JP2016064461A - 炭化珪素粉末 - Google Patents
炭化珪素粉末 Download PDFInfo
- Publication number
- JP2016064461A JP2016064461A JP2014194114A JP2014194114A JP2016064461A JP 2016064461 A JP2016064461 A JP 2016064461A JP 2014194114 A JP2014194114 A JP 2014194114A JP 2014194114 A JP2014194114 A JP 2014194114A JP 2016064461 A JP2016064461 A JP 2016064461A
- Authority
- JP
- Japan
- Prior art keywords
- silicon carbide
- content
- ppm
- less
- carbide powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title claims abstract description 84
- 239000006061 abrasive grain Substances 0.000 abstract description 31
- 238000000034 method Methods 0.000 abstract description 10
- 238000004904 shortening Methods 0.000 abstract description 2
- 239000010936 titanium Substances 0.000 description 48
- 229910010271 silicon carbide Inorganic materials 0.000 description 40
- 238000005422 blasting Methods 0.000 description 26
- 229910052719 titanium Inorganic materials 0.000 description 22
- 229910052720 vanadium Inorganic materials 0.000 description 22
- 235000012431 wafers Nutrition 0.000 description 13
- 238000000859 sublimation Methods 0.000 description 11
- 230000008022 sublimation Effects 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 10
- 239000000843 powder Substances 0.000 description 10
- 238000005245 sintering Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000009616 inductively coupled plasma Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 238000010532 solid phase synthesis reaction Methods 0.000 description 2
- 238000001308 synthesis method Methods 0.000 description 2
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 2
- HMDDXIMCDZRSNE-UHFFFAOYSA-N [C].[Si] Chemical compound [C].[Si] HMDDXIMCDZRSNE-UHFFFAOYSA-N 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- 239000006104 solid solution Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000012798 spherical particle Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Ceramic Products (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
Description
炭化珪素砥粒となる炭化珪素粉末は、アチソン法によって製造した。
比較例1〜3の炭化珪素砥粒は、Ti含有量が0.5ppm未満であった。比較例1〜3では、加工時間が5.2時間を超え実施例1〜10と比較して非常に長く、標準偏差は1.8μm〜2.1μmであって、実施例1〜8と比較して突起高さのばらつきは大きかった。
比較例4の炭化珪素砥粒は、Ti含有量が15.0ppm越え、且つV含有量が0.3ppm未満であった。比較例4は、加工時間が4.9時間となり実施例1〜10と比較して非常に長く、標準偏差は2.5μmであって、突起高さのばらつきが最も大きくなった。
Claims (4)
- Ti含有量が0.5ppm以上15.0ppm以下であることを特徴とする炭化珪素粉末。
- ブラスト加工の砥粒であることを特徴とする請求項1に記載の炭化珪素粉末。
- V含有量が0.3ppm以上15.0ppm以下であることを特徴とする請求項1又は2に記載の炭化珪素粉末。
- Ti含有量とV含有量の合計が15.0ppm以下であることを特徴とする請求項1から3の何れか1項に記載の炭化珪素粉末。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014194114A JP2016064461A (ja) | 2014-09-24 | 2014-09-24 | 炭化珪素粉末 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014194114A JP2016064461A (ja) | 2014-09-24 | 2014-09-24 | 炭化珪素粉末 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2016064461A true JP2016064461A (ja) | 2016-04-28 |
Family
ID=55804737
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014194114A Pending JP2016064461A (ja) | 2014-09-24 | 2014-09-24 | 炭化珪素粉末 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2016064461A (ja) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5969473A (ja) * | 1982-10-06 | 1984-04-19 | 株式会社日立製作所 | 電気絶縁性焼結材用炭化けい素粉末組成物 |
JPS6461308A (en) * | 1987-09-01 | 1989-03-08 | Tokai Konetsu Kogyo Kk | Production of high-purity silicon carbide powder |
JPH04236290A (ja) * | 1991-01-18 | 1992-08-25 | Tokai Carbon Co Ltd | SiC砥粒とその製造方法 |
JP2000297273A (ja) * | 1998-03-17 | 2000-10-24 | Tosoh Corp | セラミックス微小粒研磨材およびその製造方法 |
JP2000331910A (ja) * | 1999-05-20 | 2000-11-30 | Ushio Inc | レジスト硬化装置 |
JP2003313019A (ja) * | 2002-04-22 | 2003-11-06 | Hitachi Ltd | 炭素材料及びその製造方法 |
JP2008103703A (ja) * | 2006-09-20 | 2008-05-01 | Canon Inc | 基板保持装置、該基板保持装置を備える露光装置、およびデバイス製造方法 |
JP2013164132A (ja) * | 2012-02-10 | 2013-08-22 | Nsk Ltd | 自動調心ころ軸受及びその製造方法 |
-
2014
- 2014-09-24 JP JP2014194114A patent/JP2016064461A/ja active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5969473A (ja) * | 1982-10-06 | 1984-04-19 | 株式会社日立製作所 | 電気絶縁性焼結材用炭化けい素粉末組成物 |
JPS6461308A (en) * | 1987-09-01 | 1989-03-08 | Tokai Konetsu Kogyo Kk | Production of high-purity silicon carbide powder |
JPH04236290A (ja) * | 1991-01-18 | 1992-08-25 | Tokai Carbon Co Ltd | SiC砥粒とその製造方法 |
JP2000297273A (ja) * | 1998-03-17 | 2000-10-24 | Tosoh Corp | セラミックス微小粒研磨材およびその製造方法 |
JP2000331910A (ja) * | 1999-05-20 | 2000-11-30 | Ushio Inc | レジスト硬化装置 |
JP2003313019A (ja) * | 2002-04-22 | 2003-11-06 | Hitachi Ltd | 炭素材料及びその製造方法 |
JP2008103703A (ja) * | 2006-09-20 | 2008-05-01 | Canon Inc | 基板保持装置、該基板保持装置を備える露光装置、およびデバイス製造方法 |
JP2013164132A (ja) * | 2012-02-10 | 2013-08-22 | Nsk Ltd | 自動調心ころ軸受及びその製造方法 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102447432B1 (ko) | 포커스링, 포커스링의 제조방법 및 반도체소자의 제조방법 | |
JP2009263187A (ja) | イットリア焼結体およびプラズマプロセス装置用部材 | |
JP4798693B2 (ja) | プラズマ処理装置用イットリアセラミックス部品及びその製造方法 | |
CN102658529A (zh) | 一种超细磨粒纳米磨削制备纳米颗粒方法 | |
JP2008108926A (ja) | ウェハ熱処理用治具 | |
JP2016064461A (ja) | 炭化珪素粉末 | |
JP2014125422A (ja) | 酸化物焼結体、酸化物焼結体スパッタリングターゲットおよびその製造方法 | |
JP2017226585A (ja) | 炭化珪素粉末 | |
TWI844193B (zh) | 碳化矽粉末以及製造碳化矽晶圓的方法 | |
KR102581526B1 (ko) | 탄화규소 분말, 이의 제조방법 및 이를 이용하여 탄화규소 잉곳을 제조하는 방법 | |
KR102442731B1 (ko) | 탄화규소 분말 및 이를 이용하여 탄화규소 잉곳을 제조하는 방법 | |
JP2007223828A (ja) | イットリアセラミックス焼結体およびその製造方法 | |
KR102442730B1 (ko) | 탄화규소 분말, 이를 이용하여 탄화규소 잉곳을 제조하는 방법 및 탄화규소 웨이퍼 | |
JP7515200B2 (ja) | 炭化ケイ素粉末、これを用いて炭化ケイ素インゴットを製造する方法並びに炭化ケイ素ウエハ | |
CN108424145A (zh) | 一种碳化硅陶瓷的微型部件的生产工艺 | |
KR102567936B1 (ko) | 탄화규소 분말, 이의 제조방법 및 이를 이용하여 탄화규소 잉곳을 제조하는 방법 | |
US20240076191A1 (en) | Silicon carbide powder and method for manufacturing silicon carbide ingot using the same | |
JP6312431B2 (ja) | 炭化珪素質焼結体の製造方法 | |
JP5825659B2 (ja) | アルミナ質セラミックスおよびその製造方法 | |
JP2008195973A (ja) | プラズマ処理装置用セラミックスおよびその製造方法 | |
JP2005272161A (ja) | 半導体もしくは液晶製造装置用部材の製造方法 | |
JP2005119915A (ja) | 半導体プラズマ処理装置用多結晶アルミナセラミックス部品 | |
JP2010221344A (ja) | 半導体研磨布用コンディショナー、半導体研磨布用コンディショナーの製造方法及び半導体研磨装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170315 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20171222 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180206 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180406 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20180731 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20180919 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20181106 |