substrate 100 opposite to the first end 103a.

Thus, in the light-emitting device 10 according to this embodiment, the substrate 100 surrounding the third region 106 is cut off at the fourth region 107 . Therefore, even if the substrate 100 is arranged along a curved surface, for example, the fourth region 107 absorbs excess or deficiency in size, so that the light emitting device 10 is less likely to be twisted or wrinkled. Also, the light-emitting device 10 with excellent design can be obtained.

In this embodiment, the conductive layer 170 is along the periphery of the light emitting section 140 . More specifically, the first conductive portion 171 and the second conductive portion 172 are along the outer circumference of the light emitting portion 140 . Therefore, even when no conductive portion is provided between the plurality of light emitting portions 140, sufficient power can be supplied to the light emitting portions 140, and uneven light emission can be suppressed.

In addition, when a mask is used to form the organic layer 120 and the second electrode 130 in a predetermined pattern, the supporting portion for fixing the portion of the mask corresponding to the first end portion 103 to the vapor deposition apparatus is the second electrode. 4 area 107 can be overlapped. Therefore, even if the substrate 100 has a hollow portion, the light emitting device 10 can be manufactured by patterning easily.

In the light emitting device 10 according to this embodiment, the substrate 100 has one or more sets of first end portions 103 facing each other. That is, the first end portion 103 includes a first end portion 103a and a first end portion 103b facing each other. The first end 103 is the edge of the inner circumference of the substrate 100 . The first end 103a and the first end 103b are connected to each other directly or via another end. When viewed from the direction perpendicular to the first surface 101 of the substrate 100, the first end 103a and the first end 103b may be parallel or non-parallel to each other. Also, the first end portion 103a and the first end portion 103b may be straight or curved. Both the first end 103 a and the first end 103 b face the third region 106 .

Substrate 100 has a third end 105 . The third end 105 is the outer edge of the substrate 100 . In the example of this figure, the third end 105 includes a third end 105a and a third end 105b. The third end 105a is the end of the substrate 100 opposite to the first end 103a, and the third end 105b is the end of the substrate 100 opposite to the first end 103b. The third end 105a and the third end 105b are connected to each other directly or via another end. When viewed from the direction perpendicular to the first surface 101 of the substrate 100, the third end 105a and the third end 105b may be parallel or non-parallel to each other. Further, the third end portion 105a and the third end portion 105b may be straight or curved. Both the third end 105 a and the third end 105 b face the external region 108 . In the example of this figure, the first end portion 103 and the third end portion 105 are substantially similar to each other, but the first end portion 103 and the third end portion 105 may have different shapes.

The substrate 100 has one or more sets of second ends 104 facing each other. That is, the second end portion 104 includes a second end portion 104a and a second end portion 104b that face each other. In the example of this figure, the second end 104 connects the first end 103 and the third end 105 . Specifically, the second end 104a connects the first end 103a and the third end 105a, and the second end 104b connects the first end 103b and the third end 105b. . One end of the second end portion 104a and one end of the second end portion 104b are connected via at least the first end portion 103a and the first end portion 103b, and the other end of the second end portion 104a and the second end portion are connected to each other. The other end of the end portion 104b is connected via at least the third end portion 105a and the third end portion 105b. Together, the first end 103, the second end 104, and the third end 105 form one closed area, which coincides with the area where the substrate 100 resides. When viewed from the direction perpendicular to the first surface 101 of the substrate 100, the second end 104a and the second end 104b may or may not be parallel to each other. Further, the second end portion 104a and the second end portion 104b may be straight lines, curved lines, or vertices of the substrate 100, respectively. Both the second end 104 a and the second end 104 b face the fourth region 107 .

A plurality of light emitting devices 10 according to this embodiment can be used in combination. Specifically, the substrate 100 of one light emitting device 10 can be connected through the third region 106 of another light emitting device 10 . By doing so, it is possible to further improve the overall design by using a plurality of light emitting devices 10 .

The light emitting device 10 according to this embodiment further includes a first terminal 112 and a second terminal 132 . First terminal 112 and second terminal 132 will be described in detail with reference to FIG. Both the first terminal 112 and the second terminal 132 are formed on the same surface of the substrate 100 as the light emitting section 140 . At least a portion of the first terminal 112 and the second terminal 132 are positioned outside the sealing film 180 . The first terminals 112 include first terminals 112a to 112d, and the second terminals 132 include second terminals 132a to 132c.

The first terminal 112 is electrically connected to the first electrode 110 . In the example shown in this figure, the first terminal 112 is connected to the conductive layer 170 . The first terminals 112a are located at both ends of the conductive layer 170a in the extending direction. Here, the conductive layer 170a is the conductive layer 170 positioned between the third end portion 105 and the portion along the third end portion 105 closest to the third end portion 105 among the outer circumferences of the plurality of light emitting portions 140. be. The first terminals 112b are located at both ends in the extending direction of the conductive layer 170b. Here, the conductive layer 170b is positioned between the first end portion 103 and the portion along the first end portion 103 closest to the first end portion 103 among the outer circumferences of the plurality of light emitting portions 140. is. First terminal 112 a and first terminal 112 b are located at second end 104 . The two first terminals 112a face each other, and the two first terminals 112b face each other. The first terminal 112 c is connected in the middle of the conductive layer 170 a and positioned between the conductive layer 170 a and the third end portion 105 . The first terminal 112 d is connected in the middle of the conductive layer 170 b and positioned between the conductive layer 170 b and the first end portion 103 . Note that the light emitting device 10 may not include at least one of the first terminals 112a to 112d.

The second terminal 132 is electrically connected to the second electrode 130 . In the example shown in this figure, at least part of the second electrode 130 is connected to the second terminal 132 over the insulating film 150 . The second terminals 132a are respectively arranged at the second ends 104, and the two second terminals 132a face each other. A second terminal 132 b is located between the conductive layer 170 a and the third end 105 . A second terminal 132 c is located between the conductive layer 170 b and the first end 103 . The second terminal 132b is aligned with the first terminal 112c, and the second terminal 132c is aligned with the first terminal 112d. The second terminal 132a is located between the first terminal 112a and the first terminal 112b. Note that the light emitting device 10 may not include at least one of the second terminals 132a to 132c.

The first terminal 112 and the second terminal 132 have, for example, at least one of a layer made of the same material as the conductive layer 170 and a layer made of the same material as the first electrode 110. . A layer formed of the same material as the conductive layer 170 in the first terminal 112 and the second terminal 132 can be formed in the same process as the conductive layer 170 . Therefore, the conductive layer 170 may be integrated with at least part of the layers of the first terminal 112 .

In the example of this figure, a plurality of light-emitting portions 140 are provided on the first surface 101 of the substrate 100 . Specifically, the light-emitting device 10 has two segments of the light-emitting portion 140 . The plurality of light emitting units 140 have the same shape as the substrate 100 as a whole. However, the present invention is not limited to this example, and only one light emitting unit 140 may be provided on the first surface 101 of the substrate 100 . Also, the shape of the light emitting part 140 may be different from the shape of the substrate 100 when viewed from the direction perpendicular to the first surface 101 .

In the example shown in this figure, one conductive layer 170 is formed for each light emitting section 140 . Specifically, the conductive layer 170 is formed along one edge of the light emitting section 140 . However, the present invention is not limited to this example, and the conductive layers 170 may be formed on both sides of one light emitting section 140 .

A positive terminal of the control circuit is connected to the first terminal 112 via a conductive member such as a flexible cable, a bonding wire or a lead terminal, and a conductive member such as a flexible cable, a bonding wire or a lead terminal is connected to the second terminal 132. is connected to the negative terminal of the control circuit.

In this embodiment, the substrate 100 as a whole has a hollow heart shape. The hollowed out portion is the third region 106 . However, the shapes of the substrate 100 and the light emitting section 140 are not limited to this example, and may be circular, rectangular, polygonal, star-shaped, or the like. However, at least part of the edge of the light emitting section 140 is preferably along the edge of the substrate 100 . Moreover, it is preferable that the substrate 100 is not closed in a circular shape, but is discontinued at the fourth region 107 as described above.

As described above, according to the present example, the conductive layer 170 has the first conductive portion 171 and the second conductive portion 172 as in the embodiment. Therefore, the stress in the conductive layer 170 is dispersed, the occurrence of cracks is reduced, and the extension of the cracks is suppressed. Furthermore, even if the arrangement of the conductive layer 170 is limited for the purpose of improving the design, etc., the conductive layer 170 can be made thicker to suppress uneven light emission of the light emitting section 140 .

Although the embodiments and examples have been described above with reference to the drawings, these are examples of the present invention, and various configurations other than those described above can be adopted.
Examples of reference forms are added below.
1.
a light-emitting portion located on the first surface side of the substrate and having a laminated structure including a first electrode, an organic layer, and a second electrode;
A conductive layer having a first conductive portion and a second conductive portion and containing a material having a higher conductivity than the material of the first electrode,
The light-emitting device, wherein the first conductive portion and the second conductive portion are positioned between the light-emitting portion and an end portion of the substrate.
2.
1. In the light emitting device according to
between the light-emitting portion and the first conductive portion, between the first conductive portion and the second conductive portion, and between the second conductive portion and the edge of the substrate, the first electrode is a light-emitting device in contact with the substrate;
3.
2. In the light emitting device according to
A light-emitting device in which one surface of the conductive layer is in contact with the substrate and the other surface is in contact with the first electrode.
4.
2. or 3. In the light emitting device according to
The light emitting device further comprising an underlying layer that includes the same material as the material included in the first electrode and that is positioned between the substrate and the first conductive portion.
5.
4. In the light emitting device according to
A light-emitting device in which an end portion of the underlayer overlaps an end portion of the first conductive portion when viewed from a direction perpendicular to the first surface.
6.
4. In the light emitting device according to
When viewed from a direction perpendicular to the first surface, an end portion of the underlying layer does not overlap the first conductive portion,
The light emitting device, wherein the base layer is in contact with the first electrode.
7.
1. to 6. In the light emitting device according to any one of
The light-emitting device, wherein the first conductive portion and the second conductive portion each extend along the outer periphery of the light-emitting portion.
8.
1. to 7. In the light emitting device according to any one of
The light-emitting device according to claim 1, wherein the conductive layer is provided with an opening between the first conductive portion and the second conductive portion, and the opening is circular, elliptical, or rectangular.
9.
1. to 7. In the light emitting device according to any one of
The light emitting device, wherein the first conductive portion and the second conductive portion are separated from each other.
10.
1. to 9. In the light emitting device according to any one of
The light emitting unit has a first region and a second region,
The width of the first region is a first width,
The width of the second region is a second width larger than the first width,
The distance between the first conductive portion and the second conductive portion closest to the second region is larger than the distance between the first conductive portion and the second conductive portion closest to the first region. Device.
11.
1. to 9. In the light emitting device according to any one of
The light emitting unit has a first region and a second region,
The width of the first region is a first width,
The width of the second region is a second width larger than the first width,
A distance between the first conductive part and the second conductive part closest to the second region is smaller than a distance between the first conductive part and the second conductive part closest to the first region. Device.
12.
10. or 11. In the light emitting device according to
When the width of the first conductive portion closest to the first region is w _c11 and the width of the first conductive portion closest to the second region is w _c12 , |w _c11 −w _c12 |/w _c11 is 0 or more and 0.1 or less.
13.
1. to 12. In the light emitting device according to any one of
A maximum distance between first end portions of the edge portions of the substrate that face each other through a third region is a third distance, and second ends of the edge portions of the substrate that face each other through a fourth region are the maximum distance. the distance between the parts is a fourth distance that is smaller than the third distance;
the substrate surrounds the third region, and the substrate is discontinued in the fourth region connected to the third region;
The light emitting device, wherein the first conductive portion and the second conductive portion are along the periphery of the light emitting portion.
14.
1. to 13. In the light emitting device according to any one of
The first electrode has translucency,
The light emitting device, wherein the conductive layer is electrically connected to the first electrode.
15.
1. to 14. In the light emitting device according to any one of
The light emitting device, wherein the first conductive portion and the second conductive portion are arranged in parallel.

10 Light emitting device 100 Substrate 101 First surface 102 Second surface 103, 103a, 103b First end 104, 104a, 104b Second end 105, 105a, 105b Third end 106 Third region 107 Fourth region 108 Outside Region 109 Edge 110 First electrode 112, 112a, 112b, 112c, 112d First terminal 120 Organic layer 130 Second electrode 132, 132a, 132b, 132c Second terminal 140 Light emitting part 141 First region 142 Second region 150 Insulation Films 170, 170a, 170b Conductive layers 171, 171a First conductive portions 172, 172a Second conductive portion 174 Base layer 175 Opening 180 Sealing film

Claims (1)

a light-emitting portion located on the first surface side of the substrate and having a laminated structure including a first electrode, an organic layer, and a second electrode;
A conductive layer having a first conductive portion and a second conductive portion and containing a material having a higher conductivity than the material of the first electrode,
The light-emitting device, wherein the first conductive portion and the second conductive portion are positioned between the light-emitting portion and an end portion of the substrate.

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