JP2016021553A - Component mounting device and method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide component mounting device and method that can enhance the mounting efficiency of a component having a pair of leads onto a board to enhance the productivity.SOLUTION: A component mounting device has a head for griping an electronic component 2 having a pair of leads 4, a head moving mechanism for moving the head to insert the leads 4 of the electronic component 2 into through-holes of a board, thereby mounting the electronic component onto the board, and a lead correction jig 17 having a pair of slope faces 45 and a pair of slope faces 55 which are inclined to different directions. The leads 4 of the electronic component 2 gripped by the head moved by the head moving mechanism are pressed against the slope faces 45 or the slope faces 55 by the lead correction jig 17, whereby the leads 4 are displaced to approach to or separate from each other, thereby correcting the lead width Lw.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting a component held by a head on a substrate.

  There is known a component mounting apparatus that grips an electronic component with a movable head, moves the head onto a substrate, and mounts the electronic component on the substrate (for example, see Patent Document 1).

Japanese Unexamined Patent Publication No. 2013-93536

  In such a component mounting apparatus, when a lead of a radial lead type electronic component having a pair of leads extending downward from the component main body is inserted into the through hole of the substrate and mounted on the substrate, The interval between leads (lead width) needs to be within a preset allowable range. Therefore, in such a component mounting apparatus, when mounting a radial lead type electronic component, the lead width of the electronic component is detected, and it is determined whether or not the detected lead width is within a preset allowable range. To do. If it is determined that the lead width is within the allowable range, the electronic component is mounted on the board.

  In a component mounting apparatus that makes such a determination, if there are many electronic components whose lead widths are outside the allowable range, the mounting efficiency of the electronic components on the substrate is lowered, and the productivity is lowered. In response to this, for example, by changing the allowable range of the lead width within a predetermined margin range by the apparatus operator, it is possible to improve the mounting efficiency by reducing electronic components whose lead width is out of the allowable range. . However, changing the allowable range of the lead width has a problem of affecting the mounting efficiency of other electronic components that differ in, for example, the lead width and the size of the through hole of the substrate into which the lead is inserted.

  The present invention has been made to solve the above problems, and provides a component mounting apparatus and a component mounting method capable of improving the mounting efficiency when mounting an electronic component having a pair of leads on a substrate. The purpose is that.

In order to achieve the above object, the component mounting apparatus of the present invention includes:
A head for gripping a component having a pair of leads;
A head moving mechanism for moving the head to insert the lead of the component into a through-hole of the substrate and mounting the component on the substrate;
A lead correction unit having a pair of inclined surfaces inclined in different directions, and the lead of the component held by the head moved by the head moving mechanism is pressed against the inclined surface of the lead correction unit; A lead correction jig for correcting the lead width by displacing the leads in a direction approaching or separating from each other,
It is characterized by providing.

  According to this component mounting apparatus, the lead of the component can be easily pressed and corrected in the direction of approaching or separating from the inclined surface provided in the lead correcting portion of the lead correcting jig, and the lead width can be easily corrected. As a result, components that could not be mounted on the substrate because the lead width was out of the allowable range can be mounted on the substrate. Therefore, without changing the allowable range of the lead width forcibly and resetting it, the mounting efficiency of components on the board can be improved, the tact time can be shortened, and the productivity can be improved. be able to.

  In the component mounting apparatus according to the aspect of the invention, it is preferable that the lead correction jig includes a plurality of the lead correction portions having different intervals between the inclined surfaces.

  According to this component mounting apparatus, the leads of a plurality of types of components having different lead widths can be displaced and corrected with one lead correction jig. Thereby, the tact time of one cycle in the component mounting process for mounting a plurality of types of components having different lead widths on the substrate can be shortened.

In the component mounting apparatus of the present invention, the lead correction unit includes a recess having a pair of inclined surfaces gradually approaching in the pressing direction of the component held by the head moved by the head moving mechanism,
It is preferable that the parts are moved closer to each other along the inclined surface by inserting the leads into the recesses.

  According to this component mounting apparatus, by inserting the lead of a component having a wide lead width into the concave portion of the lead correction portion, the leads can be displaced and corrected in directions close to each other.

In the component mounting apparatus according to the aspect of the invention, the lead correction unit includes a convex portion having a pair of inclined surfaces that are gradually separated toward a pressing direction of the component held by the head moved by the head moving mechanism. ,
It is preferable that the parts are spaced apart from each other by the protrusions being inserted between the leads so that the leads are displaced along the inclined surface.

  According to this component mounting apparatus, by inserting the convex portion of the lead correcting portion between the leads of a component having a narrow lead width, the leads can be displaced and corrected in directions away from each other.

In the component mounting apparatus of the present invention, the lead correction portion includes a pair of concave portions having a pair of inclined surfaces gradually approaching in a pressing direction of the component held by the head moved by the head moving mechanism, A convex portion having a pair of inclined surfaces that are gradually separated toward the pressing direction of the component held by the head moved by a head moving mechanism;
The parts are inserted into the recesses so that the leads are displaced along the inclined surface and are close to each other, and the protrusions are inserted between the leads. Preferably, the leads are displaced along the inclined surface and separated from each other.

  According to this component mounting apparatus, by inserting the lead of a component with a wide lead width into the concave portion of the lead correction section, the lead can be corrected by being displaced in a direction close to each other, and the lead width is reduced. By inserting the convex portion of the lead correction portion between the leads, the leads can be displaced and displaced in directions away from each other.

  In the component mounting apparatus according to the aspect of the invention, it is preferable that at least one of the inclined surfaces of the lead correction unit can change the interval between the inclined surfaces.

  According to this component mounting apparatus, the lead width of the component can be easily corrected by changing the interval between the inclined surfaces of the lead correction portion corresponding to the lead width of the component.

  In the component mounting apparatus according to the aspect of the invention, it is preferable that the lead correction jig includes a lead correction member in which the concave portion and the convex portion are formed adjacent to each other.

  According to this component mounting apparatus, since the concave portion for bringing the lead width of the component close to each other and the convex portion for separating the lead width of the component are formed adjacent to the lead correction member, the cost due to the reduction in the number of components and the simplification of the structure. It is possible to easily correct the lead width of the component while downing.

In the component mounting apparatus of the present invention, a lead width measuring unit that measures the lead width of the component gripped by the head,
When the lead width measured by the lead width measuring unit is out of a preset allowable range, the component held by the head by the head moving mechanism is pressed against the lead correction jig and the component A control unit for correcting the lead width of
It is preferable to provide.

  According to this component mounting apparatus, a component whose lead width is out of the allowable range can be easily detected, and the lead width of the component can be easily corrected by the lead correcting jig.

The component mounting method of the present invention includes:
A component mounting method for mounting a component having a pair of leads on the substrate by inserting the lead into a through hole of the substrate,
Causing the head to grip the component,
Measure the lead width of the component held by the head,
It is determined whether the measured lead width is out of a preset allowable range,
When the lead width is out of the allowable range, the lead is brought into contact with the inclined surface by pressing the component against a lead correcting jig having a lead correcting portion having a pair of inclined surfaces inclined in different directions. By displacing the leads in the direction of approaching or separating from each other, the lead width is corrected,
The lead of the component whose lead width is corrected is inserted into a through hole of the substrate, and the component is mounted on the substrate.

  According to this component mounting method, the lead width of a component whose lead width is out of the allowable range can be corrected with the lead correction jig and mounted on the substrate. As a result, components that could not be mounted on the substrate because the lead width was out of the allowable range can be mounted on the substrate. Therefore, without changing the allowable range of the lead width forcibly and resetting it, the mounting efficiency of components on the board can be improved, the tact time can be shortened, and the productivity can be improved. be able to.

  According to the component mounting apparatus of the present invention, it is possible to provide a component mounting apparatus and a component mounting method capable of improving the productivity by increasing the mounting efficiency of a component having a pair of leads on a substrate.

It is a schematic block diagram of the component mounting apparatus which concerns on this embodiment. It is a schematic side view of a part of a component mounting apparatus. It is a side view of the electronic component gripped by the head of the component mounting apparatus. It is a perspective view of the lead correction jig fixed to the base of the component mounting apparatus. It is the perspective view seen from the lead proximity correction part side of the lead correction jig. It is a figure explaining the correction | amendment operation | movement of the lead of an electronic component, Comprising: (a) is a front view of a lead proximity correction part, (b) is a perspective view of a lead proximity correction part. It is the perspective view seen from the lead spacing correction part side of the lead correction jig. It is a figure explaining the correction | amendment operation | movement of the lead | read | reed of an electronic component, Comprising: (a) is a front view of a lead space | interval correction | amendment part, (b) is a perspective view of a lead space | interval correction | amendment part. It is a flowchart explaining the component mounting method which mounts an electronic component. 6 is a perspective view of a lead correction jig according to Modification 1. FIG. It is a perspective view of the lead correction mechanism part of the lead correction jig shown in FIG. It is a perspective view of the base and base member which constitute a lead correction mechanism part. It is a perspective view of the lead proximity correction slide member which comprises a lead correction mechanism part. It is a perspective view of a lead separation correction slide member which constitutes a lead correction mechanism part. It is a figure explaining a lead correction mechanism part, Comprising: (a) is a perspective view in the case of using as a lead proximity correction part, (b) is a perspective view in the case of using as a lead separation | spacing correction part. It is a figure explaining a lead correction mechanism part, Comprising: (a) is a schematic side view at the time of using as a lead proximity correction part, (b) is a schematic side view at the time of using as a lead space | interval correction part. 10 is a perspective view of a lead correction jig according to Modification 2. FIG. It is a perspective view of a lead correction jig. It is a front view of the lead correction board which comprises a lead correction jig.

Embodiments of a component mounting apparatus and a component mounting method according to the present invention will be described below with reference to the drawings.
FIG. 1 is a schematic configuration diagram of a component mounting apparatus according to the present embodiment. FIG. 2 is a schematic side view of a part of the component mounting apparatus. FIG. 3 is a side view of the electronic component held by the head of the component mounting apparatus.

  As shown in FIGS. 1 and 2, the component mounting apparatus 10 according to the present embodiment includes a substrate transport unit 11, a component supply unit 12, a head 13, an XY moving mechanism (head moving mechanism) 14, and an elevating mechanism. (Head moving mechanism) 15, a laser recognition device (lead width measuring unit) 16, a lead correction jig 17, and a component storage unit 18 are provided. The component mounting apparatus 10 includes a control device (control unit) 21, an operation unit 22, and a display unit 23. The component mounting apparatus 10 is an apparatus for mounting the electronic component 2 supplied by the component supply unit 12 on the substrate 1.

  The substrate 1 is a plate-like member, and a wiring pattern is provided on the surface. Solder which is a joining member for joining the wiring pattern of the plate-like member and the electronic component is attached to the surface of the wiring pattern provided on the substrate 1 by reflow. In addition, a through hole into which the lead 4 of the electronic component 2 is inserted is formed in the substrate 1.

  The substrate transport unit 11 is a transport mechanism that transports the substrate 1 in the X-axis direction in FIG. The board | substrate conveyance part 11 moves the board | substrate 1 along the rail 11a extended in a X-axis direction. The substrate transport unit 11 transports the substrate 1 in the X-axis direction by moving the substrate 1 along the rail 11 a in a direction in which the mounting target surface of the substrate 1 faces the head 13. The substrate transport unit 11 transports the supplied substrate 1 to a predetermined position on the rail 11a. The board | substrate conveyance part 11 will convey the board | substrate 1 to the apparatus which performs the next process, if the electronic component 2 is mounted on the board | substrate 1 conveyed to the predetermined position.

  The component supply unit 12 holds a large number of electronic components 2 to be mounted on the substrate 1 and delivers them to the head 13.

  As shown in FIG. 3, the head 13 includes a suction nozzle 13 a that sucks and grips the component body 3 of the electronic component 2. The head 13 is moved in the horizontal direction (X, Y direction) by the XY moving mechanism 14 and is moved up and down by the elevating mechanism 15 in the vertical direction (Z direction). The head 13 is rotatable about a vertical axis by a rotation mechanism (not shown).

  The electronic component (component) 2 is a radial lead type electronic component having a pair of leads 4 extending in parallel from the lower end of the component main body 3. In this example, the pair of leads 4 extends in parallel from the lower end of the component body 3 formed in a columnar shape, for example, an electronic component such as a capacitor.

  As shown in FIG. 2, the electronic components 2 mounted on the substrate 1 are sequentially supplied by the component supply unit 12 with the leads 4 fixed to the tape. In the component supply unit 12, a cutting mechanism (not shown) cuts the lead 4 in a state where the suction nozzle 13 a of the head 13 holds the component main body 3 of the electronic component 2. Thereby, the electronic component 2 is separated from the tape. In this state, the head 13 is moved by the XY moving mechanism 14 and the lifting mechanism 15, so that the electronic component 2 is conveyed while being held by the head 13.

  The laser recognition device (lead width measurement unit) 16 includes a light source 16a and a light receiving element 16b. The laser recognition device 16 detects the shape and orientation of the electronic component 2 by irradiating the electronic component 2 sucked by the suction nozzle 13a of the head 13 with laser light. Further, the laser recognition device 16 measures a lead width Lw that is an interval between the leads 4 of the electronic component 2.

  The lead correction jig 17 is a jig that corrects the lead width Lw of the electronic component 2 held by the suction nozzle 13 a of the head 13 that is moved by the XY moving mechanism 14 and the lifting mechanism 15.

  The component storage unit 18 is a box that stores the electronic component 2 that is not mounted on the substrate 1. That is, the component storage unit 18 is a disposal box in which the electronic component 2 to be discarded that is not mounted on the substrate 1 is discarded. The electronic component 2 to be discarded is transported onto the component storage unit 18, and the component storage unit 18. It is thrown into.

  The control device 21 controls each part of the component mounting apparatus 10. The operation unit 22 is an input device through which an operator inputs an operation, and includes a keyboard, a mouse, a touch panel, and the like. The operation unit 22 sends the detected various inputs to the control device 21. The display unit 23 is a screen that displays various types of information to the worker, and includes a touch panel and a vision monitor. The display unit 23 displays various images based on the image signal input from the control device 21.

Next, the lead correction jig 17 will be described.
FIG. 4 is a perspective view of the lead correction jig fixed to the base. FIG. 5 is a perspective view of the lead correction jig as viewed from the lead proximity correction portion side. 6A and 6B are diagrams for explaining the lead correction operation of the electronic component, in which FIG. 6A is a front view of the lead proximity correction portion, and FIG. 6B is a perspective view of the lead proximity correction portion. FIG. 7 is a perspective view of the lead correction jig viewed from the lead separation correction portion side. 8A and 8B are diagrams for explaining the lead correction operation of the electronic component, in which FIG. 8A is a front view of the lead separation correction unit, and FIG. 8B is a perspective view of the lead separation correction unit.

  As shown in FIG. 4, the lead correction jig 17 is fixed to the upper part of the base 31. The base 31 is fixed to the table 10 a of the component mounting apparatus 10.

  The lead correction jig 17 has a jig fixing block 32. A plurality of lead proximity correction portions (lead correction portions) 40 are provided on one surface 32a of the jig fixing block 32, and a plurality of lead separation correction portions (leads) are provided on the other surface 32b of the jig fixing block 32. 50) is provided. The electronic component 2 held by the suction nozzle 13 a of the head 13 is pressed against the plurality of lead proximity correction units 40 and the plurality of lead separation correction units 50.

  As shown in FIG. 5, each lead proximity correction unit 40 has a lead proximity correction plate 41. The lead proximity correction plate 41 is fitted into a holding recess 42 formed in the jig fixing block 32 and is fixed to the jig fixing block 32 by a screw 43. The lead proximity correction plate 41 has a recess 44 formed in the upper part thereof. The pair of side surfaces constituting the recess 44 are inclined surfaces 45 that are inclined in different directions toward the lower side, which is the pressing direction of the electronic component 2. Specifically, these inclined surfaces 45 are inclined surfaces 45 that gradually approach in the pressing direction of the electronic component 2.

  The plurality of lead proximity correction portions 40 have different intervals between the inclined surfaces 45 of the respective lead proximity correction plates 41 and correspond to the electronic components 2 having different lead widths Lw. In this example, six lead proximity correction portions 40 are provided, and electrons having a lead width Lw of 2.0 mm, 2.5 mm, 3.5 mm, 5.0 mm, 7.5 mm, and 10.0 mm are sequentially arranged from the left side of the front view. Corresponds to part 2.

  A fixture 46 is fixed to one surface 32 a of the jig fixing block 32 by a screw 47, and the fixture fixing block 32 on the upper end side having the concave portion 44 of each lead proximity correction plate 41 is fixed by the fixture 46. The other side is covered.

  As shown in FIG. 6A, when the pair of leads 4 of the electronic component 2 is inserted into the recess 44 of the lead proximity correction plate 41, each lead 4 is inclined as shown in FIG. 45 and then move downward while contacting the inclined surface 45. As a result, the leads 4 of the electronic component 2 are displaced in the direction of approaching each other along the inclination of the inclined surface 45, and the lead width Lw is narrowed. The inclination angle of each inclined surface 45 of the lead proximity correction plate 41 with respect to the vertical direction is preferably 45 degrees or less. When the inclination angle of the inclined surface 45 with respect to the vertical direction is set to 45 degrees or less, the lead 4 slides smoothly with respect to the inclined surface 45, and the lead 4 is gently displaced. Thereby, damage to the lead 4 due to a sudden load application is suppressed.

  As shown in FIG. 7, each lead spacing correction unit 50 has a lead spacing correction plate 51. The lead separation correction plate 51 is fitted into a holding recess 52 formed in the jig fixing block 32 and is fixed to the jig fixing block 32 by a screw 53. The lead spacing correction plate 51 has a convex portion 54 formed on the top thereof. A pair of side surfaces constituting these convex portions 54 are inclined surfaces 55 that are inclined in different directions downward, respectively, which is the pressing direction of the electronic component 2. Specifically, these inclined surfaces 55 are inclined surfaces 55 that are gradually separated in the pressing direction of the electronic component 2.

  The plurality of lead separation correction portions 50 have different intervals between the inclined surfaces 55 of the respective lead separation correction plates 51, and correspond to the electronic components 2 having different lead widths Lw. In this example, six lead separation correction portions 50 are provided, and electrons having a lead width Lw of 2.0 mm, 2.5 mm, 3.5 mm, 5.0 mm, 7.5 mm, and 10.0 mm are sequentially arranged from the right side as viewed from the front. Corresponds to part 2.

  A fixing bracket 56 is fixed to the other surface 32b of the jig fixing block 32 with a screw 57. By this fixing bracket 56, the jig fixing block on the upper end side having the convex portion 54 of each lead separation correction plate 51 is fixed. 32 and the opposite side are covered.

  As shown in FIG. 8A, when the convex portion 54 of the lead spacing correction plate 51 is inserted between the pair of leads 4 of the electronic component 2, as shown in FIG. , Each contacting the inclined surface 55 and then moving downward while contacting the inclined surface 55. As a result, each lead 4 of the electronic component 2 is displaced in a direction away from each other along the inclination of the inclined surface 55, and the lead width Lw is increased. The inclination angle of each inclined surface 55 of the lead separation correction plate 51 with respect to the vertical direction is preferably 45 degrees or less. If the inclination angle of the inclined surface 55 with respect to the vertical direction is 45 degrees or less, the lead 4 slides smoothly with respect to the inclined surface 55, and the lead 4 is gently displaced. Thereby, damage to the lead 4 due to a sudden load application is suppressed.

Next, a component mounting method using the lead correction jig 17 by the control device 21 will be described.
FIG. 9 is a flowchart for explaining a component mounting method for mounting electronic components.

  The head 13 that has moved to the component supply unit 12 adsorbs and grips the component main body 3 of the electronic component 2 delivered from the component supply unit 12 by the suction nozzle 13a (step S01).

  The head 13 moves, the electronic component 2 is conveyed to the laser recognition device 16, and the lead width Lw of the lead 4 of the electronic component 2 is measured by the laser recognition device 16 (step S02).

  A lead width determination is performed to determine whether or not the measured lead width Lw of the electronic component 2 is within a preset allowable range (step S03). The allowable range of the lead width Lw is a range of dimensions between an upper limit value and a lower limit value at which the lead 4 of the electronic component 2 can be inserted into a predetermined through hole of the substrate 1, and these upper limit value and lower limit value are determined. Threshold. The control device 21 extracts the allowable range of the electronic component 2 of that type from the component data stored in the storage unit (not shown) based on the type of the electronic component 2 held by the head 13, and extracts the extracted range. The allowable range is compared with the lead width Lw measured by the laser recognition device 16. In this example, the allowable range of the electronic component 2 having a reference lead width Lw of 2.0 mm, 2.5 mm, 3.5 mm, 5.0 mm, 7.5 mm, and 10.0 mm is set in advance.

  If it is determined in this lead width determination (step S03) that the measured lead width Lw is within the allowable range (step S03: YES), the process proceeds to a component mounting operation (step S10). In this component mounting operation, the head 13 moves to convey the electronic component 2 onto the substrate 1, insert the lead 4 of the electronic component 2 into a predetermined through hole of the substrate 1, and mount the electronic component 2 on the substrate 1. . Thereafter, the head 13 moves to the component supply unit 12 and grips the electronic component 2 to be next mounted on the substrate 1.

  If it is determined in the lead width determination (step S03) that the measured lead width Lw is not within the allowable range (step S03: NO), the head 13 moves and the electronic component 2 is placed on the lead correction jig 17. Then, the lead 4 of the electronic component 2 is pressed against the lead correction jig 17 to shift the lead width correction operation to correct the lead width Lw.

  In this lead width correction operation, when the lead width Lw is equal to or greater than a threshold value consisting of the upper limit value of the allowable range (step S04), the lead proximity correction unit corresponding to the reference lead width Lw of the electronic component 2 in the lead correction jig 17 40 is used to narrow the lead width Lw (step S05). For example, in the case of the electronic component 2 having a standard lead width Lw of 2.0 mm, the lead 4 is pressed against the corresponding lead proximity correction unit 40 (the lead proximity correction unit 40 at the left end in FIG. 5), and the lead proximity correction plate 41 The lead 4 is inserted into the recess 44. The leads 4 inserted into the recesses 44 of the lead proximity correction plate 41 are displaced along the inclination of the inclined surface 45 in the direction approaching each other, and the lead width Lw is narrowed and corrected.

  In the lead width correction operation, when the lead width Lw is equal to or smaller than the threshold value including the lower limit value of the allowable range (step S06), the lead separation correction corresponding to the reference lead width Lw of the electronic component 2 in the lead correction jig 17 is performed. The lead width Lw is increased using the part 50 (step S07). For example, in the case of the electronic component 2 having a reference lead width Lw of 2.0 mm, the lead 4 is pressed against the corresponding lead separation corrector 50 (the lead separation corrector 50 at the right end in FIG. 7), and the lead separation corrector 51 The convex portion 54 is inserted between the leads 4. The leads 4 in which the convex portions 54 of the lead separation correction plate 51 are inserted are displaced in a direction away from each other along the inclination of the inclined surface 55, and the lead width Lw is widened and corrected.

  The correction amount of the lead width Lw by the lead width correction operation can be easily adjusted by adjusting the height of the head 13 and changing the pressing amount of the lead 4 against the lead correction jig 17. The lead 4 is slightly returned to its original state by elasticity after being displaced. Specifically, when the lead width Lw is displaced so as to be narrowed and then extracted from the lead correction jig 17, the lead 4 is restored and the lead width Lw is slightly increased. Similarly, when the lead width Lw is displaced so as to be widened and then extracted from the lead correction jig 17, the lead 4 is restored and the lead width Lw is slightly narrowed. For this reason, in the lead width correcting operation, the pressing amount for pressing the lead 4 of the electronic component 2 against the lead correcting jig 17 is set in consideration of the restoring amount of the displaced lead 4.

  After the lead width correction operation, the head 13 moves, the electronic component 2 is conveyed to the laser recognition device 16, and the lead width Lw of the lead 4 of the electronic component 2 is measured again by the laser recognition device 16 (step S08).

  A lead width re-determination is performed to re-determine whether or not the measured lead width Lw of the electronic component 2 is within a preset allowable range (step S09).

  In this lead width re-determination (step S09), if it is determined that the measured lead width Lw is within the allowable range (step S09: YES), the process shifts to a component mounting operation (step S10), and the electronic component 2 is changed to the electronic component 2. Mounted on the substrate 1. Thereafter, the head 13 moves to the component supply unit 12 and grips the electronic component 2 to be next mounted on the substrate 1.

  In the lead width re-determination (step S09), if it is determined that the measured lead width Lw is not within the allowable range (step S09: NO), it is determined whether the number of determinations of the lead width Lw has reached a predetermined number. Determination is made (step S11).

  When the determination number of the lead width Lw has not reached the predetermined number (step S11: No), the process shifts to the lead width correction operation, and the correction operation of the lead 4 is performed again (steps S04, S05, steps S06, S07). .

  When the number of determinations of the lead width Lw has reached the predetermined number (step S11: YES), the electronic component 2 held by the head 13 cannot be mounted on the substrate 1 with the lead width Lw corrected. It determines with it being an improper part, and throws into the components storage part 18 (step S12). Thereafter, the head 13 moves to the component supply unit 12 and grips a new electronic component 2.

  As described above, according to the present embodiment, the electronic component 2 whose lead width Lw is out of the allowable range is easily detected, and the leads 4 of the electronic component 2 are brought close to each other by the lead correction jig 17. The lead width Lw can be easily corrected by displacing in the separating direction.

  That is, by inserting the lead 4 of the electronic component 2 having the lead width Lw widened into the concave portion 44 of the lead proximity correction portion 40 of the lead correction jig 17, the lead 4 is pressed against the inclined surface 45 and displaced in a direction close to each other. Can be corrected. Further, by inserting the convex portion 54 of the lead spacing correction portion 50 of the lead correction jig 17 between the leads 4 of the electronic component 2 whose lead width Lw is narrowed, the leads 4 are pressed against the inclined surface 55 and separated from each other. It can be corrected by displacing in the direction.

  Therefore, the electronic component 2 that could not be mounted on the substrate 1 because the lead width Lw was out of the allowable range can be mounted on the substrate 1. As a result, it is possible to improve the mounting efficiency of the electronic component 2 on the substrate 1 and shorten the tact time without causing a problem that the allowable range of the lead width Lw is forcibly corrected and reset to cause mounting failure. Productivity can be improved.

  In addition, the lead correction jig 17 includes a plurality of lead proximity correction portions 40 with different intervals between the inclined surfaces 45 and a plurality of lead separation correction portions 50 with different intervals between the inclined surfaces 55. Therefore, with one lead correction jig 17, the leads 4 of a plurality of types of electronic components 2 having different lead widths Lw can be displaced and corrected in the approaching direction or the separating direction. Thereby, the tact time of one cycle in the component mounting process for mounting a plurality of types of electronic components 2 having different lead widths Lw on the substrate 1 can be shortened.

  Next, a modified example of the lead correction jig will be described. Note that the same components as those of the lead correction jig 17 in the above embodiment are denoted by the same reference numerals and description thereof is omitted.

(Modification 1)
FIG. 10 is a perspective view of a lead correction jig according to the first modification. FIG. 11 is a perspective view of the lead correction mechanism portion of the lead correction jig. FIG. 12 is a perspective view of a pedestal and a base member constituting the lead correction mechanism. FIG. 13 is a perspective view of a lead proximity correction slide member constituting the lead correction mechanism. FIG. 14 is a perspective view of a lead separation correcting slide member. FIGS. 15A and 15B are diagrams illustrating the lead correction mechanism, in which FIG. 15A is a perspective view when used as a lead proximity correction unit, and FIG. 15B is a perspective view when used as a lead separation correction unit. FIGS. 16A and 16B are diagrams for explaining the lead correction mechanism, in which FIG. 16A is a schematic side view when used as a lead proximity correction unit, and FIG. 16B is a schematic side view when used as a lead separation correction unit.

  As shown in FIG. 10, the lead correction jig 60 according to Modification 1 is also fixed to the upper part of the base 31 fixed to the table 10 a of the component mounting apparatus 10.

  The lead correction jig 60 has a flat pedestal 61, and a plurality of lead correction mechanisms 62 are arranged on the pedestal 61 at equal intervals. The lead correction mechanism 62 has a function of narrowing the lead width Lw and a function of widening the lead width Lw.

  As shown in FIG. 11, the lead correction mechanism 62 includes a base member 64 on one side of the pedestal 61. The lead correction mechanism section 62 includes a lead proximity correction slide member 65 provided on the other side of the base 61 and a lead separation correction slide member 66 provided on the base member 64.

  As shown in FIG. 12, the pedestal 61 is lowered on one side where the base member 64 is disposed. The pedestal 61 has a base member fixing portion 61a on one side and a slide member mounting portion 61b on the other side. A slide groove 61c is formed in the slide member mounting portion 61b of the pedestal 61, and a screw hole 61d is formed in the center in the width direction of the slide groove 61c. Further, in the base 61, a fixing screw hole 61e is formed in the base member fixing portion 61a.

  The base member 64 fixed to the base member fixing portion 61a of the pedestal 61 has a wall portion 64a protruding upward on the slide member mounting portion 61b side. The base member 64 is formed with a slide groove 64b, and a screw hole 64c is formed at the center in the width direction of the slide groove 64b. The base member 64 is formed with a screw insertion hole 64d at a position away from the slide groove portion 64b, and the screw 67 inserted into the screw insertion hole 64d is screwed into the fixing screw hole 61e of the pedestal 61. The member 64 is fixed to the pedestal 61 (see FIG. 11).

  As shown in FIG. 13, the lead proximity correction slide member 65 is formed in a rectangular shape in plan view. The lead proximity correction slide member 65 is disposed in a slide groove portion 61 c formed in the pedestal 61. The lead proximity correction slide member 65 is formed with a wall portion 65 a protruding upward at an end portion of the base member 64 on the wall portion 64 a side. The lead proximity correction slide member 65 is formed with a long hole 65b along the longitudinal direction. The lead proximity correction slide member 65 is fixed to the pedestal 61 by screwing and tightening the screw 68 inserted into the long hole 65b into the screw hole 61d of the pedestal 61 (see FIG. 11). The lead proximity correction slide member 65 is slidable along the slide groove 61c in a state where the screw 68 is loosened. Then, by sliding the lead proximity correction slide member 65, the distance between the wall portion 64a of the base member 64 and the wall portion 65a of the lead proximity correction slide member 65 is adjusted.

  As shown in FIG. 14, the lead spacing correction slide member 66 is formed in a rectangular shape in plan view. The lead spacing correction slide member 66 is disposed in a slide groove portion 64 b formed in the base member 64. The lead separation correcting slide member 66 is formed with a wall portion 66a protruding upward at an end portion of the base member 64 on the wall portion 64a side. In addition, a long hole 66b is formed in the lead separation correcting slide member 66 along the longitudinal direction. The lead spacing correction slide member 66 is fixed to the base member 64 by screwing the screw 69 inserted into the long hole 66b into the screw hole 64c of the base member 64 and tightening (see FIG. 11). The lead spacing correction slide member 66 is slidable along the slide groove 64b in a state where the screw 69 is loosened. The distance between the wall portion 64a of the base member 64 and the wall portion 66a of the lead separation correction slide member 66 is adjusted by sliding the lead separation correction slide member 66.

  As shown in FIG. 15A, in the lead correction mechanism portion 62, a lead proximity correction portion (lead correction portion) 71 is constituted by the wall portion 64a of the base member 64 and the wall portion 65a of the lead proximity correction slide member 65. The lead 4 of the electronic component 2 is pressed against the lead proximity correction unit 71. Further, as shown in FIG. 15B, in the lead correction mechanism portion 62, a lead separation correction portion (lead correction portion) 72 is formed from the wall portion 64a of the base member 64 and the wall portion 66a of the lead separation correction slide member 66. The lead 4 of the electronic component 2 is pressed against the lead separation correcting portion 72.

  On the wall 64 a of the base member 64, an inclined surface 81 is formed on the surface facing the wall 65 a of the lead proximity correction slide member 65. In addition, an inclined surface 82 is formed on the wall portion 65 a of the lead proximity correction slide member 65 on the surface facing the wall portion 64 a of the base member 64. The inclined surfaces 81 and 82 are gradually approached downward. In the lead proximity correction portion 71, as shown in FIG. 16A, a concave portion 91 is formed from the inclined surfaces 81 and 82, and the pair of leads 4 of the electronic component 2 are inserted into the concave portion 91. It is.

  When the pair of leads 4 of the electronic component 2 are inserted into the recesses 91 of the lead proximity correction portion 71, the leads 4 come into contact with the inclined surfaces 81 and 82, respectively, and then contact the inclined surfaces 81 and 82 and move downward. Move to. As a result, each lead 4 of the electronic component 2 is displaced in the direction approaching each other along the inclination of the inclined surfaces 81 and 82, and the lead width Lw is narrowed.

  An inclined surface 83 is formed on the wall 66 a of the lead separation correcting slide member 66 on the surface opposite to the wall 64 a of the base member 64. The inclined surfaces 81 and 83 are gradually separated downward. As shown in FIG. 16 (b), the lead separation correcting portion 72 is formed with a convex portion 92 from the inclined surfaces 81 and 83, and this convex portion 92 is inserted between the leads 4 of the electronic component 2. Is included.

  When the convex portion 92 of the lead separation corrector 72 is inserted between the pair of leads 4 of the electronic component 2, each lead 4 contacts the inclined surfaces 81 and 83, and then contacts the inclined surfaces 81 and 83. While moving down. As a result, the leads 4 of the electronic component 2 are displaced in directions away from each other along the inclination of the inclined surfaces 81 and 83, and the lead width Lw is increased.

  And also in the case of the component mounting apparatus 10 provided with the lead correction jig | tool 60 which concerns on the modification 1, the electronic component 2 from which the lead width Lw remove | deviated from the tolerance | permissible_range is detected easily, and the lead 4 of the electronic component 2 is detected. The lead width Lw can be easily corrected by being displaced toward or away from each other by the lead correction jig 60.

  That is, by inserting the lead 4 of the electronic component 2 having the lead width Lw widened into the concave portion 91 of the lead proximity correction portion 71 of the lead correction jig 60, the lead 4 is pressed against the inclined surfaces 81 and 82 and approaches each other. It can be corrected by displacing. Further, the lead 4 is pressed against the inclined surfaces 81 and 83 by inserting the convex portion 92 of the lead spacing correction portion 72 of the lead correction jig 60 between the leads 4 of the electronic component 2 whose lead width Lw is narrow. It can be corrected by displacing in directions away from each other.

  Therefore, the electronic component 2 that could not be mounted on the substrate 1 because the lead width Lw was out of the allowable range can be mounted on the substrate 1. This improves the mounting efficiency of the electronic component 2 on the substrate 1 and shortens the tact time without causing a problem that the allowable range of the lead width Lw is forcibly re-corrected to cause mounting defects. Can be improved.

  In addition, by sliding the lead proximity correction slide member 65 and the lead separation correction slide member 66, the interval between the inclined surfaces 81 and 82 and the interval between the inclined surfaces 81 and 83 can be easily changed. Thereby, the electronic component 2 is changed by changing the interval between the inclined surfaces 81 and 82 of the lead proximity correcting portion 71 and the interval between the inclined surfaces 81 and 83 of the lead separation correcting portion 72 corresponding to the lead width Lw of the electronic component 2. The lead width Lw of 2 can be easily corrected.

  For example, in each of the six lead correction mechanisms 62 of the lead correction jig 60, the interval between the inclined surfaces 81 and 82 and the interval between the inclined surfaces 81 and 83 are adjusted, and the lead proximity correction unit 71 and the lead separation correction unit 72 are adjusted. Can be made to correspond to the electronic component 2 having a lead width Lw of 2.0 mm, 2.5 mm, 3.5 mm, 5.0 mm, 7.5 mm, and 10.0 mm.

(Modification 2)
FIG. 17 is a perspective view of a lead correction jig according to the second modification. FIG. 18 is a perspective view of the lead correction jig. FIG. 19 is a front view of a lead correction plate constituting the lead correction jig.

  As shown in FIG. 17, the lead correction jig 100 according to the modified example 2 is also fixed to the upper part of the base 31 fixed to the table 10 a of the component mounting apparatus 10.

  As shown in FIG. 18, the lead correction jig 100 has a jig fixing block 102. A lead correction plate (lead correction member) 103 is fixed to one side surface of the jig fixing block 102 by screws 109.

  As shown in FIG. 19, a plurality of recesses 104 are formed in the lead correction plate 103. A pair of side surfaces forming these recesses 104 are inclined surfaces 105 that gradually approach each other downward in the pressing direction of the electronic component 2. In the lead correction jig 100, the concave portion 104 of the lead correction plate 103 is a lead proximity correction portion (lead correction portion) 106.

  The plurality of lead proximity correction portions 106 have different intervals between the inclined surfaces 105 of the concave portions 104, and correspond to the electronic components 2 having different lead widths Lw. In this example, six lead proximity correction portions 106 each including six concave portions 104 are provided, and are 2.0 mm, 2.5 mm, 3.5 mm, 5.0 mm, 7.5 mm, 10.0 mm in order from the left side when viewed from the front. Corresponds to the electronic component 2 having the lead width Lw.

  In addition, the lead correction plate 103 has convex portions 114 between the concave portions 104, and a pair of side surfaces forming the convex portions 114 are directed downward in the pressing direction of the electronic component 2, respectively. The inclined surfaces 115 are gradually separated from each other. In the lead correction jig 100, the convex portions 114 of the lead correction plate 103 are used as lead separation correction portions (lead correction portions) 116, respectively.

  The plurality of lead separation correction portions 116 have different intervals between the inclined surfaces 115 of the convex portions 114, and correspond to the electronic components 2 having different lead widths Lw. In this example, six lead separation correction portions 116 each including six convex portions 114 are provided, and are 2.0 mm, 2.5 mm, 3.5 mm, 5.0 mm, 7.5 mm, 10. It corresponds to the electronic component 2 having a lead width Lw of 0 mm.

  As described above, in the lead correction jig 100, the concave portion 104 that makes the lead width Lw of the electronic component 2 approach and the convex portion 114 that makes the lead width Lw of the electronic component 2 separate are formed adjacent to the lead correction plate 103. ing.

  The inclined surface 115 and the concave portion 104 of the convex portion 114 excluding the inclined surface 115 on the left side of the convex portion 114 at the left end of the lead correction plate 103 and the right inclined surface 105 of the concave portion 104 at the right end of the lead correction plate 103 in the front view. These inclined surfaces 105 are common.

  A fixture 107 is fixed to one side of the fixture fixing block 102 with a screw 108, and the fixture fixture block 102 on the upper end side having the concave portion 104 and the convex portion 114 of the lead correction plate 103 is fixed by the fixture 107. The other side is covered.

  In the lead correction jig 100 described above, when the pair of leads 4 of the electronic component 2 are inserted into the concave portions 104 constituting the lead proximity correction portion 106 of the lead correction plate 103, each lead 4 contacts the inclined surface 105, respectively. Then, it moves downward while contacting the inclined surface 105. As a result, the leads 4 of the electronic component 2 are displaced in the direction of approaching each other along the inclination of the inclined surface 105, and the lead width Lw is narrowed. Moreover, when the convex part 114 which comprises the lead space | interval correction | amendment part 116 of the lead correction board 103 is inserted between a pair of lead | read | reed 4 of the electronic component 2, each lead 4 will each contact the inclined surface 115, Then, It moves downward while contacting the inclined surface 115. Thereby, each lead 4 of the electronic component 2 is displaced in a direction away from each other along the inclination of the inclined surface 115, and the lead width Lw is increased.

  And also in the case of the component mounting apparatus 10 provided with the lead correction jig | tool 100 which concerns on the modification 2, the electronic component 2 from which the lead width Lw remove | deviated from the tolerance | permissible_range is detected easily, and the lead | read | reed 4 of the electronic component 2 is detected. The lead width Lw can be easily corrected by being displaced toward or away from each other by the lead correction jig 100.

  That is, by inserting the lead 4 of the electronic component 2 with the lead width Lw widened into the concave portion 104 of the lead proximity correction portion 106 of the lead correction jig 100, the lead 4 is pressed against the inclined surface 105 and displaced in a direction close to each other. Can be corrected. Further, the lead 4 is pressed against the inclined surface 115 to be separated from each other by inserting the convex portion 114 of the lead separation correcting portion 116 of the lead correction jig 100 between the leads 4 of the electronic component 2 whose lead width Lw is narrowed. It can be corrected by displacing in the direction.

  Therefore, the electronic component 2 that could not be mounted on the substrate 1 because the lead width Lw was out of the allowable range can be mounted on the substrate 1. This improves the mounting efficiency of the electronic component 2 on the substrate 1 and shortens the tact time without causing a problem that the allowable range of the lead width Lw is forcibly re-corrected to cause mounting defects. Can be improved.

  In particular, since the concave portion 104 that makes the lead width Lw of the electronic component 2 close and the convex portion 114 that makes the lead width Lw of the electronic component 2 apart are formed adjacent to the lead correction plate 103, the number of components is reduced and the structure is simplified. It is possible to easily correct the lead width Lw of the electronic component 2 while reducing the cost by making it easier.

1: Substrate 2: Electronic component (component)
4: Lead 10: Component mounting device 13: Head 14: XY moving mechanism (head moving mechanism)
15: Lifting mechanism (head moving mechanism)
16: Laser recognition device (lead width measurement unit)
17, 60, 100: Lead correction jig 21: Control device (control unit)
40, 71, 106: Lead proximity correction part (lead correction part)
44, 91, 104: Recess 45, 55, 81, 82, 83, 105, 115: Inclined surfaces 50, 72, 116: Lead separation corrector (lead corrector)
54, 92, 114: convex portion Lw: lead width

Claims (9)

A head for gripping a component having a pair of leads;
A head moving mechanism for moving the head to insert the lead of the component into a through-hole of the substrate and mounting the component on the substrate;
A lead correction unit having a pair of inclined surfaces inclined in different directions, and the lead of the component held by the head moved by the head moving mechanism is pressed against the inclined surface of the lead correction unit; A lead correction jig for correcting the lead width by displacing the leads in a direction approaching or separating from each other,
A component mounting apparatus comprising:   The component mounting apparatus according to claim 1, wherein the lead correction jig includes a plurality of the lead correction portions having different intervals between the inclined surfaces. The lead correction portion includes a recess having a pair of inclined surfaces gradually approaching in a pressing direction of the component held by the head moved by the head moving mechanism,
3. The component mounting according to claim 1, wherein each of the components is moved close to each other by being displaced along the inclined surface when the leads are inserted into the concave portion. apparatus. The lead correction portion includes a convex portion having a pair of inclined surfaces that are gradually separated toward a pressing direction of the component held by the head moved by the head moving mechanism,
3. The component according to claim 1, wherein the protrusions are inserted between the leads so that the leads are displaced along the inclined surface and separated from each other. 4. Component mounting equipment. The lead correction part is moved by the head moving mechanism, and a recess having a pair of inclined surfaces that gradually approach the pressing direction of the component held by the head moved by the head moving mechanism. And a convex portion having a pair of the inclined surfaces that are gradually separated in the pressing direction of the component held by the head,
The parts are inserted into the recesses so that the leads are displaced along the inclined surface and are close to each other, and the protrusions are inserted between the leads. The component mounting apparatus according to claim 1, wherein the leads are displaced along the inclined surface and separated from each other.   6. The component mounting apparatus according to claim 1, wherein the lead correction unit is configured such that an interval between the inclined surfaces can be changed by moving at least one of the inclined surfaces. 7. .   The component mounting apparatus according to claim 5, wherein the lead correction jig includes a lead correction member in which the concave portion and the convex portion are formed adjacent to each other. A lead width measuring unit for measuring the lead width of the component gripped by the head;
When the lead width measured by the lead width measuring unit is out of a preset allowable range, the component held by the head by the head moving mechanism is pressed against the lead correction jig and the component A control unit for correcting the lead width of
The component mounting apparatus according to any one of claims 1 to 7, further comprising: A component mounting method for mounting a component having a pair of leads on the substrate by inserting the lead into a through hole of the substrate,
Causing the head to grip the component,
Measure the lead width of the component held by the head,
It is determined whether the measured lead width is out of a preset allowable range,
When the lead width is out of the allowable range, the lead is brought into contact with the inclined surface by pressing the component against a lead correcting jig having a lead correcting portion having a pair of inclined surfaces inclined in different directions. By displacing the leads in the direction of approaching or separating from each other, the lead width is corrected,
A component mounting method, wherein the lead of the component whose lead width is corrected is inserted into a through hole of the substrate and the component is mounted on the substrate.

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