JP2016063226A5 - - Google Patents

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Publication number
JP2016063226A5
JP2016063226A5 JP2015178095A JP2015178095A JP2016063226A5 JP 2016063226 A5 JP2016063226 A5 JP 2016063226A5 JP 2015178095 A JP2015178095 A JP 2015178095A JP 2015178095 A JP2015178095 A JP 2015178095A JP 2016063226 A5 JP2016063226 A5 JP 2016063226A5
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JP
Japan
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component
applying
material deposited
hno3
components
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JP2015178095A
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Japanese (ja)
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JP2016063226A (ja
JP6584249B2 (ja
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Priority claimed from US14/525,118 external-priority patent/US9406534B2/en
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JP2015178095A 2014-09-17 2015-09-10 プラズマ処理チャンバの構成部品を洗浄する湿式洗浄工程 Active JP6584249B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201462051920P 2014-09-17 2014-09-17
US62/051,920 2014-09-17
US14/525,118 2014-10-27
US14/525,118 US9406534B2 (en) 2014-09-17 2014-10-27 Wet clean process for cleaning plasma processing chamber components

Publications (3)

Publication Number Publication Date
JP2016063226A JP2016063226A (ja) 2016-04-25
JP2016063226A5 true JP2016063226A5 (https=) 2018-10-18
JP6584249B2 JP6584249B2 (ja) 2019-10-02

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ID=55455446

Family Applications (1)

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JP2015178095A Active JP6584249B2 (ja) 2014-09-17 2015-09-10 プラズマ処理チャンバの構成部品を洗浄する湿式洗浄工程

Country Status (5)

Country Link
US (1) US9406534B2 (https=)
JP (1) JP6584249B2 (https=)
KR (1) KR20160033056A (https=)
CN (1) CN105428210B (https=)
TW (1) TWI693651B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20190070639A1 (en) * 2017-09-07 2019-03-07 Applied Materials, Inc. Automatic cleaning machine for cleaning process kits
KR102461911B1 (ko) * 2018-07-13 2022-10-31 삼성전자주식회사 플라즈마 제네레이터, 이를 포함하는 세정수 처리 장치, 반도체 세정 장치 및 세정수 처리 방법
US11488848B2 (en) * 2018-07-31 2022-11-01 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated semiconductor die vessel processing workstations
KR102836261B1 (ko) * 2018-09-21 2025-07-18 램 리써치 코포레이션 플라즈마 프로세싱 챔버를 컨디셔닝하기 위한 방법
KR102156980B1 (ko) * 2018-11-28 2020-09-16 배기백 차량의 크롬몰딩 복원방법
KR102024757B1 (ko) * 2019-02-15 2019-09-24 (주)에이텍솔루션 이온 소스의 세정 방법 및 이를 이용한 반도체 소자의 제조 방법
KR102027183B1 (ko) * 2019-03-08 2019-10-01 (주)에이텍솔루션 이온 소스의 세정 방법 및 이를 이용한 반도체 소자의 제조 방법
WO2021126889A1 (en) * 2019-12-17 2021-06-24 Applied Materials, Inc. Surface profiling and texturing of chamber components
CN111534825B (zh) * 2020-05-14 2022-05-31 富乐德科技发展(大连)有限公司 去除半导体设备不锈钢部件钛及氮化钛沉积膜的工艺
US20210391150A1 (en) * 2020-06-10 2021-12-16 Plasma-Therm Llc Plasma Source Configuration
US12237186B2 (en) * 2022-09-15 2025-02-25 Applied Materials, Inc. On-board cleaning of tooling parts in hybrid bonding tool
CN118988887A (zh) * 2024-09-26 2024-11-22 安徽富乐德科技发展股份有限公司 一种带有复杂的空腔结构的shower head的清洗工艺

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100265289B1 (ko) * 1998-01-26 2000-09-15 윤종용 플라즈마식각장치의 캐소우드 제조방법 및 이에 따라 제조되는 캐소우드
KR100445273B1 (ko) * 2001-10-26 2004-08-21 손정하 세라믹 절연체의 세정방법
CN100382230C (zh) * 2002-04-17 2008-04-16 兰姆研究公司 硅电极及其生产方法、生产硅部件及加工半导体晶片方法
US6902628B2 (en) * 2002-11-25 2005-06-07 Applied Materials, Inc. Method of cleaning a coated process chamber component
US7045072B2 (en) * 2003-07-24 2006-05-16 Tan Samantha S H Cleaning process and apparatus for silicate materials
US7077918B2 (en) * 2004-01-29 2006-07-18 Unaxis Balzers Ltd. Stripping apparatus and method for removal of coatings on metal surfaces
US20090142247A1 (en) * 2007-12-03 2009-06-04 Applied Materials, Inc. Chemical treatment to reduce machining-induced sub-surface damage in semiconductor processing components comprising silicon carbide
ES2764249T3 (es) * 2008-05-02 2020-06-02 Oerlikon Surface Solutions Ag Pfaeffikon Procedimiento para decapar piezas de trabajo y solución de decapado
US8075701B2 (en) * 2008-06-30 2011-12-13 Lam Research Corporation Processes for reconditioning multi-component electrodes
US8734586B2 (en) * 2012-02-02 2014-05-27 Sematech, Inc. Process for cleaning shield surfaces in deposition systems

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