JP2016033931A - ワイヤボンディング装置 - Google Patents
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- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/002—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating specially adapted for particular articles or work
- B23K20/004—Wire welding
- B23K20/005—Capillary welding
- B23K20/007—Ball bonding
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/24—Preliminary treatment
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
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- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78252—Means for applying energy, e.g. heating means in the upper part of the bonding apparatus, e.g. in the capillary or wedge
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- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78264—Means for applying energy, e.g. heating means by induction heating, i.e. coils
- H01L2224/78266—Means for applying energy, e.g. heating means by induction heating, i.e. coils in the upper part of the bonding apparatus, e.g. in the capillary or wedge
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- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
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- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/78308—Removable capillary
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- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
- H01L2224/7831—Auxiliary members on the pressing surface
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- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78313—Wedge
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- H01—ELECTRIC ELEMENTS
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- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
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- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
【解決手段】ボンディング対象物へ局所加熱を行うワイヤボンディング装置であって、キャピラリ40と、キャピラリ40の周囲に非接触の状態で配置されたパターンコイル34,35と、パターンコイル34,35に所定の高周波電力を供給する高周波電源50と、を含み、キャピラリ40は、基体部41と、基体部41の外面に設けられ、パターンコイル34,35に印加される所定の高周波電力によって電磁誘導による熱が発生する金属層42と、金属層42の外面と基体部41の先端とを覆い、金属層で発生した熱をボンディング対象物へ伝導するダイヤモンド層43とを備える。
【選択図】図2
Description
Claims (6)
- ボンディング対象物へ局所加熱を行うワイヤボンディング装置であって、
ワイヤボンディングツールと、
前記ワイヤボンディングツールの周囲に非接触の状態で配置されたコイルと、
前記コイルに所定の高周波電力を供給する高周波電源と、
を含み、
前記ワイヤボンディングツールは、
基体部と、
前記基体部の外面に設けられ、前記コイルに印加される前記所定の高周波電力によって電磁誘導による熱が発生する抵抗層と、
前記抵抗層の外面と前記基体部の先端とを覆い、前記抵抗層で発生した熱をボンディング対象物へ伝導する伝熱層とを備えること、
を特徴とするワイヤボンディング装置。 - 請求項1に記載のワイヤボンディング装置であって、
前記高周波電源と前記コイルとのインピーダンスを整合させる整合装置を含むこと、
を特徴とするワイヤボンディング装置。 - 請求項1または2に記載のワイヤボンディング装置であって、
前記抵抗層は、チタン、クロム、ニッケル、タングステン、白金の少なくとも1種またはそれらを基とする合金で構成されていること、
を特徴とするワイヤボンディング装置。 - 請求項1から3のいずれか1項に記載のワイヤボンディング装置であって、
前記伝熱層は、ダイヤモンド、ナノカーボン材料の1種またはそれらを組み合わせた材料で構成されていること、
を特徴とするワイヤボンディング装置。 - 請求項1から4のいずれか1項に記載のワイヤボンディング装置であって、
前記コイルは、複数のパターンコイルを垂直方向に重ねて配置され、
前記パターンコイルを収容するコイルアセンブリは、
前記複数のパターンコイルを覆う上板と下板と、
前記上板と前記下板との間に前記複数のパターンコイルと絶縁体とを含み、
前記絶縁体は、前記複数の上側パターンコイルと下側パターンコイルとの間に挟みこまれて構成され、ボンディング対象物に対してボンディングツールが接離方向に移動する際に、前記上下板、前記絶縁体、前記複数のパターンコイルは、前記ワイヤボンディングツールを非接触状態で移動可能とする貫通孔をそれぞれ含み、
前記複数の上側パターンコイルと前記下側パターンコイルとは前記絶縁体を貫通して互いに電気的に接続されていること、
を特徴とするワイヤボンディング装置。 - 請求項1から4のいずれか1項に記載のワイヤボンディング装置であって、
前記コイルは、一部が切れた円環状の金属線と、前記金属線の各端に接続された各給電線と、を含み、
前記金属線は、表面が絶縁部材によって覆われ、前記各給電線は、剛性のある他の絶縁部材で覆われていること、
を特徴とするワイヤボンディング装置。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012284948A JP5934087B2 (ja) | 2012-12-27 | 2012-12-27 | ワイヤボンディング装置 |
PCT/JP2013/077068 WO2014103463A1 (ja) | 2012-12-27 | 2013-10-04 | ワイヤボンディング装置 |
TW102142904A TWI528478B (zh) | 2012-12-27 | 2013-11-26 | 打線裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012284948A JP5934087B2 (ja) | 2012-12-27 | 2012-12-27 | ワイヤボンディング装置 |
Publications (2)
Publication Number | Publication Date |
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JP2016033931A true JP2016033931A (ja) | 2016-03-10 |
JP5934087B2 JP5934087B2 (ja) | 2016-06-15 |
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JP2012284948A Active JP5934087B2 (ja) | 2012-12-27 | 2012-12-27 | ワイヤボンディング装置 |
Country Status (3)
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JP (1) | JP5934087B2 (ja) |
TW (1) | TWI528478B (ja) |
WO (1) | WO2014103463A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI620261B (zh) * | 2017-06-20 | 2018-04-01 | China Grinding Wheel Corp | Line tool |
JP7168780B2 (ja) | 2018-12-12 | 2022-11-09 | ヘレウス マテリアルズ シンガポール ピーティーイー. リミテッド | 電子部品の接触面を電気的に接続するプロセス |
US11717912B2 (en) * | 2019-03-18 | 2023-08-08 | Shinkawa Ltd. | Capillary guide device and wire bonding apparatus |
US11937979B2 (en) * | 2021-04-27 | 2024-03-26 | Kulicke And Soffa Industries, Inc. | Ultrasonic transducers, wire bonding machines including ultrasonic transducers, and related methods |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4831691B1 (ja) * | 1969-12-18 | 1973-10-01 | ||
JPH0637155A (ja) * | 1992-07-16 | 1994-02-10 | Matsushita Electric Ind Co Ltd | 電極接合装置 |
JPH06268007A (ja) * | 1993-03-17 | 1994-09-22 | Nec Yamagata Ltd | 半導体製造装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007335708A (ja) * | 2006-06-16 | 2007-12-27 | Shinkawa Ltd | ワイヤボンダ、ワイヤボンディング方法及びプログラム |
-
2012
- 2012-12-27 JP JP2012284948A patent/JP5934087B2/ja active Active
-
2013
- 2013-10-04 WO PCT/JP2013/077068 patent/WO2014103463A1/ja active Application Filing
- 2013-11-26 TW TW102142904A patent/TWI528478B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4831691B1 (ja) * | 1969-12-18 | 1973-10-01 | ||
JPH0637155A (ja) * | 1992-07-16 | 1994-02-10 | Matsushita Electric Ind Co Ltd | 電極接合装置 |
JPH06268007A (ja) * | 1993-03-17 | 1994-09-22 | Nec Yamagata Ltd | 半導体製造装置 |
Also Published As
Publication number | Publication date |
---|---|
TW201430976A (zh) | 2014-08-01 |
WO2014103463A1 (ja) | 2014-07-03 |
JP5934087B2 (ja) | 2016-06-15 |
TWI528478B (zh) | 2016-04-01 |
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