JP2016025350A - 伝熱プレート - Google Patents
伝熱プレート Download PDFInfo
- Publication number
- JP2016025350A JP2016025350A JP2015133480A JP2015133480A JP2016025350A JP 2016025350 A JP2016025350 A JP 2016025350A JP 2015133480 A JP2015133480 A JP 2015133480A JP 2015133480 A JP2015133480 A JP 2015133480A JP 2016025350 A JP2016025350 A JP 2016025350A
- Authority
- JP
- Japan
- Prior art keywords
- heat transfer
- transfer device
- channel
- channels
- fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/08—Tubular elements crimped or corrugated in longitudinal section
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
- B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D1/00—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators
- F28D1/02—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid
- F28D1/03—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits
- F28D1/0308—Heat-exchange apparatus having stationary conduit assemblies for one heat-exchange medium only, the media being in contact with different sides of the conduit wall, in which the other heat-exchange medium is a large body of fluid, e.g. domestic or motor car radiators with heat-exchange conduits immersed in the body of fluid with plate-like or laminated conduits the conduits being formed by paired plates touching each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
- F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Geometry (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
101 本体
103 流体入口(入口)
105 流体出口(出口)
107 チャネル
111 チャネル流体入口(チャネル入口)
113 チャネル流体出口(チャネル出口)
Claims (14)
- 伝熱装置であって、
流体入口および流体出口を画定する本体と、
前記流体入口と前記流体出口との間で流体連通している前記本体内に画定される複数のチャネルであって、前記チャネルが、前記流体入口と前記流体出口との間で、織り合わされて互いに流体的に隔離される、チャネルと、を備える、伝熱装置。 - 前記本体が、前記流体入口と前記流体出口との間で、前記チャネルを互いに流体的に隔離する単一マトリクスを画定する、請求項1に記載の伝熱装置。
- 前記伝熱装置が、電気部品に装着されるように構成される、請求項1に記載の伝熱装置。
- 前記本体が、約0.08インチ厚である、請求項2に記載の伝熱装置。
- 前記本体が、各チャネルに対して少なくとも1つのチャネル流体入口を画定する、請求項1に記載の伝熱装置。
- 前記本体が、各チャネルに対して少なくとも1つのチャネル流体出口を画定する、請求項5に記載の伝熱装置。
- 前記チャネルが、波形状であり、波形によって画定される、請求項6に記載の伝熱装置。
- 前記波形状のチャネルが、チャネルの交差および流体連通を回避するために互いに相のずれた各チャネルの前記波形を画定することによって織り合わされる、請求項7に記載の伝熱装置。
- 前記複数のチャネルが、行と列の正方格子状に配列している、請求項7に記載の伝熱装置。
- 前記複数のチャネルが、対角線上に画定され、少なくとも1つの屈曲部を含む、請求項7に記載の伝熱装置。
- 各チャネルが、前記チャネルが前記本体内で熱的に結びつき互いに流体的に隔離されるように、互いに180度相のずれた状態である、請求項10に記載の伝熱装置。
- 前記本体が、アルミニウムを含む、請求項1に記載の伝熱装置。
- 方法であって、
流体入口および流体出口を画定する本体と、前記流体入口と前記流体出口との間で流体連通している前記本体内に画定される複数のチャネルと、を形成することによって伝熱装置を形成することを含み、前記チャネルが、前記流体入口と前記流体出口との間で、織り合わされて互いに流体的に隔離される、方法。 - 形成することが、付加製造によって前記伝熱装置を形成することを含む、請求項13に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/337,444 | 2014-07-22 | ||
US14/337,444 US20160025422A1 (en) | 2014-07-22 | 2014-07-22 | Heat transfer plate |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016025350A true JP2016025350A (ja) | 2016-02-08 |
JP6567344B2 JP6567344B2 (ja) | 2019-08-28 |
Family
ID=53682539
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015133480A Active JP6567344B2 (ja) | 2014-07-22 | 2015-07-02 | 伝熱プレート |
Country Status (3)
Country | Link |
---|---|
US (1) | US20160025422A1 (ja) |
EP (1) | EP2977702B1 (ja) |
JP (1) | JP6567344B2 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9693487B2 (en) * | 2015-02-06 | 2017-06-27 | Caterpillar Inc. | Heat management and removal assemblies for semiconductor devices |
TWM512730U (zh) * | 2015-08-20 | 2015-11-21 | Cooler Master Co Ltd | 水冷式散熱裝置 |
US11346611B2 (en) | 2016-08-16 | 2022-05-31 | Hamilton Sundstrand Corporation | Heat exchangers with multiple flow channels |
JP6477800B2 (ja) * | 2017-08-02 | 2019-03-06 | 三菱マテリアル株式会社 | ヒートシンク |
US10677538B2 (en) | 2018-01-05 | 2020-06-09 | Baltimore Aircoil Company | Indirect heat exchanger |
USD889420S1 (en) * | 2018-01-05 | 2020-07-07 | Baltimore Aircoil Company, Inc. | Heat exchanger cassette |
US11015872B2 (en) * | 2018-06-29 | 2021-05-25 | The Boeing Company | Additively manufactured heat transfer device |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59142382A (ja) * | 1982-12-03 | 1984-08-15 | プッチ・タマラ | 板状熱交換器 |
JPS59221597A (ja) * | 1983-05-30 | 1984-12-13 | Daikin Ind Ltd | 熱交換器 |
JP2000146461A (ja) * | 1998-11-10 | 2000-05-26 | Osaka Gas Co Ltd | 熱交換器 |
JP2005274120A (ja) * | 2004-02-24 | 2005-10-06 | Showa Denko Kk | 液冷式冷却板 |
JP2006295178A (ja) * | 2005-04-11 | 2006-10-26 | Samsung Electronics Co Ltd | 電子素子用ヒートシンク装置 |
JP2008526028A (ja) * | 2004-12-23 | 2008-07-17 | オンスクリーン テクノロジーズ インコーポレイテッド | 熱伝達メッシュを組み込んだ冷却装置 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1172247A (en) * | 1966-04-20 | 1969-11-26 | Apv Co Ltd | Improvements in or relating to Plate Heat Exchangers |
US3854523A (en) * | 1971-08-19 | 1974-12-17 | Du Pont | Liquid heat exchange system |
DE3126618C2 (de) * | 1981-07-06 | 1986-08-07 | Akzo Gmbh, 5600 Wuppertal | Wärmeaustauscher aus Hohlfäden |
DE19528116B4 (de) * | 1995-08-01 | 2007-02-15 | Behr Gmbh & Co. Kg | Wärmeübertrager mit Platten-Sandwichstruktur |
DE60208953T2 (de) * | 2001-07-13 | 2006-09-21 | Lytron, Inc., Woburn | Kühlplatte mit plattem Schlauch zur Flüssigkeitskühlung elektrischer Komponenten |
NL1027640C2 (nl) * | 2004-12-01 | 2006-06-02 | Stichting Energie | Warmtewisselaarelement, warmtewisselaar en werkwijze voor het wisselen van warmte. |
JP5565459B2 (ja) * | 2010-04-21 | 2014-08-06 | 富士電機株式会社 | 半導体モジュール及び冷却器 |
US9952004B2 (en) * | 2013-04-11 | 2018-04-24 | Solid State Cooling Systems | High efficiency thermal transfer plate |
-
2014
- 2014-07-22 US US14/337,444 patent/US20160025422A1/en not_active Abandoned
-
2015
- 2015-07-02 JP JP2015133480A patent/JP6567344B2/ja active Active
- 2015-07-15 EP EP15176907.2A patent/EP2977702B1/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59142382A (ja) * | 1982-12-03 | 1984-08-15 | プッチ・タマラ | 板状熱交換器 |
JPS59221597A (ja) * | 1983-05-30 | 1984-12-13 | Daikin Ind Ltd | 熱交換器 |
JP2000146461A (ja) * | 1998-11-10 | 2000-05-26 | Osaka Gas Co Ltd | 熱交換器 |
JP2005274120A (ja) * | 2004-02-24 | 2005-10-06 | Showa Denko Kk | 液冷式冷却板 |
JP2008526028A (ja) * | 2004-12-23 | 2008-07-17 | オンスクリーン テクノロジーズ インコーポレイテッド | 熱伝達メッシュを組み込んだ冷却装置 |
JP2006295178A (ja) * | 2005-04-11 | 2006-10-26 | Samsung Electronics Co Ltd | 電子素子用ヒートシンク装置 |
Also Published As
Publication number | Publication date |
---|---|
EP2977702A1 (en) | 2016-01-27 |
US20160025422A1 (en) | 2016-01-28 |
EP2977702B1 (en) | 2019-03-06 |
JP6567344B2 (ja) | 2019-08-28 |
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