JP2016039260A - Sheet peeling device and sheet peeling method, and peeling start part formation device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a sheet peeling device and a sheet peeling method, capable of reducing running cost, and capable of preventing an adherent from being lifted to be broken when an adhesive sheet is peeled.SOLUTION: A sheet peeling device 10 includes: a peeling start part formation means 20 forming a peeling start part to an adhesive sheet AS by pulling up an end of the adhesive sheet AS stuck to an adherent WF, the peeling start part being partially peeled off from the adherent WF; and a holding means 30 holding the peeling start part. The peeling start part formation means 20 includes a fluid spraying means 21 spraying a fluid to the end of the adhesive sheet AS thereby to pull up the end of the adhesive sheet AS. The adhesive sheet AS is peeled off from the adherent WF by the relative movement between the adherent WF and the holding means 30.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a sheet peeling apparatus, a peeling method, and a peeling start part forming apparatus.

  2. Description of the Related Art Conventionally, a sheet peeling apparatus that peels an adhesive sheet attached to an adherend is known (for example, see Patent Documents 1 and 2).

JP 2005-175253 A JP 2010-165901 A

However, the sheet peeling apparatus described in Patent Document 1 requires a peeling adhesive sheet for peeling the adhesive sheet from the adherend, and thus has a disadvantage that running cost increases.
Moreover, since the sheet peeling apparatus described in Patent Document 2 is configured to adsorb the edge of the adhesive sheet with the suction pad and peel it from the adherend, when the adhesive sheet is lifted by the suction force, By trying to deform into a conical shape following the shape of the suction pad, air does not enter between the adherend and the adhesive sheet, and air does not enter between the adherend and the support surface that supports the adherend. In some cases, the adherend is lifted together with the adhesive sheet and may be damaged.

The objective of this invention is providing the sheet | seat peeling apparatus and peeling method which can reduce running cost, and a peeling start part formation apparatus.
Another object of the present invention is to provide a sheet peeling apparatus, a peeling method, and a peeling start portion forming apparatus capable of preventing the adherend from being lifted and damaged together with the adhesive sheet when peeling the adhesive sheet. There is to do.

  The sheet peeling apparatus according to the present invention forms a peeling start part that forms a peeling start part partially peeled from the adherend on the adhesive sheet by rolling up the end of the adhesive sheet affixed to the adherend. And a gripping means for gripping the peeling start portion, wherein the peeling start portion forming means includes a fluid spraying means for spraying a fluid to an end portion of the adhesive sheet, and the adherend and the gripping means. And the relative movement, the adhesive sheet is peeled from the adherend.

In the sheet peeling apparatus of the present invention, the gripping means includes a pair of gripping members that grip the peeling start portion, and one gripping member of the pair of gripping members is a region where the peeling start portion is formed. It is preferable that it is a peeling start part suppression means which suppresses to the predetermined area | region of the said adhesive sheet.
In the sheet peeling apparatus of the present invention, the peeling start portion forming means is in a plane parallel to the adherend surface of the adherend and intersects the relative movement direction of the adherend and the gripping means. It is preferable that a spraying means moving means capable of moving the fluid spraying means is provided.

  The peeling start part forming apparatus of the present invention starts peeling to form a peeling start part partially peeled from the adherend on the adhesive sheet by rolling up the end of the adhesive sheet affixed to the adherend. It is a part formation apparatus, Comprising: It has the fluid spraying means which blows up the fluid and blows up to the edge part of the said adhesive sheet, It is characterized by the above-mentioned.

  The sheet peeling method of the present invention forms a peeling start portion that is partially peeled from the adherend by spraying a fluid onto the end portion of the adhesive sheet affixed to the adherend and rolling it up. A step of gripping the peeling start portion with a gripping means, and a step of peeling the adhesive sheet from the adherend by relative movement of the adherend and the gripping means. And

According to the present invention as described above, since the fluid is blown up to the end portion of the adhesive sheet, the peeling adhesive sheet does not need to be used, and the running cost can be reduced.
In addition, since the adhesive sheet is not adsorbed and peeled off, it is possible to prevent the adherend from being lifted together with the adhesive sheet and damaged.

In addition, by using one gripping member of the pair of gripping members as a peeling start portion suppressing unit, the peeling start portion is prevented from spreading randomly, and the peeling start portion is connected to the other gripping member. Can be easily gripped.
Furthermore, if the peeling means moving means is provided in the peeling start part forming means, the peeling start part can be expanded in a direction intersecting the relative movement direction of the adherend and the gripping means, and the gripping means can grip the adhesive sheet. Missing gripping can be suppressed.

The side view of the sheet peeling apparatus which concerns on one Embodiment of this invention. Operation | movement explanatory drawing of the sheet peeling apparatus of FIG.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In the following, without giving a reference figure, for example, when directions such as up, down, left, right, or near side, back side are shown, all of FIG. The top, bottom, left, and right directions are parallel to the page, the front is the front direction perpendicular to the page, and the back is the back direction perpendicular to the page. To do.

  In FIG. 1, the sheet peeling apparatus 10 lifts up the end of the adhesive sheet AS attached to the wafer WF as an adherend, whereby the peeling start part AS1 that partially peels from the wafer WF to the adhesive sheet AS. (Refer to FIG. 2) and a peeling start portion forming means 20 for forming the peeling start portion AS1 and a gripping means 30 for gripping the peeling start portion AS1, and the wafer WF and the gripping means 30 move relative to each other, so that the adhesive sheet AS is removed from the wafer WF. Is provided to be peelable. In the present embodiment, the wafer WF is transported by the moving means 40, so that the wafer WF and the gripping means 30 are relatively moved. Moreover, the peeling start part formation means 20 is the peeling start part formation apparatus of this invention.

  The peeling start part forming means 20 includes a fluid spraying means 21 that blows up a gas as a fluid to the end of the adhesive sheet AS and a surface parallel to the adherend surface WF1 of the wafer WF, and the wafer WF A spraying means moving means capable of moving the fluid spraying means 21 in a direction (front-rear direction) intersecting a relative movement direction with respect to the gripping means 30 and includes a linear motor 22 as a driving device. The fluid spraying means 21 includes a rotating motor 23 as a driving device in which an output shaft 23A is supported on a slider 22A of a linear motor 22 via a bracket 22B, a rotating body 24 supported by the rotating motor 23 body, And a nozzle 25 supported by the body 24 and connected to a gas supply means (not shown) such as a pressure pump and a turbine.

  The gripping means 30 includes first and second gripping members 32 and 35 as a pair of gripping members that grip the peeling start portion AS1, and the first gripping member 32 as one gripping member of the pair of gripping members. Functions as a peeling start portion suppressing unit that suppresses a region where the peeling start portion AS1 is formed to a predetermined region of the adhesive sheet AS. Such a gripping means 30 is formed in a linear motion motor 31 as a driving device, a first gripping member 32 supported by an output shaft 31A of the linear motion motor 31, and a first gripping member 32, and penetrates in the left-right direction. The linear motor 33 as a driving device supported on the rear surface in the through-hole 32C, the linear motor 34 as a driving device supported by the slider 33A of the linear motor 33, and the output shaft of the linear motor 34 A second gripping member 35 supported by 34A and a detection means 36 such as an optical sensor or a camera for detecting the peeling start portion AS1 are provided. The first and second gripping members 32 and 35 are provided with convex portions 32B and 35B that improve the frictional force with the adhesive sheet AS on the opposing surfaces 32A and 35A facing each other. The first gripping member 32 is connected to a decompression means (not shown) such as a decompression pump or a vacuum ejector, and has a plurality of suction holes 32D in the vertical direction and the front-rear direction as separation start part holding means capable of holding the separation start part AS1. It is installed side by side.

  The moving means 40 is supported by a slider 41A of a linear motor 41 as a driving device, and includes a table 42 having a support surface 42A that can suck and hold the wafer WF by a decompression means (not shown) such as a decompression pump or a vacuum ejector.

A procedure for peeling the adhesive sheet AS from the wafer WF in the above sheet peeling apparatus 10 will be described.
First, with respect to the sheet peeling apparatus 10 in the state indicated by the solid line in FIG. 1 in which the respective members are arranged at the initial positions, when the operator or a conveying means (not shown) places the wafer WF on the table 42, the moving means 40 is illustrated. The pressure reducing means that is not operated is driven, and the wafer WF is sucked and held by the support surface 42A. Next, the moving means 40 drives the linear motor 41 to move the table 42 to a predetermined position below the peeling start portion forming means 20 and the gripping means 30 as indicated by a two-dot chain line in FIG. Next, the gripping means 30 drives the linear motion motor 31 to lower the first gripping member 32, and the lower end portion of the first gripping member 32 approaches the adhesive sheet AS as indicated by a two-dot chain line in the figure. Let At this time, the lower end part of the 1st holding member 32 may contact | abut to adhesive sheet AS, and does not need to contact | abut. Next, the gripping means 30 drives the linear motor 33, and as shown by a two-dot chain line in FIG. 1, the nozzle 25 is on the right side of the adhesive sheet AS, and the height of the adhesive boundary surface between the adhesive sheet AS and the wafer WF is high. The second holding member 35 is moved so as to be positioned at the height (the height of the adherend surface WF1 of the wafer WF).

  Next, the gripping means 30 drives a decompression means (not shown), and the peeling start portion forming means 20 drives a gas supply means (not shown). As shown by a solid line in FIG. By blowing gas on the end of the sheet, the end of the adhesive sheet AS is rolled up to form the peeling start part AS1. Then, the peeling start portion forming means 20 drives the rotation motor 23, and as shown by a two-dot chain line in FIG. 2A, the nozzle 25 is rotated in the clockwise direction and tilted upward to start peeling. The part AS1 is pressed against the first gripping member 32. The peeling start part AS1 pressed against the first gripping member 32 is sucked and held by the suction hole 32D. At this time, the first gripping member 32 can suppress the peeling start part AS1 from spreading randomly. Then, the peeling start part formation means 20 drives the linear motor 22, and moves the fluid spraying means 21 in the front-back direction, thereby expanding the peeling start part AS1 in the front-rear direction.

  Then, on the condition that the peeling start part AS1 is detected by the detection means 36, the gripping means 30 drives the linear motor 33 and moves the second gripping member 35 upward as shown in FIG. Let Next, after the gripping means 30 drives the linear motion motor 34 and the second gripping member 35 is moved to the left as shown in FIG. 2C, the peeling start portion forming means 20 and the gripping means 30 are illustrated. The driving of the gas supply means not performed and the decompression means not shown are stopped. Thereby, the peeling start part AS1 is gripped by the first and second gripping members 32 and 35. At this time, since the convex portions 32B and 35B bite into the peeling start portion AS1, the frictional force between the first and second gripping members 32 and 35 and the adhesive sheet AS is improved, and the peeling start portion AS1 can be reliably held. it can. When the lower end of the first gripping member 32 is in contact with the adhesive sheet AS, the gripping means 30 drives the linear motion motor 31 and raises the first gripping member 32 slightly (for example, about 0.5 mm to 10 mm). Let Next, the moving unit 40 drives the linear motor 41 to move the table 42 to the right to peel the entire adhesive sheet AS from the wafer WF. When the table 42 reaches a predetermined position, the moving unit 40 moves the linear motor 41. Stop driving. Thereafter, after the moving unit 40 stops driving the decompression unit (not shown), the operator or the transfer unit (not shown) transfers the wafer WF to the next process.

  When the entire adhesive sheet AS is peeled from the wafer WF, the gripping means 30 drives the linear motion motor 34 to return the second gripping member 35 to the initial position with respect to the linear motion motor 34 and The adhesive sheet AS is dropped and accommodated in a sheet collecting means (not shown) such as a box or bag located below. Then, the peeling start portion forming means 20 and the gripping means 30 drive the rotation motor 23, the linear motor 33, and the linear motion motor 31, and return the fluid spraying means 21 and the first gripping member 32 to the initial positions. Is repeated.

According to the embodiment as described above, the fluid is blown to the end portion of the adhesive sheet AS to be rolled up, so that it is not necessary to use the peeling adhesive sheet, and the running cost can be reduced.
Further, since the adhesive sheet AS is not adsorbed and peeled off, it is possible to prevent the wafer WF from being lifted together with the adhesive sheet AS and damaged.

  As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this. That is, the invention has been illustrated and described with particular reference to certain specific embodiments, but without departing from the spirit and scope of the invention, Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description of the shape, material, and the like disclosed above is exemplary for ease of understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such restrictions is included in this invention.

For example, the peeling start portion forming means 20 swings the nozzle 25 in the clockwise direction and the counterclockwise direction until the peeling start portion AS1 is detected by the detecting means 36, that is, until the peeling start portion AS1 is formed. You may make it move, and you may move it up and down.
The peeling start part forming means 20 may move the fluid spraying means 21 in the front-rear direction until the peeling start part AS1 spreads in the front-rear direction.
The peeling start part forming means 20 may be provided with a plurality of fluid spraying means 21 such as providing the fluid spraying means 21 on each of the plurality of sliders 22 </ b> A of the linear motor 22.
In the fluid spraying means 21, the nozzle 25 may be provided directly on the second gripping member 35. In this case, the linear motor 22, the bracket 22B, and the rotation motor 23 can be omitted.
The fluid outlet of the nozzle 25 may have the same width as the width in the front-rear direction of the peeling start part AS1, may be wider than the width of both ends, may be narrower than the width of both ends, or wider than the width of both ends The linear motor 22 can be omitted.
The fluid sprayed by the nozzle 25 may be air, a gas such as a single gas or a mixed gas, a liquid such as water or oil, a gel-like body, or the like.
The spraying means moving means may move the fluid spraying means 21 in a direction parallel to the adherend surface WF1 and inclined with respect to the front-rear direction.

The gripping means 30 may grip the peeling start part AS1 with a chuck cylinder as a driving device having a pair of gripping claws.
The gripping means 30 connects a suction means (not shown) such as a pressure pump or a turbine to the suction hole 32D, and ejects a fluid such as air or a single gas from the suction hole 32D when the adhesive sheet AS is accommodated. It may be.
The gripping means 30 may not have the suction hole 32D.
Even if the adhesive sheet AS is peeled from the wafer WF while a pressing means such as a roller or air spray is provided at the lower end of the first gripping member 32 and the adhesive sheet AS and the wafer WF are pressed against the table 42 by the pressing means. Good.
A member such as a blade material, rubber, resin, or sponge can be used as the peeling start portion suppressing unit, and a configuration in which the adhesive sheet AS is pressed by air blowing can also be used.
The peeling start part suppressing means can be constituted by a member different from the first gripping member 32, and the peeling start part AS1 pressed against the peeling start part suppressing means is formed by the first and second gripping members 32 and 35. It may be gripped.
The peeling start part holding means may adopt a chuck cylinder, an adhesive sheet, an electrostatic chuck, or the like as a driving device capable of holding the peeling start part AS1.

The moving means 40 may stop the wafer WF and move the gripping means 30, or may move both the wafer WF and the gripping means 30.
The moving unit 40 may be configured to hold the wafer WF by a chuck unit such as a mechanical chuck or a chuck cylinder, an electrostatic chuck, an adhesive, a magnetic force, or the like.
As a configuration in which the moving unit 40 moves the wafer WF in the front-rear direction, the peeling start part AS1 may be expanded in the front-rear direction. In this case, the linear motor 22 can be omitted.
When the wafer WF is transferred by another apparatus, the moving unit 40 may be omitted.

  In order to make it easy to form the peeling start part AS1 or to make it easier to peel the adhesive sheet AS from the wafer WF, an adhesive strength lowering means for reducing the adhesive strength of the adhesive sheet AS is provided, and the adhesive strength of the adhesive sheet AS The adhesive sheet AS may be rolled up after lowering. By providing such an adhesive force lowering means, it is possible to prevent the adhesive sheet AS once lifted up from reattaching to the wafer WF. For example, the adhesive strength reducing means cools or heats the fluid supplied to the nozzle 25 so that the adhesive strength decreases according to the characteristics of the adhesive sheet AS, and sprays the fluid from the nozzle 25 onto the adhesive sheet AS. What is necessary is just to comprise. As the adhesive strength reducing means, if the adhesive of the adhesive sheet AS is one whose adhesive strength is reduced by electromagnetic waves such as ultraviolet rays, infrared rays, X-rays, microwaves, etc., an electromagnetic wave irradiation device capable of irradiating those electromagnetic waves should be adopted. What is necessary is just to employ | adopt an appropriate thing according to the property, structure, etc. of the adhesive agent of adhesive sheet AS. In addition, the structure which reduces the adhesive force of the whole adhesive sheet AS may be sufficient as an adhesive force fall means, and the structure which reduces the adhesive force of a part of outer edge of the adhesive sheet AS or the whole may be sufficient as it.

  The material, type, shape and the like of the adhesive sheet AS and the adherend in the present invention are not particularly limited. For example, the adhesive sheet AS may be a circle, an ellipse, a polygon such as a triangle or a quadrangle, or other shapes, or may be an adhesive form such as pressure-sensitive adhesiveness or heat-sensitive adhesiveness. Such an adhesive sheet AS is, for example, a single layer having only an adhesive layer, a layer having an intermediate layer between the base material and the adhesive layer, and a cover layer on the upper surface of the base material. The above-described ones, and further, a so-called double-sided adhesive sheet that can peel the substrate from the adhesive layer may be used, and the double-sided adhesive sheet has a single-layer or multi-layer intermediate layer, It may be a single layer or multiple layers without an intermediate layer. Examples of the adherend include, for example, foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, circuit board, information recording substrates such as optical disks, glass plates, steel plates, ceramics, wood plates or resin plates, Arbitrary forms of members and articles can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Arbitrary sheets, films, tapes and the like can be attached to any adherend as described above.

The means and steps in the present invention are not limited in any way as long as they can perform the operations, functions, or steps described with respect to those means and steps. The process is not limited at all. For example, as long as the gripping means can grip the peeling start portion, it is not limited in any way as long as it is within the technical scope in light of the technical common sense at the time of filing (about other means and processes). Will be omitted).
The drive device in the embodiment employs an electric device such as a rotation motor, a linear motion motor, a linear motor, a single-axis robot, and an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition, it is possible to adopt a combination of them directly or indirectly (some of them overlap with those exemplified in the embodiment).

10 Sheet peeling device 20 Peeling start portion forming means (peeling start portion forming device)
21 Fluid spraying means 22 Linear motor (spraying means moving means)
30 Gripping means 32 First gripping member (gripping member, peeling start portion suppressing means)
35 Second gripping member (gripping member)
AS adhesive sheet AS1 Peel start part WF Wafer (Substrate)
WF1 surface

Claims (5)

A peeling start part forming means for forming a peeling start part partially peeled from the adherend on the adhesive sheet by rolling up the end of the adhesive sheet affixed to the adherend;
Gripping means for gripping the peeling start portion,
The peeling start part forming unit includes a fluid spraying unit that sprays a fluid onto an end portion of the adhesive sheet and lifts it up.
A sheet peeling apparatus that peels the adhesive sheet from the adherend when the adherend and the gripping means move relative to each other.   The gripping means includes a pair of gripping members that grip the peeling start portion, and one gripping member of the pair of gripping members defines a region where the peeling start portion is formed as a predetermined region of the adhesive sheet. The sheet peeling apparatus according to claim 1, wherein the sheet peeling apparatus is a peeling start portion restraining unit that restrains the sheet.   The peeling start portion forming means can move the fluid spraying means in a direction parallel to the adherend surface of the adherend and intersecting the relative movement direction of the adherend and the gripping means. The sheet peeling apparatus according to claim 1, further comprising a blowing means moving means. By peeling up the end of the adhesive sheet affixed to the adherend, a peeling start part forming device for forming a peeling start part partially peeled from the adherend on the adhesive sheet,
An apparatus for forming a peeling start portion, comprising fluid spraying means for spraying a fluid onto an end portion of the adhesive sheet. A step of forming a peeling start portion partially peeled from the adherend on the adhesive sheet by spraying a fluid to the end of the adhesive sheet affixed to the adherend and rolling it up;
Gripping the peeling start portion with gripping means;
And a step of peeling the adhesive sheet from the adherend by relative movement between the adherend and the gripping means.

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