JP2016056422A - Member for terminal and method for manufacturing the same, and terminal for connector - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a member for a terminal capable of obtaining a terminal for a connector having wear resistance and having heat resistance more excellent than that of conventional ones, and to provide a terminal for a connector having wear resistance and having heat resistance more excellent than that of conventional ones.SOLUTION: A member 1 for a terminal includes a substrate 10 made of copper and a copper alloy, a first layer 11 made of Ni and a Ni alloy and formed on the substrate 10, a second layer 12 made of a Cu-Sn alloy and formed on the first layer 11, a third layer 13 made of an Ag-Sn alloy and formed on the second layer 12, and a fourth layer 14 made of Ag or an Ag alloy, formed on the third layer 13 and exposed on the uppermost surface. The member 1 for a terminal is obtained by heating a plating member including a first plating layer 21 comprising Ni plating and the like, a second plating layer 22 consisting of Cu-Sn alloy plating, a third plating layer 23 comprising Sn plating and the like, and a fourth plating layer 24 comprising Ag plating and the like on the substrate 10 in this order.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a terminal member, a manufacturing method thereof, and a connector terminal.

  In recent years, with the widespread use of hybrid vehicles and electric vehicles, opportunities for large currents to flow through connector terminals are increasing. High current connector terminals are required to have heat resistance because they generate a large amount of heat when energized. Moreover, the terminal size of the connector increases in accordance with the current capacity. For this reason, the connector terminal tends to have a large fitting force with the counterpart connector terminal, and thus the surface of the terminal is easily damaged. Moreover, there are many insertions / extractions by maintenance etc. Therefore, wear resistance is required for the connector terminal.

  Conventionally, as a terminal member used for a connector terminal, a terminal member in which an Sn plating layer is formed on the surface of a base material made of copper or a copper alloy is generally known.

  In addition, for example, in Patent Document 1, a base material made of copper or a copper alloy, a base layer made of Ni covering the surface of the base material, an Ag—Sn alloy layer covering the surface of the base layer, and Ag—Sn A terminal member having an Ag layer covering the surface of the alloy layer and exposed on the outermost surface is disclosed. Further, the same document discloses a manufacturing method for forming the terminal member by forming an Ag plating layer, an Sn plating layer, and an Ag plating layer in this order on the substrate and heating them. . Further, the same document discloses a connector terminal made of the terminal member.

Japanese Patent No. 5387742

  However, the conventional technology has room for improvement in the following points. That is, the general terminal member described above is composed of an Sn plating layer whose outermost layer is relatively soft. Therefore, the connector terminal formed using this terminal member is inferior in wear resistance.

  On the other hand, the member for terminals of patent documents 1 has an Ag-Sn alloy layer and an Ag layer which covers the surface of an Ag-Sn alloy layer. Therefore, the connector terminal formed using this terminal member has wear resistance due to the reduction of the friction coefficient. However, the terminal member of Patent Document 1 further suppresses diffusion of copper atoms contained in the base material to the outermost surface by further improvement, and when used for a connector terminal, there is room for exhibiting excellent heat resistance. Is still left.

  The present invention has been made in view of the above background, and has a wear resistance and a terminal member capable of obtaining a connector terminal superior in heat resistance as compared with the prior art, and also has wear resistance. In addition, the present invention intends to provide a connector terminal that is superior in heat resistance as compared with the prior art.

One aspect of the present invention is a substrate made of copper or a copper alloy;
A first layer formed on the substrate and made of Ni or Ni alloy;
A second layer formed on the first layer and made of a Cu-Sn alloy;
A third layer formed on the second layer and made of an Ag-Sn alloy;
And a fourth layer made of Ag or an Ag alloy, which is formed on the third layer and exposed on the outermost surface.

Another aspect of the present invention is a method for manufacturing the terminal member,
On a base material made of copper or copper alloy, a first plating layer made of Ni plating or Ni alloy plating, a second plating layer made of Cu-Sn alloy plating, a third plating layer made of Sn plating or Sn alloy plating, and A preparation step of preparing a plating member having a fourth plating layer made of Ag plating or Ag alloy plating in this order;
By heating the plating member, the first layer composed of the first plating layer, the second layer composed of the second plating layer, the third plating layer, and a part of the fourth plating layer, And a heating step for obtaining the third layer made of an Ag—Sn alloy formed by alloying and the fourth layer made of the remainder of the fourth plating layer. In the manufacturing method.

  Still another embodiment of the present invention lies in a connector terminal which is formed using the terminal member.

  The terminal member has a third layer made of an Ag—Sn alloy, and a fourth layer made of Ag or an Ag alloy, which is formed on the third layer and exposed on the outermost surface. . In the terminal member, a fourth layer made of Ag or Ag alloy is formed on a third layer made of Ag—Sn alloy which is harder than Ag or Ag alloy. Therefore, when the terminal member is used for a connector terminal, the friction coefficient on the surface of the fourth layer can be reduced as compared with the case where the third layer is made of the same material as the fourth layer. Abrasion can be ensured.

  The terminal member includes a first layer made of Ni or a Ni alloy between the base material and the fourth layer, a second layer made of the Cu—Sn alloy formed on the first layer, and have. Therefore, diffusion of copper atoms contained in the base material to the outermost surface is first suppressed by the first layer. And when there exists a copper atom which passed the 1st layer, the further spreading | diffusion to the outermost surface of the said copper atom is suppressed by the 2nd layer arrange | positioned above the 1st layer. Therefore, when the terminal member is used as a connector terminal, the copper atoms of the base material are unlikely to reach the outermost surface due to heat generated by a large current, and copper oxide is not easily formed on the outermost surface. Therefore, when the terminal member is used as a connector terminal, it is possible to exhibit excellent heat resistance due to the effects of the first layer and the second layer.

  Therefore, according to the terminal member, it is possible to obtain a connector terminal having wear resistance and superior heat resistance as compared with the conventional one.

  The manufacturing method of the said member for terminals has the preparation process and heating process which were mentioned above. Therefore, according to the method for manufacturing the terminal member, the terminal member is obtained.

  In particular, according to the method for manufacturing a terminal member, a terminal member having a third layer made of an Ag—Sn alloy having almost no voids in the layer can be obtained. This is because the plating member having the above-described laminated structure is heated, so that when the third layer made of the Ag—Sn alloy is formed, a nest that causes voids is hardly generated in the layer. Inferred. When a large number of voids are generated in the Ag—Sn alloy, chipping or cracking occurs starting from the void, and the Ag—Sn alloy is peeled off to promote wear. Therefore, according to the method for manufacturing a terminal member, a terminal having excellent wear resistance that not only exhibits wear resistance by reducing a friction coefficient but also can suppress acceleration of wear caused by voids. A member for use is obtained.

  Since the connector terminal is formed by using the terminal member, the connector terminal has wear resistance and is excellent in heat resistance as compared with the conventional case.

FIG. 3 is an explanatory diagram schematically showing a laminated structure of a terminal member in Example 1. It is explanatory drawing which showed typically the laminated structure of the plating member prepared with the manufacturing method of the member for terminals of Example 1. FIG. It is a scanning electron micrograph of the member for terminals of sample 1 in an example of an experiment. It is a scanning electron micrograph of the member for terminals of comparative sample 1 in an experimental example. In an experimental example, it is a scanning electron micrograph for demonstrating acceleration | stimulation of the abrasion resulting from a void. In an experiment example, it is another scanning electron micrograph for explaining promotion of wear resulting from a void.

  The terminal member will be described.

  Specifically, the terminal member can have a plate shape or the like, for example. In this case, the terminal member may have each layer on one side or both sides. Each layer may be partially formed on a part of the surface of the terminal member, or may be formed on the entire surface of the terminal member.

  In the terminal member, the thickness of the first layer is preferably 0.2 μm or more, more preferably, from the viewpoint of ensuring the effect of suppressing the diffusion of copper atoms from the substrate. It can be 5 μm or more. In addition, the thickness of the first layer is preferably 3 μm or less, more preferably 2.5 μm or less, from the viewpoint of bending workability (cracking prevention) and the like.

  The thickness of the second layer is preferably 0.1 μm or more from the viewpoint of ensuring the effect of suppressing the diffusion of copper atoms from the base material and further the diffusion of Ni atoms from the first layer. Preferably, it can be 0.2 μm or more. The thickness of the second layer is preferably 1 μm or less, more preferably 0.5 μm or less, from the viewpoint of bending workability (cracking prevention) and the like.

  The thickness of the third layer is preferably 1 μm or more, more preferably 2 μm or more, from the viewpoint of easily improving the wear resistance by reducing the friction coefficient on the surface of the fourth layer. The thickness of the third layer can be set to 45 μm or less, for example, from the viewpoint of productivity, reduction of manufacturing cost, and the like.

  The thickness of the fourth layer can be configured to be thinner than the thickness of the third layer. In this case, the fourth layer is easily affected by the relatively hard third layer in the lower layer, and it becomes easy to improve the wear resistance by reducing the friction coefficient on the surface of the fourth layer. Further, since the fourth layer is less softened by heat, the heat resistance is improved accordingly. The thickness of the fourth layer is specifically preferably 0.5 μm or more, more preferably 0.8 μm or more, and further preferably 1 μm or more, from the viewpoint of ensuring good conductivity, for example. It can be.

  In the terminal member, the fourth layer is preferably made of Ag. In this case, when used as a connector terminal, the contact resistance of the electrical contact portion of the connector terminal can be easily reduced. In addition, there is an advantage that it is easy to ensure low friction.

  In the terminal member, the third layer preferably has no voids in the layer. In this case, when used as a connector terminal, chipping or cracking occurs starting from the void, and the Ag—Sn alloy does not easily peel off, so that excellent wear resistance can be obtained. In addition, the above-mentioned void means a hollow portion that causes peeling of the Ag-Sn alloy as a starting point of chipping or cracking of the Ag-Sn alloy when the connector terminal is used, leading to accelerated wear. To do. Accordingly, a minute cavity that does not lead to the above-described wear promotion is allowed inside the third layer. The presence or absence of voids in the layer can be determined by cross-sectional observation using a scanning electron microscope.

  Next, a method for manufacturing the terminal member will be described.

  In the method for manufacturing a terminal member, the third plating layer in the plating member is preferably made of Sn, and the fourth plating layer is preferably made of Ag. In this case, there is an advantage that it is easy to obtain the third layer made of Ag—Sn alloy and the fourth layer made of Ag in the heating step.

  The thickness of the first plating layer in the plating member is preferably 0.2 μm or more, more preferably 0.5 μm or more from the viewpoint of ensuring the effect of suppressing the diffusion of copper atoms from the substrate. More preferably, it can be 0.8 μm or more. The thickness of the first plating layer is preferably 3 μm or less, more preferably 2.5 μm or less, and even more preferably 2 μm or less, from the viewpoint of bending workability (cracking prevention) and the like.

  The thickness of the second plating layer is preferably 0.1 μm or more from the viewpoint of ensuring the effect of suppressing the diffusion of copper atoms from the substrate and the diffusion of Ni atoms from the first plating layer. More preferably, it can be 0.2 μm or more. In addition, the thickness of the second plating layer is preferably 1 μm or less, more preferably 0.5 μm or less, from the viewpoint of bending workability (cracking prevention) and the like.

  In addition, the thickness of a 3rd plating layer and a 4th plating layer can be adjusted to an optimal thickness ratio so that the 3rd layer and the 4th layer which were mentioned above may be formed by the heating of a plating member. Specifically, considering the mass number and density of Sn and Ag, Sn does not remain by the alloying, and Ag in the fourth plating layer remains even after the Ag is consumed by the alloying. Thus, the ratio of the thicknesses of the third plating layer and the fourth plating layer can be set. More specifically, when the Sn film thickness is 1, the thickness of each layer can be set using the point that Ag with a film thickness of 1.9 reacts without excess or deficiency.

  The thickness of the third plating layer is preferably in the range of 0.5 to 15 μm, more preferably in the range of 0.5 to 3 μm, from the viewpoint of ensuring the formation of the third layer.

  The thickness of the fourth plating layer is preferably 1 to 30 μm, more preferably 1 to 4 μm from the viewpoint of ensuring the formation of the fourth layer.

  In the method for manufacturing the terminal member, the heating atmosphere when the plating member is heated can be, for example, an air atmosphere. The heating temperature can be set to a temperature equal to or higher than the melting point of Sn from the viewpoint of promoting alloying of the Ag—Sn alloy. More specifically, the heating temperature is preferably 240 ° C. or higher, more preferably 250 ° C. or higher, and still more preferably 260 ° C. or higher. The heating temperature can be preferably 300 ° C. or less from the viewpoint of preventing oxidation of Sn and the like. The heating time is preferably 0.1 minutes or more, more preferably 0.2 minutes or more, and further preferably 0.5 minutes or more from the viewpoint of promoting alloying of the Ag—Sn alloy. can do. The heating time is preferably 3 minutes or less, more preferably 2 minutes or less, and even more preferably 1.5 minutes or less from the viewpoint of preventing oxidation of Sn or the like.

  In addition, as a heating method of a plating member, for example, a reflow furnace, energization heating, high frequency induction heating, or the like can be used.

  In the method for manufacturing a terminal member, a plating member is prepared by preparing a pre-plating member having a first plating layer, a second plating layer, and a third plating layer in this order on a substrate. It can be prepared by forming a fourth plating layer on the third plating layer.

  In this case, since a pre-plated member prepared separately is used, it is only necessary to form the fourth plating layer on the third plating layer. Therefore, the plating process necessary for preparing the plating member is not complicated, and the productivity of the terminal member can be improved.

  Next, the connector terminal will be described.

  Specifically, the connector terminal can be configured as a male terminal, a female terminal, a relay terminal, or the like. More specifically, the connector terminal has, for example, an electrical contact portion that comes into contact with the mating connector terminal, and at least the above-described layers are laminated on the base material in the electrical contact portion. Can do. The electrical contact portion is likely to be a problem of wear due to contact with the mating connector terminal, and wear resistance is required. Moreover, the electrical contact portion is likely to have a problem of an increase in contact resistance due to copper oxide caused by thermal diffusion of copper atoms of the base material, and is required to have heat resistance. Therefore, in this case, the above-described effects can be sufficiently exerted.

  However, the connector terminal may have, for example, a structure in which each of the above-described layers is laminated on all base materials except for a fractured surface portion by punching, or all including a fractured surface portion by punching. You may have the structure by which each layer mentioned above was laminated | stacked on this base material.

  In addition, each structure mentioned above can be arbitrarily combined as needed, in order to acquire each effect etc. which were mentioned above.

  Hereinafter, the member for terminals of the example, its manufacturing method, and the connector terminal will be described with reference to the drawings. In addition, about the same member, it demonstrates using the same code | symbol.

(Example 1)
A terminal member, a manufacturing method thereof, and a connector terminal of Example 1 will be described with reference to FIGS. As shown in FIG. 1, the terminal member 1 of this example includes a base material 10, a first layer 11 formed on the base material 10, and a second layer 12 formed on the first layer 11. And a third layer 13 formed on the second layer 12 and a fourth layer 14 formed on the third layer 13. The fourth layer 14 is exposed on the outermost surface. The substrate 10 and the first layer 11, the first layer 11 and the second layer 12, the second layer 12 and the third layer 13, and the third layer 13 and the fourth layer 14 are in contact with each other.

  The substrate 10 is made of copper or a copper alloy. The first layer 11 is made of Ni or Ni alloy. The second layer 12 is made of a Cu—Sn alloy. The third layer 13 is made of an Ag—Sn alloy. The fourth layer 14 is made of Ag or an Ag alloy. Specifically, in this example, the first layer 11 is made of Ni, and the fourth layer 14 is made of Ag.

  In this example, the thickness of the first layer 11 is 0.5 μm. The thickness of the second layer 12 is 0.6 μm. The thickness of the third layer 13 is 1.1 μm. The thickness of the fourth layer 14 is 1.0 μm. Further, the terminal member 1 does not have voids in the third layer 13 (except for the interface between the second layer 12 and the fourth layer 14).

  The manufacturing method of the member for terminals of this example has a preparation process and a heating process.

  In the preparation step, the plating member 2 is prepared. The plating member 2 has a first plating layer 21, a second plating layer 22, a third plating layer 23, and a fourth plating layer 24 in this order on the substrate 10. The substrate 10 is made of copper or a copper alloy. The first plating layer 21 is made of Ni plating or Ni alloy plating. The second plating layer 22 is made of Cu—Sn alloy plating. The third plating layer 23 is made of Sn plating or Sn alloy plating. The fourth plating layer 24 is made of Ag or an Ag alloy. In this example, specifically, the 3rd plating layer 23 consists of Sn plating, and the 4th plating layer 24 consists of Ag plating.

  In the present example, the thickness of the first plating layer 21 is 0.5 μm. The thickness of the second plating layer 22 is 0.6 μm. The thickness of the third plating layer 23 is 0.5 μm. The thickness of the fourth plating layer is 2.0 μm.

  In this example, the plating member 2 prepares in advance a pre-plating member (not shown) having the first plating layer 21, the second plating layer 22, and the third plating layer 23 in this order on the substrate 10. This is prepared by forming the fourth plating layer 24 on the third plating layer 23 of the pre-plating member.

  In the manufacturing method of the member for terminals of this example, the plating member 2 is heated in the heating step. Specifically, the heating condition is an air atmosphere at 290 ° C. for 1 minute. Heating in the heating step is performed using a reflow furnace.

  The connector terminal (not shown) of this example is formed using the terminal member 1 of this example. Specifically, the connector terminal has an electrical contact portion that comes into contact with a counterpart connector terminal (not shown), and the layers 11 to 14 are laminated on the base material 10 in the electrical contact portion. In a portion other than the electrical contact portion, a Ni layer and a Sn layer are laminated in this order on the base material 10. The connector terminal of this example is formed by punching the terminal member 1 on the plate into a terminal shape and bending it. In this example, the base material 10 is exposed at the fracture surface due to the punching.

<Experimental example>
Hereinafter, it demonstrates more concretely using an experiment example.

(Sample 1)
On a base material made of a copper alloy plate, a first plating layer made of Ni plating (thickness 0.5 μm), a second plating layer made of Cu—Sn alloy plating (thickness 0.6 μm), and a first plating layer made of Sn plating. A pre-plated member having three plating layers (thickness 0.5 μm) in this order was prepared.

The pre-plated member is formed with a Ni plated layer, a Cu plated layer, and a Sn plated layer in this order on the surface of a substrate made of a clean copper alloy plate in the following conditions, and then at 290 ° C. for 60 seconds. It produced by giving the reflow process which heats.
<Ni plating layer>
Uses a plating bath containing NiSO ₄ · 6H ₂ O 240 g / L, NiCl ₂ · 6H ₂ O 30 g / L, H ₃ BO ₃ 30 g / L
・ Current density: 5ASD
<Cu plating layer>
Uses a plating bath containing CuSO ₄ 250 g / L, H ₂ SO ₄ 80 g / L, and brightener 10 g / L. Operating temperature 45 ° C.
・ Current density: 5ASD
<Sn plating layer>
Use of a plating bath containing SnSO ₄ 50 g / L, H ₂ SO ₄ 80 g / L, cresolsulfonic acid: 30 g / L, brightener 10 g / L
・ Current density: 3ASD

Next, electroplating was performed on the third plating layer of the pre-plated member under the following conditions to form a fourth plating layer made of Ag plating. Thereby, the plating member A was prepared.
<4th plating layer>
・ A plating bath with an Ag concentration of 45 g / L is used. ・ Operating temperature: 30 ° C.
・ Current density: 5ASD
・ Thickness: 2μm

Next, the plated member A was heated in the atmosphere at 290 ° C. for 1 minute. Thereby, the member for terminals of sample 1 was obtained. A cross-sectional SEM photograph of the obtained terminal member of Sample 1 is shown in FIG. As shown in FIG. 3, by performing the heat treatment, the first layer 11 (thickness 0.5 μm) made of the first plating layer 21 and the second plating are formed on the base material 10 made of copper alloy. The third layer 13 (thickness) made of an Ag—Sn alloy formed by alloying the second layer 12 (thickness 0.6 μm) made of the layer 22 and the third plating layer 23 and a part of the fourth plating layer 24. 1.1 μm) and the fourth layer 14 (thickness 1 μm) made of the remainder of the fourth plating layer 24 are formed in this order. The chemical composition of each layer was measured by calculating the abundance of these elements in all the existing elements by normalizing the peak intensities of Ag and Sn with the Auger electron emission cross section. As a result, the second layer specifically had a composition of Cu ₆ Sn ₅ . Specifically, the third layer had a composition of Ag ₄ Sn ₁ . Further, as shown in FIG. 3, the third layer 13 had almost no voids in the layer.

(Comparative sample 1)
The surface of the substrate made of a clean copper alloy plate is subjected to electroplating treatment under the following conditions, and the Ni plating layer, the Ag plating layer (1), the Sn plating layer, and the Ag plating layer (2) are arranged in this order. Formed. Thereby, the plating member B was prepared.
<Ni plating layer>
・ Uses plating bath with Ni concentration of 100g / L ・ Operating temperature: 30 ℃
・ Current density: 6ASD
・ Thickness: 2.4 μm
<Ag plating layer (1)>
・ A plating bath with an Ag concentration of 45 g / L is used. ・ Operating temperature: 30 ° C.
・ Current density: 5ASD
・ Thickness: 2.7μm
<Sn plating layer>
・ Uses plating bath with Sn concentration of 60 g / L ・ Additive: 40 mL / L
・ Operating temperature: 40 ℃
・ Current density: 5ASD
・ Thickness: 1.2μm
<Ag plating layer (2)>
・ A plating bath with an Ag concentration of 45 g / L is used. ・ Operating temperature: 30 ° C.
・ Current density: 5ASD
・ Thickness: 3.8 μm

  Next, the plated member B was heated at 290 ° C. for 1 minute in the air. This obtained the terminal member of the comparative sample 1. The terminal member of Comparative Sample 1 obtained was observed and measured in the same manner as Sample 1. A cross-sectional SEM photograph of the terminal member of Comparative Sample 1 is shown in FIG. As shown in FIG. 4, the terminal member of Comparative Sample 1 has a Ni plating layer 91 (thickness 2.4 μm), an Ag layer 92 (thickness 1.6 μm) on a base material 10 made of a copper alloy, It can be seen that an Ag—Sn alloy layer 93 (thickness: 3.0 μm) and an Ag layer 94 (thickness: 2.7 μm) are provided in this order. In the terminal member of Comparative Sample 1, many voids B were observed in the Ag—Sn alloy layer 93.

  The terminal member of Sample 1 has a third layer made of an Ag—Sn alloy and a fourth layer made of Ag that is formed on the third layer and exposed on the outermost surface. In the terminal member, a fourth layer made of Ag is formed on a third layer made of an Ag—Sn alloy that is harder than Ag. Therefore, when the terminal member is used for a connector terminal, the friction coefficient on the surface of the fourth layer can be reduced as compared with the case where the third layer is made of the same material as the fourth layer. It can be said that wearability can be ensured.

  The terminal member has a first layer made of Ni and a second layer made of a Cu-Sn alloy formed on the first layer between the base material and the fourth layer. ing. Therefore, diffusion of copper atoms contained in the base material to the outermost surface is first suppressed by the first layer. And when there exists a copper atom which passed the 1st layer, the further spreading | diffusion to the outermost surface of the said copper atom is suppressed by the 2nd layer arrange | positioned above the 1st layer. Therefore, when the terminal member is used as a connector terminal, the copper atoms of the base material are unlikely to reach the outermost surface due to heat generated by a large current, and copper oxide is not easily formed on the outermost surface. Therefore, it can be said that the terminal member can exhibit excellent heat resistance due to the effects of the first layer and the second layer when used as a connector terminal.

  Here, a wear test was performed on the terminal member of Sample 1 and the terminal member of Comparative Sample 1C. In the wear test, a flat terminal member made from each sample and an embossed terminal member having a radius of 3 mm are held in contact in the vertical direction, and a 5 N load is applied in the vertical direction using a piezoelectric actuator. While applying, 10 mm / min. The embossed terminal member was pulled in the horizontal direction at a speed of 5 mm and the frictional force acting on the contact portion was measured using a load cell. A value obtained by dividing the frictional force by the load was defined as a friction coefficient. The friction coefficient of the terminal member of Sample 1 was 0.4, and the friction coefficient of the terminal member of Comparative Sample 1C was 0.6. 5 and 6 show the results of wear tests on the terminal member of Comparative Sample 1. FIG. FIG. 5 is a cross-sectional SEM photograph in the initial stage of wear, and FIG. 6 is a cross-sectional SEM photograph in the middle of friction.

  As shown in FIG. 5 and FIG. 6, the comparative sample 1 had many voids B in the Ag—Sn alloy. Therefore, during the wear test, cracks and cracks C occurred starting from the voids B, and Ag—Sn. The exfoliation of the alloy occurred and the wear was accelerated. On the other hand, since the terminal member of Sample 1 had the third layer made of an Ag—Sn alloy having almost no voids in the layer, the above-described mechanism did not promote the wear by the above-described mechanism. It was.

  From these results, according to the terminal member and the manufacturing method thereof, the wear resistance not only exhibits wear resistance by reducing the friction coefficient, but also can suppress the acceleration of wear caused by voids. It was confirmed that an excellent terminal member was obtained.

  As mentioned above, although the Example of this invention was described in detail, this invention is not limited to the said Example, A various change is possible within the range which does not impair the meaning of this invention.

DESCRIPTION OF SYMBOLS 1 Terminal member 10 Base material 11 1st layer 12 2nd layer 13 3rd layer 14 4th layer 2 Plating member 21 1st plating layer 22 2nd plating layer 23 3rd plating layer 24 4th plating layer

Claims (6)

A base material made of copper or a copper alloy;
A first layer formed on the substrate and made of Ni or Ni alloy;
A second layer formed on the first layer and made of a Cu-Sn alloy;
A third layer formed on the second layer and made of an Ag-Sn alloy;
And a fourth layer formed on the third layer and exposed on the outermost surface and made of Ag or an Ag alloy.   The terminal member according to claim 1, wherein the fourth layer is made of Ag.   The terminal member according to claim 1, wherein the third layer has no void in the layer. It is a manufacturing method of the member for terminals given in any 1 paragraph of Claims 1-3,
On a base material made of copper or copper alloy, a first plating layer made of Ni plating or Ni alloy plating, a second plating layer made of Cu-Sn alloy plating, a third plating layer made of Sn plating or Sn alloy plating, and A preparation step of preparing a plating member having a fourth plating layer made of Ag plating or Ag alloy plating in this order;
By heating the plating member, the first layer composed of the first plating layer, the second layer composed of the second plating layer, the third plating layer, and a part of the fourth plating layer, And a heating step for obtaining the third layer made of an Ag—Sn alloy formed by alloying and the fourth layer made of the remainder of the fourth plating layer. Production method.   On the base material, a pre-plated member having the first plated layer, the second plated layer, and the third plated layer in this order is prepared, and the pre-plated member is disposed on the third plated layer of the pre-plated member. The said plating member is prepared by forming 4 plating layers, The manufacturing method of the member for terminals of Claim 4 characterized by the above-mentioned.   A connector terminal, comprising: the terminal member according to claim 1.