JP2016025331A5 - - Google Patents

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Publication number
JP2016025331A5
JP2016025331A5 JP2014151122A JP2014151122A JP2016025331A5 JP 2016025331 A5 JP2016025331 A5 JP 2016025331A5 JP 2014151122 A JP2014151122 A JP 2014151122A JP 2014151122 A JP2014151122 A JP 2014151122A JP 2016025331 A5 JP2016025331 A5 JP 2016025331A5
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Japan
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semiconductor region
region
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semiconductor
imaging device
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JP2014151122A
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Japanese (ja)
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JP2016025331A (ja
JP6406911B2 (ja
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Priority to JP2014151122A priority Critical patent/JP6406911B2/ja
Priority claimed from JP2014151122A external-priority patent/JP6406911B2/ja
Priority to US14/805,254 priority patent/US9391102B2/en
Priority to CN201510441369.0A priority patent/CN105280660B/zh
Publication of JP2016025331A publication Critical patent/JP2016025331A/ja
Publication of JP2016025331A5 publication Critical patent/JP2016025331A5/ja
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Publication of JP6406911B2 publication Critical patent/JP6406911B2/ja
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JP2014151122A 2014-07-24 2014-07-24 撮像装置及び撮像装置の製造方法 Active JP6406911B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014151122A JP6406911B2 (ja) 2014-07-24 2014-07-24 撮像装置及び撮像装置の製造方法
US14/805,254 US9391102B2 (en) 2014-07-24 2015-07-21 Imaging device
CN201510441369.0A CN105280660B (zh) 2014-07-24 2015-07-24 成像设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014151122A JP6406911B2 (ja) 2014-07-24 2014-07-24 撮像装置及び撮像装置の製造方法

Publications (3)

Publication Number Publication Date
JP2016025331A JP2016025331A (ja) 2016-02-08
JP2016025331A5 true JP2016025331A5 (https=) 2017-08-31
JP6406911B2 JP6406911B2 (ja) 2018-10-17

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JP2014151122A Active JP6406911B2 (ja) 2014-07-24 2014-07-24 撮像装置及び撮像装置の製造方法

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US (1) US9391102B2 (https=)
JP (1) JP6406911B2 (https=)
CN (1) CN105280660B (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6727830B2 (ja) * 2016-02-09 2020-07-22 キヤノン株式会社 撮像装置
JP6719984B2 (ja) * 2016-06-06 2020-07-08 キヤノン株式会社 撮像装置、撮像システム
JP7013119B2 (ja) * 2016-07-21 2022-01-31 キヤノン株式会社 固体撮像素子、固体撮像素子の製造方法、及び撮像システム
CN110832844B (zh) * 2017-07-07 2021-11-09 普里露尼库斯新加坡私人有限公司 固态摄像装置、固态摄像装置的驱动方法、以及电子设备
WO2019193800A1 (ja) * 2018-04-04 2019-10-10 ソニーセミコンダクタソリューションズ株式会社 固体撮像素子および撮像装置
US12490539B2 (en) 2020-05-29 2025-12-02 Sony Semiconductor Solutions Corporation Semiconductor device and electronic apparatus
WO2025258462A1 (ja) * 2024-06-12 2025-12-18 株式会社ニコン 撮像素子、および撮像装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006197392A (ja) * 2005-01-14 2006-07-27 Canon Inc 固体撮像装置、カメラ、及び固体撮像装置の駆動方法
JP4459098B2 (ja) * 2005-03-18 2010-04-28 キヤノン株式会社 固体撮像装置及びカメラ
JP2008205639A (ja) * 2007-02-16 2008-09-04 Texas Instr Japan Ltd 固体撮像装置及びその動作方法
JP2008305983A (ja) * 2007-06-07 2008-12-18 Nikon Corp 固体撮像素子
CN101752392A (zh) * 2008-12-02 2010-06-23 上海华虹Nec电子有限公司 四晶体管cmos图像传感器及其制造方法
JP5558859B2 (ja) * 2010-02-18 2014-07-23 キヤノン株式会社 固体撮像装置および固体撮像装置の製造方法
JP2011204797A (ja) * 2010-03-24 2011-10-13 Sony Corp 固体撮像装置とその製造方法、及び電子機器
JP5767465B2 (ja) * 2010-12-15 2015-08-19 キヤノン株式会社 固体撮像装置およびその製造方法ならびにカメラ
JP5959877B2 (ja) * 2012-02-17 2016-08-02 キヤノン株式会社 撮像装置
DE102012101368B4 (de) * 2012-02-21 2020-02-27 Leuze Electronic Gmbh & Co. Kg Lichtvorhang

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