JP2016064540A5 - - Google Patents

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Publication number
JP2016064540A5
JP2016064540A5 JP2014193672A JP2014193672A JP2016064540A5 JP 2016064540 A5 JP2016064540 A5 JP 2016064540A5 JP 2014193672 A JP2014193672 A JP 2014193672A JP 2014193672 A JP2014193672 A JP 2014193672A JP 2016064540 A5 JP2016064540 A5 JP 2016064540A5
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JP
Japan
Prior art keywords
region
opening
width
silicon substrate
supply path
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JP2014193672A
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English (en)
Japanese (ja)
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JP6395539B2 (ja
JP2016064540A (ja
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Priority to JP2014193672A priority Critical patent/JP6395539B2/ja
Priority claimed from JP2014193672A external-priority patent/JP6395539B2/ja
Priority to US14/860,536 priority patent/US9669628B2/en
Publication of JP2016064540A publication Critical patent/JP2016064540A/ja
Publication of JP2016064540A5 publication Critical patent/JP2016064540A5/ja
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JP2014193672A 2014-09-24 2014-09-24 液体吐出ヘッド用基板の製造方法、及びシリコン基板の加工方法 Active JP6395539B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014193672A JP6395539B2 (ja) 2014-09-24 2014-09-24 液体吐出ヘッド用基板の製造方法、及びシリコン基板の加工方法
US14/860,536 US9669628B2 (en) 2014-09-24 2015-09-21 Liquid ejection head substrate, method of manufacturing the same, and method of processing silicon substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014193672A JP6395539B2 (ja) 2014-09-24 2014-09-24 液体吐出ヘッド用基板の製造方法、及びシリコン基板の加工方法

Publications (3)

Publication Number Publication Date
JP2016064540A JP2016064540A (ja) 2016-04-28
JP2016064540A5 true JP2016064540A5 (enExample) 2017-10-12
JP6395539B2 JP6395539B2 (ja) 2018-09-26

Family

ID=55524947

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014193672A Active JP6395539B2 (ja) 2014-09-24 2014-09-24 液体吐出ヘッド用基板の製造方法、及びシリコン基板の加工方法

Country Status (2)

Country Link
US (1) US9669628B2 (enExample)
JP (1) JP6395539B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11014359B2 (en) * 2018-09-21 2021-05-25 Fujifilm Dimatix, Inc. Internal print head flow features
WO2021008700A1 (en) * 2019-07-17 2021-01-21 Scrona Ag Inkjet print head with contamination robustness
JP2023097080A (ja) * 2021-12-27 2023-07-07 花王株式会社 インクジェット記録用水系インク

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3984689B2 (ja) 1996-11-11 2007-10-03 キヤノン株式会社 インクジェットヘッドの製造方法
JPH11348282A (ja) 1998-06-09 1999-12-21 Seiko Epson Corp インクジェットヘッド及びその製造方法
JP2001162802A (ja) 1999-12-07 2001-06-19 Fuji Xerox Co Ltd インクジェットヘッド及びその作製方法
US6805432B1 (en) 2001-07-31 2004-10-19 Hewlett-Packard Development Company, L.P. Fluid ejecting device with fluid feed slot
US6648454B1 (en) * 2002-10-30 2003-11-18 Hewlett-Packard Development Company, L.P. Slotted substrate and method of making
JP4854336B2 (ja) 2006-03-07 2012-01-18 キヤノン株式会社 インクジェットヘッド用基板の製造方法
JP2009006552A (ja) * 2007-06-27 2009-01-15 Canon Inc インクジェット記録ヘッドおよびインクジェット記録装置
AT507226B1 (de) * 2008-08-28 2010-09-15 Univ Wien Tech Mikrofluidvorrichtung
JP5329932B2 (ja) * 2008-12-08 2013-10-30 佐藤 一雄 シリコン微細構造体の製造方法及び微細流路デバイスの製造方法
US8251497B2 (en) * 2008-12-18 2012-08-28 Eastman Kodak Company Injection molded mounting substrate
KR20100081557A (ko) * 2009-01-06 2010-07-15 삼성전자주식회사 잉크젯 프린트헤드의 잉크피드홀 및 그 형성방법
JP5455461B2 (ja) * 2009-06-17 2014-03-26 キヤノン株式会社 シリコン基板の加工方法及び液体吐出ヘッド用基板の製造方法
JP5738025B2 (ja) * 2011-03-18 2015-06-17 キヤノン株式会社 液体吐出ヘッド
JP2013028155A (ja) * 2011-06-21 2013-02-07 Canon Inc 液体吐出ヘッド用基板の製造方法
US20140307029A1 (en) * 2013-04-10 2014-10-16 Yonglin Xie Printhead including tuned liquid channel manifold

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