JP2016046490A - ウエーハの加工方法 - Google Patents
ウエーハの加工方法 Download PDFInfo
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- JP2016046490A JP2016046490A JP2014172005A JP2014172005A JP2016046490A JP 2016046490 A JP2016046490 A JP 2016046490A JP 2014172005 A JP2014172005 A JP 2014172005A JP 2014172005 A JP2014172005 A JP 2014172005A JP 2016046490 A JP2016046490 A JP 2016046490A
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- Prior art keywords
- wafer
- grinding
- grinding wheel
- circular recess
- processing method
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- 238000003672 processing method Methods 0.000 title claims abstract description 52
- 239000006061 abrasive grain Substances 0.000 claims abstract description 6
- 230000002093 peripheral effect Effects 0.000 claims description 34
- 238000000034 method Methods 0.000 claims description 8
- 239000004575 stone Substances 0.000 abstract 2
- XOFYZVNMUHMLCC-ZPOLXVRWSA-N prednisone Chemical compound O=C1C=C[C@]2(C)[C@H]3C(=O)C[C@](C)([C@@](CC4)(O)C(=O)CO)[C@@H]4[C@@H]3CCC2=C1 XOFYZVNMUHMLCC-ZPOLXVRWSA-N 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 238000003754 machining Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
Abstract
【解決手段】ウエーハの加工方法は第1研削ステップと第2研削ステップとを備える。第1研削ステップは第1研削砥石を研削装置のチャックテーブルの保持面と直交する方向の加工送り方向に移動してウエーハWを研削し、ウエーハWの裏面WRに第1円形凹部R1を形成する。第2研削ステップは、第1研削砥石より細かい砥粒で形成された第2研削砥石34を、ウエーハWの中心側からウエーハWの外周に向かって斜め方向に下降させ、第1円形凹部R1を研削する。
【選択図】図6
Description
実施形態1に係るウエーハの加工方法を、図面に基づいて説明する。図1は、実施形態1に係るウエーハの加工方法により加工されるウエーハの斜視図である。
実施形態2に係るウエーハの加工方法を、図面に基づいて説明する。図9は、実施形態2に係るウエーハの加工方法の第2研削ステップの概要を示す側面図、図10は、実施形態2に係るウエーハの加工方法の第2研削ステップ後の概要を示す側面図、図11は、図10中のXI部を拡大して示す側面図、図12は、実施形態2に係るウエーハの加工方法の第2研削ステップの概要を拡大して示す側面図、図13は、実施形態2に係るウエーハの加工方法の第2研削ステップ後の概要を拡大して示す側面図である。なお、図9〜図13において、実施形態1と同一部分には、同一符号を付して説明を省略する。
10a 保持面
24 第1研削砥石(研削砥石)
34 第2研削砥石(研削砥石)
D デバイス
S ストリート
T 仕上げ厚さ
W ウエーハ
W1 デバイス領域
W2 外周余剰領域
WS 表面
WR 裏面
R1 第1円形凹部
B1 底面
C1 曲面部
I1 内周壁
Claims (2)
- 表面に格子状に形成された複数のストリートによって区画された領域にデバイスが形成されたデバイス領域と該デバイス領域を囲繞する外周余剰領域とを備えたウエーハを、チャックテーブルの保持面に保持し該デバイス領域に対応する裏面の領域を研削砥石で研削し、該デバイス領域の厚さを所定の仕上げ厚さに形成するウエーハの加工方法であって、
第1研削砥石を該保持面と直交する方向の加工送り方向に移動してウエーハを研削し、ウエーハの裏面に第1円形凹部を形成する第1研削ステップと、
該第1研削砥石より細かい砥粒で形成された第2研削砥石を、ウエーハの中心側からウエーハの外周に向かって斜め方向に下降させ該第1円形凹部を研削する第2研削ステップと、を備えることを特徴とするウエーハの加工方法。 - 該第2研削ステップは、
該第1円形凹部の内周壁より僅かに内側、且つ該第1円形凹部の底面より僅かに上方となる位置まで該第2研削砥石の先端外周を斜めに下降させ、該第1円形凹部の内周壁と底面とを繋ぐ曲面部の一部を研削し、
該第2研削ステップを実施した後に、該第2研削砥石を該加工送り方向に移動して該第1円形凹部の底面を研削し、該デバイス領域の厚さを所定の仕上げ厚さに形成する第3研削ステップを備えることを特徴とするウエーハの加工方法。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014172005A JP6360750B2 (ja) | 2014-08-26 | 2014-08-26 | ウエーハの加工方法 |
CN201510520741.7A CN105390383B (zh) | 2014-08-26 | 2015-08-21 | 晶片的加工方法 |
DE102015216193.5A DE102015216193A1 (de) | 2014-08-26 | 2015-08-25 | Waferbearbeitungsverfahren |
US14/835,298 US9786509B2 (en) | 2014-08-26 | 2015-08-25 | Wafer processing method |
Applications Claiming Priority (1)
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---|---|---|---|
JP2014172005A JP6360750B2 (ja) | 2014-08-26 | 2014-08-26 | ウエーハの加工方法 |
Publications (2)
Publication Number | Publication Date |
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JP2016046490A true JP2016046490A (ja) | 2016-04-04 |
JP6360750B2 JP6360750B2 (ja) | 2018-07-18 |
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JP2014172005A Active JP6360750B2 (ja) | 2014-08-26 | 2014-08-26 | ウエーハの加工方法 |
Country Status (4)
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US (1) | US9786509B2 (ja) |
JP (1) | JP6360750B2 (ja) |
CN (1) | CN105390383B (ja) |
DE (1) | DE102015216193A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017216400A (ja) * | 2016-06-01 | 2017-12-07 | 株式会社ディスコ | ウェーハの加工方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9984888B2 (en) * | 2014-08-13 | 2018-05-29 | Newport Fab, Llc | Method of fabricating a semiconductor wafer including a through substrate via (TSV) and a stepped support ring on a back side of the wafer |
KR20170016547A (ko) * | 2015-08-03 | 2017-02-14 | 삼성전자주식회사 | 척 테이블 및 그를 포함하는 기판 제조 장치 |
US10096460B2 (en) | 2016-08-02 | 2018-10-09 | Semiconductor Components Industries, Llc | Semiconductor wafer and method of wafer thinning using grinding phase and separation phase |
JP6723892B2 (ja) * | 2016-10-03 | 2020-07-15 | 株式会社ディスコ | ウエーハの加工方法 |
JP6460074B2 (ja) * | 2016-10-07 | 2019-01-30 | トヨタ自動車株式会社 | 半導体ウエハと半導体素子の製造方法 |
JP7089136B2 (ja) * | 2018-03-22 | 2022-06-22 | 株式会社デンソー | ウエーハの研削方法 |
US11551923B2 (en) * | 2021-01-15 | 2023-01-10 | Phoenix Silicon International Corp. | Taiko wafer ring cut process method |
TWI818416B (zh) * | 2021-03-24 | 2023-10-11 | 環球晶圓股份有限公司 | 晶圓 |
US11837632B2 (en) * | 2021-03-24 | 2023-12-05 | Globalwafers Co., Ltd. | Wafer |
JP2022160807A (ja) * | 2021-04-07 | 2022-10-20 | 株式会社ディスコ | 被加工物の加工方法 |
CN114434242B (zh) * | 2022-02-21 | 2023-02-17 | 无锡芯坤电子科技有限公司 | 一种晶圆打磨设备及其使用方法 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007305835A (ja) * | 2006-05-12 | 2007-11-22 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2008042081A (ja) * | 2006-08-09 | 2008-02-21 | Disco Abrasive Syst Ltd | ウエーハ研削装置 |
JP2008098351A (ja) * | 2006-10-11 | 2008-04-24 | Disco Abrasive Syst Ltd | ウエーハの研削加工方法 |
US20090020854A1 (en) * | 2007-07-20 | 2009-01-22 | Tao Feng | Process of forming ultra thin wafers having an edge support ring |
JP2009176896A (ja) * | 2008-01-23 | 2009-08-06 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2009253143A (ja) * | 2008-04-09 | 2009-10-29 | Fuji Electric Device Technology Co Ltd | 半導体ウェハ研削用砥石、半導体ウェハ研削装置および半導体装置の製造方法 |
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JP2011071288A (ja) * | 2009-09-25 | 2011-04-07 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2012190930A (ja) * | 2011-03-09 | 2012-10-04 | Disco Abrasive Syst Ltd | ウエーハ及びウエーハの搬送方法 |
Family Cites Families (4)
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JP4758222B2 (ja) * | 2005-12-21 | 2011-08-24 | 株式会社ディスコ | ウエーハの加工方法および装置 |
EP2213415A1 (en) * | 2009-01-29 | 2010-08-04 | S.O.I. TEC Silicon | Device for polishing the edge of a semiconductor substrate |
JP5519256B2 (ja) * | 2009-12-03 | 2014-06-11 | 株式会社荏原製作所 | 裏面が研削された基板を研磨する方法および装置 |
JP5796412B2 (ja) * | 2011-08-26 | 2015-10-21 | 三菱電機株式会社 | 半導体素子の製造方法 |
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2014
- 2014-08-26 JP JP2014172005A patent/JP6360750B2/ja active Active
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2015
- 2015-08-21 CN CN201510520741.7A patent/CN105390383B/zh active Active
- 2015-08-25 US US14/835,298 patent/US9786509B2/en active Active
- 2015-08-25 DE DE102015216193.5A patent/DE102015216193A1/de active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2007305835A (ja) * | 2006-05-12 | 2007-11-22 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2008042081A (ja) * | 2006-08-09 | 2008-02-21 | Disco Abrasive Syst Ltd | ウエーハ研削装置 |
JP2008098351A (ja) * | 2006-10-11 | 2008-04-24 | Disco Abrasive Syst Ltd | ウエーハの研削加工方法 |
US20090020854A1 (en) * | 2007-07-20 | 2009-01-22 | Tao Feng | Process of forming ultra thin wafers having an edge support ring |
JP2009176896A (ja) * | 2008-01-23 | 2009-08-06 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2009253143A (ja) * | 2008-04-09 | 2009-10-29 | Fuji Electric Device Technology Co Ltd | 半導体ウェハ研削用砥石、半導体ウェハ研削装置および半導体装置の製造方法 |
US20100059862A1 (en) * | 2008-09-08 | 2010-03-11 | Seddon Michael J | Thinned semiconductor wafer and method of thinning a semiconductor wafer |
JP2011071288A (ja) * | 2009-09-25 | 2011-04-07 | Disco Abrasive Syst Ltd | ウエーハの加工方法 |
JP2012190930A (ja) * | 2011-03-09 | 2012-10-04 | Disco Abrasive Syst Ltd | ウエーハ及びウエーハの搬送方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2017216400A (ja) * | 2016-06-01 | 2017-12-07 | 株式会社ディスコ | ウェーハの加工方法 |
Also Published As
Publication number | Publication date |
---|---|
CN105390383A (zh) | 2016-03-09 |
US20160064230A1 (en) | 2016-03-03 |
US9786509B2 (en) | 2017-10-10 |
JP6360750B2 (ja) | 2018-07-18 |
DE102015216193A1 (de) | 2016-03-03 |
CN105390383B (zh) | 2020-03-17 |
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