CN204964818U - 插座组件及模块组件 - Google Patents

插座组件及模块组件 Download PDF

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Publication number
CN204964818U
CN204964818U CN201520580839.7U CN201520580839U CN204964818U CN 204964818 U CN204964818 U CN 204964818U CN 201520580839 U CN201520580839 U CN 201520580839U CN 204964818 U CN204964818 U CN 204964818U
Authority
CN
China
Prior art keywords
module
recess
connector
bracket
jack assemblies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201520580839.7U
Other languages
English (en)
Chinese (zh)
Inventor
高居阳介
伊东利育
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaichi Electronics Co Ltd
Original Assignee
Yamaichi Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaichi Electronics Co Ltd filed Critical Yamaichi Electronics Co Ltd
Application granted granted Critical
Publication of CN204964818U publication Critical patent/CN204964818U/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4277—Protection against electromagnetic interference [EMI], e.g. shielding means
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q1/00—Details of selecting apparatus or arrangements
    • H04Q1/02—Constructional details
    • H04Q1/14—Distribution frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1461—Slidable card holders; Card stiffeners; Control or display means therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0062—Structures of standardised dimensions, e.g. 19" rack, chassis for servers or telecommunications
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/4284—Electrical aspects of optical modules with disconnectable electrical connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10189—Non-printed connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Thermal Sciences (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
CN201520580839.7U 2014-08-04 2015-08-04 插座组件及模块组件 Expired - Lifetime CN204964818U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014158998A JP2016035993A (ja) 2014-08-04 2014-08-04 リセプタクルアセンブリー、および、モジュールアセンブリー
JP2014-158998 2014-08-04

Publications (1)

Publication Number Publication Date
CN204964818U true CN204964818U (zh) 2016-01-13

Family

ID=55059874

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201520580839.7U Expired - Lifetime CN204964818U (zh) 2014-08-04 2015-08-04 插座组件及模块组件

Country Status (3)

Country Link
US (1) US9565795B2 (enExample)
JP (1) JP2016035993A (enExample)
CN (1) CN204964818U (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105552601A (zh) * 2016-01-26 2016-05-04 成都因纳伟盛科技股份有限公司 小型化身份证阅读器主板与小安全模块的超薄插接组件
CN107546506A (zh) * 2017-07-24 2018-01-05 番禺得意精密电子工业有限公司 夹持件
CN111916925A (zh) * 2019-05-10 2020-11-10 山一电机株式会社 主连接器及具备该主连接器的插座组件
CN112946834A (zh) * 2019-12-10 2021-06-11 住友电气工业株式会社 光收发器

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017105616A1 (en) * 2015-12-18 2017-06-22 Continental Automotive Systems, Inc Sliding thermal shield
US20180084682A1 (en) * 2016-09-20 2018-03-22 Jones Tech (USA), Inc. Shielding structure for an electronic circuit
TWI674495B (zh) * 2017-10-02 2019-10-11 仁寶電腦工業股份有限公司 升降機構及電子裝置
US12028975B2 (en) 2020-11-09 2024-07-02 Samsung Electronics Co., Ltd. Electronic device including shielding member
CN112930070B (zh) * 2021-01-21 2022-08-23 北京字节跳动网络技术有限公司 电子设备
CN115793787A (zh) * 2021-09-10 2023-03-14 英业达科技有限公司 固定装置
TWM649139U (zh) * 2023-07-14 2023-12-01 正文科技股份有限公司 通訊組件及其散熱屏蔽模組

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JPS603878A (ja) * 1983-06-20 1985-01-10 富士通株式会社 混成集積回路ユニツト用コネクタ
US4717989A (en) * 1987-03-30 1988-01-05 Motorola Inc. Heat sink, EMI shield and controller module assembly for a portable radio transceiver
US5506373A (en) * 1993-07-09 1996-04-09 Magnavox Electronic Systems Company Electronic module enclosure
US6178096B1 (en) * 1998-11-25 2001-01-23 The Whitaker Corporation Shielding cover having parts held together by latch members
US6304436B1 (en) * 1999-12-03 2001-10-16 International Business Machines Corporation Connector system with outwardly opening door for a removable transceiver module
US6600865B2 (en) * 2001-06-21 2003-07-29 Hon Hai Precision Ind. Co., Ltd. Stacked GBIC guide rail assembly
JP2004280261A (ja) * 2003-03-13 2004-10-07 Canon Inc 記憶媒体等排出機構
US7133285B2 (en) * 2004-01-23 2006-11-07 Yamaichi Electronics U.S.A., Inc. Electronics connector with heat sink
US7852633B2 (en) * 2008-07-24 2010-12-14 Yamaichi Electronics Co., Ltd. Connector for connection to a module board
US8098493B2 (en) * 2008-08-15 2012-01-17 Finisar Corporation CFP mechanical platform
US8014153B2 (en) * 2008-11-18 2011-09-06 Finisar Corporation Floating front enclosure for pluggable module
CN103201911B (zh) * 2010-10-25 2016-09-28 莫列斯有限公司 插座连接器组件、多隔间插座及混合式壳体
JP5152303B2 (ja) * 2010-11-18 2013-02-27 Ｓｍｋ株式会社 Ｉｃカード装着ユニット、カードコネクタ、カードアダプタ
JP2012239025A (ja) * 2011-05-11 2012-12-06 Sumitomo Electric Ind Ltd 光トランシーバ、及びホストコネクタカバー

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105552601A (zh) * 2016-01-26 2016-05-04 成都因纳伟盛科技股份有限公司 小型化身份证阅读器主板与小安全模块的超薄插接组件
CN105552601B (zh) * 2016-01-26 2018-09-18 成都因纳伟盛科技股份有限公司 小型化身份证阅读器主板与小安全模块的超薄插接组件
CN107546506A (zh) * 2017-07-24 2018-01-05 番禺得意精密电子工业有限公司 夹持件
CN107546506B (zh) * 2017-07-24 2019-06-11 番禺得意精密电子工业有限公司 夹持件
CN111916925A (zh) * 2019-05-10 2020-11-10 山一电机株式会社 主连接器及具备该主连接器的插座组件
US11239589B2 (en) 2019-05-10 2022-02-01 Yamaichi Electronics Co., Ltd. Host connector and receptacle assembly including same
CN111916925B (zh) * 2019-05-10 2022-02-08 山一电机株式会社 主连接器及具备该主连接器的插座组件
CN112946834A (zh) * 2019-12-10 2021-06-11 住友电气工业株式会社 光收发器
CN112946834B (zh) * 2019-12-10 2024-03-08 住友电气工业株式会社 光收发器

Also Published As

Publication number Publication date
JP2016035993A (ja) 2016-03-17
US9565795B2 (en) 2017-02-07
US20160037642A1 (en) 2016-02-04

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term

Granted publication date: 20160113

CX01 Expiry of patent term