JP2016035993A - リセプタクルアセンブリー、および、モジュールアセンブリー - Google Patents

リセプタクルアセンブリー、および、モジュールアセンブリー Download PDF

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Publication number
JP2016035993A
JP2016035993A JP2014158998A JP2014158998A JP2016035993A JP 2016035993 A JP2016035993 A JP 2016035993A JP 2014158998 A JP2014158998 A JP 2014158998A JP 2014158998 A JP2014158998 A JP 2014158998A JP 2016035993 A JP2016035993 A JP 2016035993A
Authority
JP
Japan
Prior art keywords
module
recess
connector
bracket
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014158998A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016035993A5 (enExample
Inventor
陽介 高居
Yosuke Takai
陽介 高居
伊東　利育
Toshiyasu Ito
利育 伊東
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaichi Electronics Co Ltd
Original Assignee
Yamaichi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaichi Electronics Co Ltd filed Critical Yamaichi Electronics Co Ltd
Priority to JP2014158998A priority Critical patent/JP2016035993A/ja
Priority to US14/816,391 priority patent/US9565795B2/en
Priority to CN201520580839.7U priority patent/CN204964818U/zh
Publication of JP2016035993A publication Critical patent/JP2016035993A/ja
Publication of JP2016035993A5 publication Critical patent/JP2016035993A5/ja
Priority to US15/387,941 priority patent/US9930781B2/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/14—Distribution frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1461—Slidable card holders; Card stiffeners; Control or display means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0062—Structures of standardised dimensions, e.g. 19" rack, chassis for servers or telecommunications
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermal Sciences (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2014158998A 2014-08-04 2014-08-04 リセプタクルアセンブリー、および、モジュールアセンブリー Pending JP2016035993A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2014158998A JP2016035993A (ja) 2014-08-04 2014-08-04 リセプタクルアセンブリー、および、モジュールアセンブリー
US14/816,391 US9565795B2 (en) 2014-08-04 2015-08-03 Receptacle assembly and module assembly
CN201520580839.7U CN204964818U (zh) 2014-08-04 2015-08-04 插座组件及模块组件
US15/387,941 US9930781B2 (en) 2014-08-04 2016-12-22 Receptacle assembly and module assembly

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014158998A JP2016035993A (ja) 2014-08-04 2014-08-04 リセプタクルアセンブリー、および、モジュールアセンブリー

Publications (2)

Publication Number Publication Date
JP2016035993A true JP2016035993A (ja) 2016-03-17
JP2016035993A5 JP2016035993A5 (enExample) 2016-04-28

Family

ID=55059874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014158998A Pending JP2016035993A (ja) 2014-08-04 2014-08-04 リセプタクルアセンブリー、および、モジュールアセンブリー

Country Status (3)

Country Link
US (1) US9565795B2 (enExample)
JP (1) JP2016035993A (enExample)
CN (1) CN204964818U (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017105616A1 (en) * 2015-12-18 2017-06-22 Continental Automotive Systems, Inc Sliding thermal shield
CN105552601B (zh) * 2016-01-26 2018-09-18 成都因纳伟盛科技股份有限公司 小型化身份证阅读器主板与小安全模块的超薄插接组件
US20180084682A1 (en) * 2016-09-20 2018-03-22 Jones Tech (USA), Inc. Shielding structure for an electronic circuit
CN107546506B (zh) * 2017-07-24 2019-06-11 番禺得意精密电子工业有限公司 夹持件
TWI674495B (zh) * 2017-10-02 2019-10-11 仁寶電腦工業股份有限公司 升降機構及電子裝置
JP2020187844A (ja) * 2019-05-10 2020-11-19 山一電機株式会社 ホストコネクタ、および、それを備えるリセプタクルアセンブリー
JP7500959B2 (ja) * 2019-12-10 2024-06-18 住友電気工業株式会社 光トランシーバ
US12028975B2 (en) 2020-11-09 2024-07-02 Samsung Electronics Co., Ltd. Electronic device including shielding member
CN112930070B (zh) * 2021-01-21 2022-08-23 北京字节跳动网络技术有限公司 电子设备
CN115793787A (zh) * 2021-09-10 2023-03-14 英业达科技有限公司 固定装置
TWM649139U (zh) * 2023-07-14 2023-12-01 正文科技股份有限公司 通訊組件及其散熱屏蔽模組

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS603878A (ja) * 1983-06-20 1985-01-10 富士通株式会社 混成集積回路ユニツト用コネクタ
JP2004280261A (ja) * 2003-03-13 2004-10-07 Canon Inc 記憶媒体等排出機構
JP2005222537A (ja) * 2004-01-23 2005-08-18 Yamaichi Electronics Usa Inc ヒートシンクおよび電子機器用コネクタ
JP2012109165A (ja) * 2010-11-18 2012-06-07 Smk Corp Ｉｃカード装着ユニット、カードコネクタ、カードアダプタ
JP2012239025A (ja) * 2011-05-11 2012-12-06 Sumitomo Electric Ind Ltd 光トランシーバ、及びホストコネクタカバー

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4717989A (en) * 1987-03-30 1988-01-05 Motorola Inc. Heat sink, EMI shield and controller module assembly for a portable radio transceiver
US5506373A (en) * 1993-07-09 1996-04-09 Magnavox Electronic Systems Company Electronic module enclosure
US6178096B1 (en) * 1998-11-25 2001-01-23 The Whitaker Corporation Shielding cover having parts held together by latch members
US6304436B1 (en) * 1999-12-03 2001-10-16 International Business Machines Corporation Connector system with outwardly opening door for a removable transceiver module
US6600865B2 (en) * 2001-06-21 2003-07-29 Hon Hai Precision Ind. Co., Ltd. Stacked GBIC guide rail assembly
US7852633B2 (en) * 2008-07-24 2010-12-14 Yamaichi Electronics Co., Ltd. Connector for connection to a module board
US8098493B2 (en) * 2008-08-15 2012-01-17 Finisar Corporation CFP mechanical platform
US8014153B2 (en) * 2008-11-18 2011-09-06 Finisar Corporation Floating front enclosure for pluggable module
CN103201911B (zh) * 2010-10-25 2016-09-28 莫列斯有限公司 插座连接器组件、多隔间插座及混合式壳体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS603878A (ja) * 1983-06-20 1985-01-10 富士通株式会社 混成集積回路ユニツト用コネクタ
JP2004280261A (ja) * 2003-03-13 2004-10-07 Canon Inc 記憶媒体等排出機構
JP2005222537A (ja) * 2004-01-23 2005-08-18 Yamaichi Electronics Usa Inc ヒートシンクおよび電子機器用コネクタ
JP2012109165A (ja) * 2010-11-18 2012-06-07 Smk Corp Ｉｃカード装着ユニット、カードコネクタ、カードアダプタ
JP2012239025A (ja) * 2011-05-11 2012-12-06 Sumitomo Electric Ind Ltd 光トランシーバ、及びホストコネクタカバー

Also Published As

Publication number Publication date
US9565795B2 (en) 2017-02-07
CN204964818U (zh) 2016-01-13
US20160037642A1 (en) 2016-02-04

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