JP2016022554A - Surface plate unit - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a surface plate unit mounting a thin substrate on a surface plate in a processable manner and smoothly performing carrying-in and carrying-out of the thin substrate on the basis of vertical movements of a plurality of linear materials.SOLUTION: A surface plate unit includes: a surface plate 11 having a mounting section 12 on which a glass substrate 10 to be processed is mounted; support members 18a and 18b which have frames 13 located on each side facing the surface plate 11 and support each end of a plurality of wires 17 on the frames 13; and a lifting device 20 which synchronously vertically moves the plurality of wires 17 by vertically moving the support members 18a and 18b so as to perform carrying-in and carrying-out of the glass substrate 10 to/from the mounting section 12. When the glass substrate 10 is mounted on the mounting section 12, the surface plate 11 includes a groove 16 as a storage section of the wires 17 so that the wires 17 do not come into contact with the glass substrate 10.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a surface plate unit including a surface plate on which a thin substrate to be processed is placed, and more particularly to a surface plate unit that smoothly carries in and out a thin substrate.

A thin substrate such as a glass substrate used for a liquid crystal panel is subjected to various processes such as polishing and heating in the manufacturing process of the product. Since these processes are required to be performed uniformly, they are usually performed by placing them on a surface plate having a flat surface.
When a thin substrate is processed on a surface plate, generally, the thin substrate is gripped by a robot or the like, conveyed to the surface plate, and set on the mounting portion. The processed thin substrate is also unloaded from the surface plate using a robot or the like.
As a method for loading and unloading the glass substrate, there are a method in which suction is performed with a suction portion provided at the tip of the robot arm, a method in which the glass substrate is placed on a robot fork, a method in which the glass substrate is gripped with a robot hand, and the like.
When the glass substrate is thin, the sucked portion of the glass substrate is deformed by the sucking method, so that a robot fork or a robot hand is often used.

When a glass substrate is loaded on a robot fork and carried in, the glass substrate is floated on a surface plate and then only the robot fork is pulled out to set the glass substrate on the mounting portion. Moreover, when carrying out a glass substrate using a robot hand, the periphery of a glass substrate cannot be hold | gripped unless the glass substrate is made into the state which floated from the surface plate.
Therefore, a method using lift pins disclosed in Patent Document 1 is known as a technique for floating a thin substrate on a surface plate when carrying the thin substrate in and out.
In this method, when the glass substrate is placed on the robot fork and carried onto the surface plate, the lift pins are projected from the surface plate at positions that do not overlap the robot fork. In this way, only the glass substrate is lifted, and a gap can be formed between the robot fork and the glass substrate, so that only the robot fork can be pulled out.
For processed glass substrates, a lift pin can be projected from the surface plate to create a gap between the glass substrate and the surface plate. Can do.

JP 2014-99542 A

However, since the pin protruding from the surface plate has a small tip area, there is a problem that if the relative speed when the glass substrate and the pin come into contact with each other is increased, a hole is formed or cracked in the glass substrate due to the impact at the time of contact. It was. For this reason, when carrying the glass substrate into and out of the surface plate, it was necessary to perform a series of operations slowly so as not to damage the glass substrate.
In place of the pins, a method of arranging a plurality of linear members under the glass substrate and lifting them up is also conceivable. According to this method, since the contact between the glass substrate and the linear material is a linear contact, even if a series of operations when carrying the glass substrate into and out of the surface plate is performed at a high speed, a plurality of linear shapes are used. The impact is dispersed throughout the material and the above problem does not occur. In addition, since the deflection of the glass substrate and the deflection of the linear material are assimilated, even if the linear material is moved up and down at high speed, an excessive force is not applied to the glass substrate and it is difficult to damage.
However, in this method, since the linear material is exposed to the mounting portion of the surface plate, when the glass substrate is set to the mounting portion of the surface plate, the linear material is interposed between the glass substrate and the mounting portion. become.
For this reason, if processing such as polishing is performed on the glass substrate in this state, excessive pressure is applied to the contact portion with the linear material to damage the substrate, and uniform processing cannot be performed. This causes a problem that the glass substrate cannot be appropriately processed.

  The present invention has been made in view of the above-described circumstances, and when a thin substrate is carried into and out of a surface plate, the linear material is moved up and down above the surface plate to thereby form a thin substrate. In order to smoothly carry in and out of the surface plate, a linear material can be accommodated in the surface plate so that the linear material does not get in the way when processing thin substrates. The purpose is to provide a board unit.

  In the surface plate unit according to the present invention, a surface plate having a mounting portion on which a thin substrate to be processed is mounted, and a frame are positioned on opposite sides of the surface plate, and a plurality of frames are provided on these frames. A supporting member for supporting each end portion of the linear material; and the vertical movement of the plurality of linear materials by moving the supporting member up and down to carry the thin substrate into the mounting portion; An elevating device for carrying out, and when the thin substrate is placed on the mounting portion, the wire is placed on the surface plate so that the linear material does not hit the thin substrate. An accommodation part for the material is provided.

  ADVANTAGE OF THE INVENTION According to this invention, while being able to smoothly carry in and carrying out the thin board | substrate with respect to a surface plate, the process with respect to a thin board | substrate can be performed smoothly.

It is a figure which shows the surface plate unit which concerns on embodiment of this invention, (a) is a front view, (b) is a top view, (c) is a left view. It is a figure for demonstrating the vertical motion of the linear material in the surface plate unit which concerns on embodiment of this invention. It is a figure which shows the mode of the linear material accommodated in the accommodating part in the surface plate unit which concerns on embodiment of this invention. (A) is AA sectional drawing of FIG.1 and FIG.3, (b) is BB sectional drawing of FIG. 3, (c) is CC sectional drawing of FIG. It is a figure which shows the supporting member which concerns on embodiment of this invention. It is a figure for demonstrating the carrying-in method of a glass substrate. It is a figure for demonstrating the carrying-out method of a glass substrate.

Hereinafter, embodiments of the surface plate unit of the present invention will be described with reference to the drawings.
FIG. 1 is a view showing a surface plate unit according to an embodiment of the present invention, in which (a) is a front view, (b) is a plan view, and (c) is a left side view.
FIG. 2 is a view for explaining the vertical movement of the linear member in the surface plate unit according to the embodiment of the present invention.
As shown in these drawings, the surface plate unit of the present embodiment includes a surface plate 11 on which a glass substrate 10 (thin substrate) is placed.
The surface plate 11 is horizontally supported by a plurality of pole members 14 fixed to a substructure such as concrete, and has a rectangular mounting portion 12 on the upper surface.
The placement portion 12 is a region on which the glass substrate 10 formed at the substantially central portion of the upper surface of the surface plate 11 is placed, and is formed in a flat shape.
The glass substrate 10 is subjected to processing such as polishing while being placed on the placement portion 12.

In addition, the mounting portion 12 is formed with a storage portion capable of storing a linear material.
Specifically, the groove 16 that can accommodate the wire 17 (wire material) erected on the placement portion 12 by the support member 18 described later without being exposed from the placement surface is formed as the accommodation portion. .
Providing the groove 16 prevents the wire 17 from being interposed between the glass substrate 10 set on the mounting unit 12 and the mounting unit 12 while the wire 17 is installed on the mounting unit 12. Can do.
Thereby, since the wire 17 does not get in the way when the glass substrate 10 is processed, the problem that the glass substrate 10 is damaged or cannot be uniformly processed by contact with the wire 17 can be prevented.
The groove 16 is formed with a width and depth larger than the diameter of the wire 17 so as to function as a housing portion for the linear material.
The grooves 16 include at least the number of grooves 16 corresponding to the number of wires 17 to be installed.
In the surface plate unit of the present embodiment, four wires 17 are installed, and four grooves 16 corresponding to the wires 17 are formed.

FIG. 3 is a diagram illustrating a state of the linear material housed in the housing portion in the surface plate unit according to the embodiment of the present invention, and is a schematic diagram when the surface plate is viewed from above.
4A is a sectional view taken along line AA in FIGS. 1 and 3, FIG. 4B is a sectional view taken along line BB in FIG. 3, and FIG. 4C is a sectional view taken along line CC in FIG.
As the linear material, for example, a steel wire 17 having a diameter of 0.2 mm to 0.5 mm can be used.
The reason why the linear material has such a thickness is that if the diameter is less than 0.2 mm, the wire may be broken due to insufficient strength. On the other hand, if the diameter exceeds 0.5 mm, the contact surface with the glass substrate 10 This is for avoiding such a problem since the dust becomes large and dust is easily generated upon contact.
Moreover, in order to avoid the contact of the dust in a groove | channel with a linear material, the groove | channel 16 is larger than the diameter of a linear material, for example, it is preferable to form in the width | variety and depth of 0.4 mm-1.0 mm.
According to such a relationship between the linear material and the groove 16, the wire 17 can be accommodated in the groove 16 in a form that is not exposed from the placement surface of the surface plate 11 and placed on the placement portion 12. The glass substrate 10 thus made can be lifted by a plurality of wires 17.

As shown in FIG. 1 and FIG. 3 (a), the wire 17 can be made of steel wires 17 with exposed metal portions as they are.
Further, as shown in FIGS. 3A, 3B, and 4B, a linear material in which the surface of the wire 17 is coated with a resin 171 is used for all or a part of the number (inner two). You can also.
Thus, by using the wire 17 whose surface is coated with the resin 171 as a linear material, the impact when the wire 17 lifts the glass substrate 10 can be absorbed by the resin 171.
Thereby, it can prevent that the glass substrate 10 is damaged by the contact with the wire 17.
The thickness of the coating with the resin 171 is about 0.1 mm. Moreover, DLC (Diamond-Like Carbon) can also be used for coating, and the thickness of the coating in this case is about 0.003 mm.

Further, as shown in FIGS. 3C, 3D, and 4C, the entire surface is basically coated with a resin 171 for all or some of the numbers (inner two). However, it is also possible to use a linear material that is not partially coated and in which the metal portion (conductor portion) of the wire 17 is exposed.
The reason why the linear material not coated with resin is used in a part of the wire 17 is that the resin material has a merit that the glass substrate 10 is hardly damaged, but static electricity is easily charged by friction with the surface plate 11 and the like. .
That is, when static electricity is charged on the resin surface of the wire 17, a discharge occurs when the glass substrate 10 is touched, and an unintended high voltage current flows through the electronic circuit mounted on the glass substrate 10, causing a failure. Because there is.
In this regard, if a wire 17 not partially coated with resin is used and a grounding wire can be connected to an exposed portion (conductor portion) of the wire 17 not coated with resin, the static electricity generated on the resin surface is released. Accordingly, the electronic component mounted on the glass substrate 10 can be protected. For example, it is possible to previously install a terminal of the ground wire in the groove 16 so that the conductor portion of the wire 17 and the ground wire come into contact when the wire 17 is accommodated in the groove 16.

A long plate-like frame 13 is disposed on the opposite sides (left side and right side in plan view) of the placement unit 12.
A support member 18 for attaching the wire 17 on the surface plate 11 is attached to the upper surface of the frame 13.
The support members 18 (18a, 18b) are respectively attached to the opposing positions of the left and right frames 13, and the ends of the wires 17 are supported by the respective support members 18 so that the wire 17 is placed on the surface plate 11 (mounting portion 12). ) It is erected on top.
Hereinafter, a specific construction method of the wire 17 using the support member 18 (18a, 18b) will be described.

FIG. 5 is a view showing a support member according to the embodiment of the present invention.
As shown in FIG. 5, the support member 18 includes a fixing member such as a bolt 183 for fixing the end portion of the wire 17 and a pulley 182 for guiding the wire 17 to the fixing member. 181 is attached to the upper and lower portions of the upstanding surface.
5A illustrates an example in which the support member 18a is attached to the left frame 13, and FIG. 5B illustrates an example in which the support member 18b is attached to the right frame 13. (See FIGS. 1 and 2).
However, the embodiment is not limited to this, and the support member 18a may be attached to the right, the support member 18b may be attached to the left, or the support member 18b may be attached to both.

In constructing the wire 17, first, in the support member 18 b, a bolt 183 having a through hole 187 on the outer periphery of the bolt head is inserted into a bolt hole (not shown) below the mounting bracket 181, and this is a nut (not shown). To fasten and fix (temporarily fix) from the back side.
Next, the wire 17 subjected to the end treatment by the crimping member 186 larger than the through-hole 187 is inserted into the through-hole 187 from the open end side, and the support member 18a facing the support member 18a via the pulley 182 above the mounting bracket 181. It arranges toward.
Subsequently, in the support member 18a, the end portion of the wire 17 guided through the pulley 182 above the mounting bracket 181 is fixed by the bolt 183 while being sandwiched between the nuts 184 with a washer below the mounting bracket 181.
Thereby, the wire 17 can be constructed between the supporting member 18a and the supporting member 18b which oppose.

Moreover, the tension | tensile_strength of the wire 17 can be adjusted by increasing the winding of the wire 17 in the bolt head outer periphery of the volt | bolt 183 in the supporting member 18b.
Specifically, the tension of the wire 17 can be increased by rotating the bolt 183 clockwise, and the tension of the wire 17 can be decreased by rotating the bolt 183 counterclockwise.
That is, the support member 18 b also functions as a tension adjusting member that adjusts the tension of the wire 17.
Since the support member 18 b is provided for each wire 17, when laying a plurality of wires 17, the support members 18 b can be held while being adjusted one by one so as not to cause a tension difference between the wires 17. .
Therefore, when the glass substrate 10 is lifted by the wire 17, it is possible to prevent the glass substrate 10 from being distorted due to a difference in tension between the plurality of wires 17.
The wire 17 constructed by the support member 18 can be moved up and down by the lifting device 20.

The elevating device 20 is installed on the lower side of the frame 13.
Specifically, the lifting device 20 includes an electric cylinder 21, a telescopic member 22 such as a rod, a guide member 23, and a housing 24.
The electric cylinder 21 has a built-in motor, and the telescopic member 22 expands and contracts in the vertical direction according to the rotation of the motor. The electric cylinder 21 is fixed to the casing 24 installed on the floor surface, and the distal end portion of the elastic member 22 is fixed to the lower surface of the frame 13.
The guide member 23 is attached to the side surface of the casing 24 corresponding to the side surface of the frame 13 extending in a direction perpendicular to the floor surface in order to guide the frame 13 in the vertical direction.
If it does in this way, the electric cylinder 21 will be actuated and the flame | frame 13 can be moved upwards by extending the expansion-contraction member 22, and according to this, the support member 18 attached on the flame | frame 13 is moved upwards. Can do. Further, the frame 13 can be moved downward by contracting the telescopic member 22, and the support member 18 attached on the frame 13 can be moved downward accordingly (see FIG. 2).

According to the lifting device 20 having such a configuration, the support member 18 can be moved up and down by driving the electric cylinder 21, and thereby the plurality of wires 17 installed by the support member 18 are moved up and down in synchronization. Can be made. Thereby, the glass substrate 10 placed on the placement unit 12 can be moved up and down using the plurality of wires 17.
At this time, the glass substrate 10 is supported in a state where the plurality of wires 17 are in line contact with each other. Further, in the state where the glass substrate 10 is supported by the wire 17 in this way, the deflection of the wire 17 and the deflection of the glass substrate 10 are assimilated.
Thereby, the glass substrate 10 can be moved up and down while preventing damage due to impact.
Moreover, in the lifting / lowering apparatus 20, the expansion / contraction operation | movement of the expansion-contraction member 22 can be accelerated | stimulated, and the movement of the wire 17 supported by the flame | frame 13 can be sped up.
For this reason, the glass substrate 10 can be moved up and down at high speed without applying an excessive force.

According to the surface plate unit configured as described above, the wire 17 is disposed in the surface plate 11 so as to be accommodated, and is set on the mounting portion 12 so that the wire 17 does not get in the way when the glass substrate 10 is processed. In addition, the set glass substrate 10 can be moved up and down safely and at high speed by moving the plurality of wires 17 up and down.
Loading and unloading of the glass substrate 10 with respect to the surface plate 11 is performed by using the vertical movement of the glass substrate 10 synchronized with the vertical movement of the plurality of wires 17.
Hereinafter, the carrying-in method and the carrying-out method of the glass substrate 10 are demonstrated.

First, the glass substrate carrying-in method will be described.
FIG. 6 is a view for explaining a glass substrate carrying-in method.
As shown in FIG. 6A, in the initial state, the glass substrate 10 is not placed on the surface plate 11 (the placement portion 12), and a plurality of wires 17 are accommodated in the grooves 16. ing.
Here, the glass substrate 10 is carried in using a robot fork 30 in which a plurality of forks extend substantially in parallel.
Specifically, first, the robot fork 30 on which the glass substrate 10 is arranged is set on the surface plate 11 (mounting unit 12), and the glass substrate 10 is carried in (b). Each fork is arranged in a region where it does not overlap with the groove 16 on the mounting portion 12, that is, the wire 17.

Next, the wire 17 is raised (c). Specifically, the wire 17 in the erected state is raised by raising the frame 13 (support member 18) by the lifting device 20. Thereby, the glass substrate 10 is lifted by the plurality of wires 17, and a gap is formed between the glass substrate 10 and the robot fork 30.
Subsequently, the robot fork 30 is pulled out (d). In the previous step (c), since a gap is formed between the glass substrate 10 and the robot fork 30, only the robot fork 30 can be pulled out.
Then, the wire 17 is lowered (e). Thereby, the wire 17 is accommodated in the groove 16 and the glass substrate 10 is placed on the placement portion 12.

Next, a method for carrying out the glass substrate will be described.
FIG. 7 is a diagram for explaining a glass substrate carry-out method.
As shown in FIG. 7A, the processed glass substrate 10 is placed on the surface plate 11 (mounting portion 12), and the wire 17 is accommodated in the groove 16.
First, the wire 17 is raised (b). Specifically, by raising the frame 13 (supporting member 18) by the lifting device 20, the wire 17 of the installation object is raised. As a result, the glass substrate 10 is lifted by the plurality of wires 17, and a gap is formed between the glass substrate 10 and the surface plate 11 (mounting portion 12).
Here, the glass substrate 10 is carried out by using the robot hand 31 that can hold the thin substrate with two or more fingers. Specifically, in the previous step (b), the peripheral edges on both sides of the glass substrate 10 that can be gripped by forming a gap with the surface plate 11 are gripped by the two robot hands 31 ( c) Carrying out of the surface plate unit (d).
After the glass substrate 10 is gripped and carried out by the robot hand 31, the wire 17 is lowered, whereby the wire 17 is accommodated in the groove 16 and returns to the initial state (e).

According to such a glass substrate 10 carrying-in method and carrying-out method, the wire 17 can be moved up and down at high speed without damaging the glass substrate 10, thereby shortening the time taken to carry in and carry out the glass substrate 10. can do.
For example, in the conventional case where lift pins are used, it takes 2.5 seconds for lift-up for loading and unloading and 2.0 seconds for lift-down. Each takes only 0.7 seconds and can be reduced by 3.1 seconds.

  Although the present invention has been described with reference to the preferred embodiments, the present invention is not limited to the above-described embodiments, and various modifications can be made within the scope of the present invention. Nor.

For example, in the above-described embodiment, the glass substrate 10 has been described as the thin substrate. However, the present invention is not limited to such a mode, and may be applied to any thin substrate such as a film substrate used for a printed circuit board. Can do.
Further, the wire 17 is not limited to the above-described embodiment, and an arbitrary number of wires 17 can be installed at a predetermined interval according to the size, material, and the like of the thin substrate.
Moreover, it is not restricted to the structure of the support member 18b shown in FIG.5 (b), If it is a member which can wind up and fix a linear material, it can also be used as a tension adjustment member.
Moreover, although the case where the robot fork 30 is used as the loading means for the glass substrate 10 and the robot hand 31 is used as the unloading means has been described, the robot fork 30 may be used for unloading and the robot hand 31 may be used for loading. It is applicable also when carrying out and carrying out using either one.

  INDUSTRIAL APPLICABILITY The present invention can be used in the technical field related to a surface plate used when processing a thin substrate such as a glass substrate.

10 Glass substrate (thin substrate)
11 Surface plate 12 Placement part 13 Frame 14 Pole member 16 Groove (accommodating part)
17 Wire (Linear material)
171 Resin 18 Support member 20 Lifting device 21 Electric cylinder 22 Telescopic member 23 Guide member 24 Case 30 Robot fork 31 Robot hand

Claims (4)

A surface plate having a placement portion on which a thin substrate to be processed is placed;
Frames are respectively positioned on opposite sides of the surface plate, and support members that respectively support the ends of a plurality of linear members on the frames,
An elevating device that vertically moves the plurality of linear members by moving the support member up and down, and carries in and out the thin substrate with respect to the placement unit;
In order to prevent the linear material from coming into contact with the thin substrate when the thin substrate is placed on the placing portion, the linear plate is provided with a receiving portion for the linear material. A featured surface plate unit.   2. The surface plate unit according to claim 1, wherein the accommodating portion of the linear material is a plurality of grooves formed in the mounting portion of the surface plate.   The platen unit according to claim 1 or 2, wherein the plurality of linear members are wires, or a part or all of them are resin-coated on the surface of the wires.   The surface plate unit according to any one of claims 1 to 3, wherein the plurality of linear members are held on the frame via a tension adjusting member.

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