JP2016059927A5 - - Google Patents
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- Publication number
- JP2016059927A5 JP2016059927A5 JP2014187670A JP2014187670A JP2016059927A5 JP 2016059927 A5 JP2016059927 A5 JP 2016059927A5 JP 2014187670 A JP2014187670 A JP 2014187670A JP 2014187670 A JP2014187670 A JP 2014187670A JP 2016059927 A5 JP2016059927 A5 JP 2016059927A5
- Authority
- JP
- Japan
- Prior art keywords
- guide tube
- solder
- axial direction
- iron according
- soldering iron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- 238000005476 soldering Methods 0.000 claims description 5
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000010276 construction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014187670A JP2016059927A (ja) | 2014-09-16 | 2014-09-16 | 半田鏝 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014187670A JP2016059927A (ja) | 2014-09-16 | 2014-09-16 | 半田鏝 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016059927A JP2016059927A (ja) | 2016-04-25 |
| JP2016059927A5 true JP2016059927A5 (zh) | 2017-10-26 |
Family
ID=55796803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014187670A Pending JP2016059927A (ja) | 2014-09-16 | 2014-09-16 | 半田鏝 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2016059927A (zh) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6004029B1 (ja) | 2015-03-26 | 2016-10-05 | 株式会社アンド | 半田処理装置 |
| JP6782662B2 (ja) * | 2017-04-25 | 2020-11-11 | 株式会社パラット | 半田付け製品製造方法、半田付け製品、半田付け方法、および半田付け装置 |
| EP3493659A4 (en) * | 2016-07-30 | 2020-04-29 | Parat Co., Ltd. | BRAZING DEVICE AND BRAZING METHOD |
| JP7005542B2 (ja) * | 2019-02-14 | 2022-01-21 | 三菱電機株式会社 | はんだ付け装置および電子部品の製造方法 |
| CN112512226A (zh) * | 2020-11-06 | 2021-03-16 | 杭州杉芽科技有限公司 | 一种避免溢流的电子产品定量贴片装置 |
| CN115041861B (zh) * | 2022-04-24 | 2023-12-08 | 宁波亿利邦铝业有限公司 | 具有高耐腐蚀性能的可焊锡铝带及其制备工艺、设备 |
| CN115592337B (zh) * | 2022-12-14 | 2023-04-07 | 深圳市科美达自动化设备有限公司 | 转子焊压敏治具 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60121460U (ja) * | 1984-01-17 | 1985-08-16 | 関西日本電気株式会社 | ハンダコテ |
| JP2010272605A (ja) * | 2009-05-20 | 2010-12-02 | Mitsuo Ebisawa | リード線等の微小半田付けによる電子機器製造方法とそのための半田鏝 |
-
2014
- 2014-09-16 JP JP2014187670A patent/JP2016059927A/ja active Pending
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