JP2016041848A - 蒸着マスク - Google Patents
蒸着マスク Download PDFInfo
- Publication number
- JP2016041848A JP2016041848A JP2015017207A JP2015017207A JP2016041848A JP 2016041848 A JP2016041848 A JP 2016041848A JP 2015017207 A JP2015017207 A JP 2015017207A JP 2015017207 A JP2015017207 A JP 2015017207A JP 2016041848 A JP2016041848 A JP 2016041848A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- vapor deposition
- main body
- overlapping region
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000007740 vapor deposition Methods 0.000 title claims abstract description 82
- 238000005019 vapor deposition process Methods 0.000 claims abstract description 9
- 230000008021 deposition Effects 0.000 claims description 18
- 230000008020 evaporation Effects 0.000 claims 1
- 238000001704 evaporation Methods 0.000 claims 1
- 238000004140 cleaning Methods 0.000 abstract description 19
- 230000000694 effects Effects 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 description 20
- 238000000151 deposition Methods 0.000 description 17
- 239000007788 liquid Substances 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 239000010410 layer Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000003599 detergent Substances 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000013459 approach Methods 0.000 description 2
- 238000005137 deposition process Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
- H10K71/166—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering using selective deposition, e.g. using a mask
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
Abstract
Description
10、10n 蒸着マスク
100、100a、100b、100c、110 第1本体
120 開口
150 第1重なり領域
180、180a 第1貫通孔
200、200a、200b、200c、220 第2本体
250 第2重なり領域
280、280a 第2貫通孔
500 枠体
G 隙間
D 孔径
d 距離
S 基板
C 蒸着源
<従来技術>
820 上部シート体
810 下部シート体
900 枠体
90 マスク
M 成膜領域
A 重なり部分
g 隙間
Claims (6)
- 蒸着源を使う蒸着工程に用いられる蒸着マスクであって、
複数の第1貫通孔が形成されている第1重なり領域を有する第1本体と、
複数の第2貫通孔が形成されている第2重なり領域を有し、前記第1本体と異なる方向に延びる第2本体と、を含み、
前記第1重なり領域と前記第2重なり領域とを重ね合わせたとき、前記第2重なり領域における前記第1貫通孔の投影範囲は、前記第2貫通孔の範囲外にあることを特徴とする蒸着マスク。 - 前記第2重なり領域における前記第1貫通孔の投影範囲は、隣り合う前記第2貫通孔同士間に挟まれることを特徴とする請求項1に記載の蒸着マスク。
- 前記第1重なり領域と前記第2重なり領域との間には、隙間が形成され、
前記隙間は、前記第1貫通孔と前記第2貫通孔とそれぞれ連通することを特徴とする請求項1に記載の蒸着マスク。 - 前記第1貫通孔及び前記第2貫通孔の少なくとも一方は円形状であることを特徴とする請求項1に記載の蒸着マスク。
- 前記第1本体は、前記第2本体よりも前記蒸着源に接近し、
前記第1貫通孔は、前記第2貫通孔よりも開口面積が小さいことを特徴とする請求項1に記載の蒸着マスク。 - 複数の前記第1貫通孔の総開口面積と複数の前記第2貫通孔の総開口面積との合計は、前記第1重なり領域の面積の90%よりも小さいことを特徴とする請求項1に記載の蒸着マスク。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103127814 | 2014-08-13 | ||
TW103127814A TWI576445B (zh) | 2014-08-13 | 2014-08-13 | 蒸鍍遮罩 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016041848A true JP2016041848A (ja) | 2016-03-31 |
JP5917731B2 JP5917731B2 (ja) | 2016-05-18 |
Family
ID=52253570
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015017207A Active JP5917731B2 (ja) | 2014-08-13 | 2015-01-30 | 蒸着マスク |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP5917731B2 (ja) |
KR (1) | KR101622483B1 (ja) |
CN (1) | CN104278233B (ja) |
TW (1) | TWI576445B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019087287A1 (ja) * | 2017-10-31 | 2019-05-09 | シャープ株式会社 | 蒸着マスクおよび表示デバイスの製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004111305A (ja) * | 2002-09-20 | 2004-04-08 | Ulvac Japan Ltd | 有機薄膜形成方法 |
JP2010090415A (ja) * | 2008-10-06 | 2010-04-22 | Seiko Epson Corp | 蒸着マスク |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5744214A (en) * | 1997-01-30 | 1998-04-28 | International Business Machines Corporation | Corrosion resistant molybdenum mask |
TW200611987A (en) * | 2004-10-01 | 2006-04-16 | Onano Ind Corp | Evaporation mask |
KR100971753B1 (ko) * | 2007-11-23 | 2010-07-21 | 삼성모바일디스플레이주식회사 | 평판 표시장치의 박막 증착용 마스크 조립체 |
KR101030030B1 (ko) * | 2009-12-11 | 2011-04-20 | 삼성모바일디스플레이주식회사 | 마스크 조립체 |
CN202989271U (zh) * | 2012-12-10 | 2013-06-12 | 昆山允升吉光电科技有限公司 | 一种制作大面积蒸镀用掩模板的辅助治具 |
CN103898442A (zh) * | 2014-03-13 | 2014-07-02 | 昆山允升吉光电科技有限公司 | 一种配套掩模板及其蒸镀方法 |
-
2014
- 2014-08-13 TW TW103127814A patent/TWI576445B/zh active
- 2014-10-30 CN CN201410598749.0A patent/CN104278233B/zh active Active
- 2014-11-28 KR KR1020140168141A patent/KR101622483B1/ko active IP Right Grant
-
2015
- 2015-01-30 JP JP2015017207A patent/JP5917731B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004111305A (ja) * | 2002-09-20 | 2004-04-08 | Ulvac Japan Ltd | 有機薄膜形成方法 |
JP2010090415A (ja) * | 2008-10-06 | 2010-04-22 | Seiko Epson Corp | 蒸着マスク |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019087287A1 (ja) * | 2017-10-31 | 2019-05-09 | シャープ株式会社 | 蒸着マスクおよび表示デバイスの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101622483B1 (ko) | 2016-05-18 |
CN104278233B (zh) | 2017-04-12 |
TW201606103A (zh) | 2016-02-16 |
CN104278233A (zh) | 2015-01-14 |
KR20160020332A (ko) | 2016-02-23 |
JP5917731B2 (ja) | 2016-05-18 |
TWI576445B (zh) | 2017-04-01 |
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