JPWO2014132358A1 - Defective member determination device and method - Google Patents

Abstract

In the electronic component mounting apparatus, a determination area having a size smaller than the search area is applied in the search area for searching for the presence or absence of the defect mark M in the photographed image of the die D. The search area is an area surrounded by the search area frame F1, and the determination area is an area surrounded by the determination area frame F2. Then, the presence or absence of the defective mark M is determined by comparing the gray scale average value of the dots included in the determination region with a threshold value.

Description

  The present invention relates to a defective member determination apparatus and method.

  2. Description of the Related Art When mounting a die on a substrate using an electronic component mounting apparatus, there is known a defective die determination apparatus that determines whether or not the die is a defective product based on the presence or absence of a defective mark. For example, in Patent Document 1, a circuit pattern is formed on a plurality of dies formed on a wafer, and after the formation, surface inspection of each die is performed. It is disclosed that the die is taken out, the defective die is discarded, and only the good die is mounted on the substrate. Here, the defect mark may be printed by a printing apparatus, but an operator may write with a pen.

Japanese Patent Laid-Open No. 2008-261692

  By the way, as a method for determining a defective die, an average value of gray scale values of dots included in the search area and a predetermined value are searched for a search area for searching for the presence / absence of a defective mark among the shooting areas shot for each die. A method of determining the presence / absence of a defective mark by comparing with a threshold value of the above can be considered. For example, if a white die is defective, a black defect mark is to be added, and the defect mark is a set of dots having a grayscale value of black or dark gray, and is therefore included in the search area. If the average value of the gray scale values of dots exceeds a predetermined threshold value, it is determined that there is a defective mark.

  However, the defect mark attached to the die is not always attached to a fixed position of the die, and is attached to, for example, the center of the die or the corner of the die. For this reason, it is necessary to widen the search area to be approximately the same size as the die. At this time, if the defect mark is thin or small, the average value of the gray scale values of the dots included in the search area becomes small, and the average value falls below a predetermined threshold even though there is a defect mark. It may be erroneously determined that there is no mark.

  The present invention has been made to solve such a problem, and a main object thereof is to suppress the occurrence of erroneous detection of a defective mark attached to a member.

The defective member determination device of the present invention is
A defective member determination device for determining whether or not a defect mark is attached to a member used in a mounting machine,
Photographing means for photographing the member;
In the search area for searching for the presence or absence of a defective mark in the image of the member imaged by the imaging means, a determination area having a size smaller than the search area is applied, and the grayscale value of the dots included in the determination area Determination means for determining the presence or absence of the defective mark using the number of dots included in the determination area;
It is equipped with.

  In the defective member determination apparatus of the present invention, a determination region having a size smaller than the search region is applied in a search region for searching for the presence or absence of a defective mark in the image of the photographed member, and the dots included in the determination region are detected. The presence or absence of a defective mark is determined using color information (for example, RGB value or gray scale value) and the number of dots included in the determination area. The color information of the defective mark dot can be distinguished from the color information of the underlying dot of the photographed member. Here, when the determination area is the same size as the search area, if the size of the attached defect mark is too small compared to the determination area, the ratio of the number of defective mark dots to the number of dots included in the determination area May become too small to determine that there is no defective mark despite the presence of a defective mark. On the other hand, in the present invention, since the determination area is smaller than the search area, such a fear is eliminated. Therefore, it is possible to suppress the occurrence of erroneous detection of a defective mark attached to the member.

  Note that the “determination area” may be applied to the search area, for example, or may be applied to a place (one or more) where there is a high possibility that a defect mark exists in the search area. Good. In addition, the “member” may be anything used in a mounting machine, and may be, for example, a plurality of dies formed so as to be collected on a wafer, or a plurality of substrates formed so as to be collected on a large plate material. It may be.

  In the defective member determination apparatus of the present invention, the determination unit may determine the presence or absence of the defective mark by comparing an average value of gray scale values of dots included in the determination region with a predetermined threshold value. The average grayscale value of the dots included in the determination area is calculated using the grayscale value (color information) of the dots included in the determination area and the number of dots included in the determination area. In this way, even if the defect mark attached to the member is faint, it can be accurately determined that there is a defect mark.

  The defective member determination apparatus of the present invention may further include setting change means for changing the setting of the size or shape of at least one of the search area and the determination area. In this way, it is possible to change the size and shape of the search area according to the size and shape of the member, and to change the size and shape of the determination area according to the size and shape of the defective mark. .

  In the defective member determination apparatus of the present invention, the determination unit sets a defective mark candidate portion based on color information of dots included in the search region of the member, and sets the determination region for the defective mark candidate portion. It may be determined whether or not the defective mark exists. In this way, it is possible to make a determination in a shorter time than in the case where the determination region is fully applied within the search region.

  In the defective member determination apparatus of the present invention, the determination unit may exclude an excluded area preset in the image of the member from the search area. In this way, an area that is likely to be confused with a defective mark in advance (for example, an area having color information equivalent to that of a defective mark) can be set as an excluded area, which is effective in suppressing the occurrence of erroneous detection of a defective mark. Rise. The exclusion region may be set based on a circuit pattern formed on the member. Since the circuit pattern is one of the areas that are likely to be confused with the defective mark in advance, setting this as an excluded area increases the effect of suppressing the occurrence of erroneous detection of the defective mark.

The defective member determination method of the present invention is
A defective member determination method for determining whether or not a defect mark is attached to a member used in a mounting machine,
(A) photographing the member;
(B) In the search area for searching for the presence or absence of a defective mark in the image of the member photographed in step (a), a determination area having a size smaller than the search area is applied, and the dots included in the determination area Determining the presence or absence of the defective mark using color information and the number of dots included in the determination area;
Is included.

  In the defective member determination method of the present invention, a determination region having a size smaller than the search region is applied within the search region of each member, and the average value of the gray scale values of the dots included in the determination region is compared with a predetermined threshold value. Thus, the presence or absence of a defective mark is determined. Here, in the case where the determination area is the same size as the search area, if the size of the attached defect mark is too small compared to the search area, the average value of the gray scale values of the dots included in the determination area is set to the threshold value. The smaller the value is, the smaller the value is, and there is a possibility that it is determined that there is no defective mark despite the presence of the defective mark. On the other hand, in the present invention, since the determination area is smaller than the search area, such a fear is eliminated. Therefore, it is possible to suppress the occurrence of erroneous detection of a defective mark attached to the member.

The perspective view of the electronic component mounting apparatus 10. FIG. The perspective view of the wafer pallet 50. FIG. FIG. FIG. 3 is a block diagram showing a configuration relating to control of the electronic component mounting apparatus 10. The flowchart of a defective die determination processing routine. Explanatory drawing of frame F1, F2 for search areas and for determination areas. Explanatory drawing regarding the setting of a defect mark candidate part. Explanatory drawing regarding the setting of a determination area | region. Explanatory drawing of the die | dye D with the comparatively big defect mark M attached. Explanatory drawing when frame F2 for determination areas is the same as frame F1 for search areas. Explanatory drawing of the die | dye D to which the exclusion area | region was set. FIG.

  Preferred embodiments of the present invention will be described below with reference to the drawings. 1 is a perspective view of the electronic component mounting apparatus 10, FIG. 2 is a perspective view of a wafer pallet 50, FIG. 3 is an overall view of the wafer W, and FIG. 4 is a block diagram showing a configuration relating to control of the electronic component mounting apparatus 10. . In the present embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIG.

  As shown in FIG. 1, the electronic component mounting apparatus 10 includes a substrate transport device 18 that transports the substrate 16, a head 24 that can move on the XY plane, a mark camera 44 that is integrated with the head 24, and a wafer W. A wafer pallet 50 to be transferred and a controller 60 (see FIG. 4) that controls various types of control are provided.

  The substrate transfer device 18 is attached to the housing 12 and is provided on the opposing surfaces of the support plates 20 and 20 and the support plates 20 and 20 that are provided in the front-rear direction of FIG. Conveyor belts 22 and 22 (only one of them is shown in FIG. 2). The conveyor belts 22 and 22 are stretched over the drive wheels and the driven wheels provided on the left and right sides of the support plates 20 and 20 so as to be endless. The board | substrate 16 is mounted on the upper surface of a pair of conveyor belts 22 and 22, and is conveyed from the left to the right. The substrate 16 is supported by a large number of support pins 23 erected on the back side.

  The head 24 is attached to the front surface of the X-axis slider 26. The X-axis slider 26 is attached to the front surface of the Y-axis slider 30 that can slide in the front-rear direction so as to be slidable in the left-right direction. The Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32, 32 extending in the front-rear direction. The guide rails 32 and 32 are fixed to the housing 12. A pair of upper and lower guide rails 28, 28 extending in the left-right direction are provided on the front surface of the Y-axis slider 30, and the X-axis slider 26 is attached to the guide rails 28, 28 so as to be slidable in the left-right direction. The head 24 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction. Each slider 26, 30 is driven by a drive motor (not shown). The head 24 incorporates a Z-axis motor 34, and adjusts the height of the suction nozzle 40 integrated with a holder 42 attached to a ball screw 36 extending along the Z-axis by the Z-axis motor 34. The suction nozzle 40 uses pressure to suck a component at the tip of the nozzle or to release a component sucked at the tip of the nozzle.

  The mark camera 44 is attached to the rear surface of the X-axis slider 26. Therefore, the mark camera 44 moves together with the head 24. The mark camera 44 is attached with a lens facing downward so as to photograph the lower part of the camera. Therefore, in a state where the mark camera 44 is positioned above the wafer W, it is possible to photograph the die D constituting the wafer W.

  As shown in FIG. 2, the wafer pallet 50 has a rectangular pallet main body 52 having a circular hole 52a, and a stretchable structure fixed by a grip ring 54 while being stretched so as to close the circular hole 52a. An adhesive sheet 56 is provided. A wafer W on which a large number of dies D are formed is attached to the upper surface of the adhesive sheet 56. The die D is formed by forming a circuit by pattern printing before cutting the wafer W and then cutting the wafer W. A push-up pin (not shown) is disposed below the adhesive sheet 56. The push-up pins play a role of facilitating the peeling of the die D from the pressure-sensitive adhesive sheet 56 by pushing the die D upward from below the pressure-sensitive adhesive sheet 56 when the die D is sucked by the suction nozzle 40.

  FIG. 3 shows an overall view of the wafer W. In FIG. 3, the die D is square (or rectangular). In the vicinity of the outer edge of the wafer W, the die D is not formed because the shape of the die D is chipped. Further, the wafer W includes a good die D and a bad die D. The defective die D is a circuit where a defective portion is found in a circuit printed with a pattern in appearance inspection, and a defect mark M is attached with ink or the like by an inspector or an inspection machine. The position of the defect mark M on the die D is not determined, and it is not determined what size and shape it is. Such a defective mark M is not attached to a good die D.

  As shown in FIG. 4, the controller 60 is configured as a microprocessor centered on a CPU 60a, and includes a ROM 60b for storing processing programs, an HDD 60c for storing various data, a RAM 60d used as a work area, an external device and electrical signals. An input / output interface 60e and the like for performing the exchange are provided, and these are connected via a bus 60f. The controller 60 is connected so that signals can be exchanged with the substrate transport device 18, the X-axis slider 26, the Y-axis slider 30, the head 24, the mark camera 44, and the like.

  Next, the case where the die D which is an electronic component is mounted on the substrate 16 using the electronic component mounting apparatus 10 will be described. The controller 60 of the electronic component mounting apparatus 10 controls the X-axis slider 26 and the Y-axis slider 30 so that the suction nozzle 40 comes right above a predetermined die D in the wafer W. Subsequently, the controller 60 controls the Z-axis motor 34 of the head 24 to lower the suction nozzle 40 with the ball screw 36, and applies a negative pressure to the tip of the suction nozzle 40. Then, the die D is adsorbed from the adhesive sheet 56 to the tip of the adsorption nozzle 40. Subsequently, the controller 60 drives a push pin (not shown) of the wafer pallet 50 to push the die D sucked by the suction nozzle 40 upward from below the adhesive sheet 56. Since the suction nozzle 40 is supported by a spring (not shown), the spring is contracted and raised by the amount pushed up. Thus, the die D is easily peeled from the adhesive sheet 56 by pushing up the die D from below. Thereafter, the controller 60 raises the suction nozzle 40, controls each slider 26, 30 so that the die D is directly above a predetermined position of the substrate 16, lowers the suction nozzle 40 at that position, and sucks the suction nozzle 40. Supply positive pressure to Then, the die D is separated from the suction nozzle 40 and mounted at a predetermined position on the substrate 16. In this way, the die D is mounted on the substrate 16, but the wafer W has a good die D and a bad die D as shown in FIG. Therefore, the defective die D, that is, the die D with the defective mark M is discarded without being mounted on the substrate 16.

  Whether or not the defect mark M is attached to the die D is determined by the controller 60 using an image of the die D photographed by the mark camera 33. Specifically, the controller 60 determines whether or not the die is a die D (defective die) with a defective mark M by executing the defective die determination processing routine of FIG. This routine is stored in the HDD 60c. In the present embodiment, it is assumed that the die D is silver and the defect mark is attached with black ink.

  When the defective die determination process is started, the CPU 60a of the controller 60 first acquires a captured image of the wafer W (step S100). Specifically, after the X-axis slider 26 and the Y-axis slider 30 are driven and controlled so that the mark camera 44 is positioned directly above the wafer W, and the shutter of the mark camera 44 is operated at that position, the image is taken. The entire image of the wafer W is acquired from the mark camera 44.

  Next, the CPU 60a of the controller 60 sets one target die D from the wafer W (step S110). The setting procedure of the target die D is not particularly limited. For example, the setting is performed in order from the upper left to the right of the wafer W in FIG. You may make it repeat the procedure of setting in order toward.

  Next, the CPU 60a of the controller 60 sets a search area in the captured image of the target die D (step S120), and acquires the gray scale value of the dot in the search area (step S130). In the present embodiment, as shown in FIG. 6, the search area frame F1 for setting the search area is set to the same shape and size as the die D, and information related to the frame F1 is stored in the HDD 60c. Of the photographed image of the die D, an area surrounded by the search area frame F1 is a search area. The gray scale value is a value when the image is expressed only in light and dark from white to black. For example, in the case of 4 bits (16 gradations), a value of 0 to 15 can be taken, and 8 bits ( In the case of (256 gradations), a value from 0 to 255 can be taken. The minimum value (that is, zero) represents black, and the maximum value represents white.

  Next, the CPU 60a of the controller 60 sets a defective mark candidate part based on the gray scale value in the search area (step S140). Specifically, a set of gray dots whose value is black or close to black is searched from the gray scale values in the search area, and the largest set is set as a defective mark candidate portion. In the case of 256 gradations, the number of dots having gray scale values of 0 to G (G is, for example, 50 or 60) and adjacent to each other may be black or a set of gray dots close to black. FIG. 7 is an explanatory diagram regarding the setting of the defective mark candidate portion. FIG. 7A shows a die D without a defect mark M, and has two large and small black circular portions d1 and d2. In this case, a large circular portion d1 is set as a defective mark candidate portion. On the other hand, FIG. 7B shows a die D with a defect mark M, which has a defect mark M in addition to the circular portions d1 and d2. In this case, the defect mark M is set as a defect mark candidate part.

  Next, the CPU 60a of the controller 60 sets a determination area so as to include a defective mark candidate portion (step S150). In the present embodiment, a determination area frame F2 (see FIG. 6) for setting a determination area is set in advance and stored in the HDD 60c. The determination area frame F2 is smaller in size than the search area frame F1. When the inspector or the inspection machine applies the defect mark M with black ink, the size and shape of the defect mark M vary. Based on experience, the determination region frame F2 is set so that the minimum defect mark Mmin is determined from the defect marks M that vary in such a manner, and the size and shape can surround the minimum defect mark Mmin. Yes. The CPU 60a sets the determination region frame F2 so that the center dot of the defective mark candidate portion matches the center of the determination region frame F2, and sets the region surrounded by the determination region frame F2 as the determination region. . FIG. 8 is an explanatory diagram regarding the setting of the determination area. FIG. 8A shows a determination area set for the die D without the defect mark M, and FIG. 8B shows a determination area set for the die D with the minimum defect mark Mmin.

  Next, the CPU 60a of the controller 60 calculates the average value (grayscale average value) of the grayscale values of the dots included in the determination area (step S160). Then, the gray scale average value and the threshold value are compared (step S170). If the gray scale average value exceeds the threshold value, the current die D is stored as a defective die in the HDD 60c (step S180), and the gray scale average value is calculated. If it is below the threshold, the current die D is stored in the HDD 60c as a normal die (step S185). The gray scale average value is a value obtained by dividing the sum of the gray scale values of the dots included in the determination area by the number of dots included in the determination area. The threshold is a value set as follows. In other words, the gray scale average value of a plurality of dies D with defective marks and the gray scale average value of a plurality of dies D without defective marks are calculated in advance, and both gray scale average values are clearly distinguished. A value to be obtained was obtained, and the value was used as a threshold value and a threshold value. The threshold value is stored in the HDD 60c. In FIG. 8A, the gray scale average value is equal to or less than the threshold value, so that it is determined as a good die. In FIG. 8B, since the gray scale average value exceeds the threshold value, it is determined as a defective die. . FIG. 9 shows a die D with a relatively large defect mark M. In this case, the determination area frame F2 is set so that the center dot of the defect mark M coincides with the center of the determination area frame F2, and the gray scale average value exceeds the threshold value, so that it is determined as a defective die.

  Next, the CPU 60a of the controller 60 confirms whether or not the processing has been completed for all the dies D included in the wafer W (step S190), and if unprocessed dies D remain, the process returns to step S110 again. Returning, when the processing is completed for all the dies D, this routine is finished.

  Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The electronic component mounting apparatus 10 of the present embodiment corresponds to a defective member determination apparatus of the present invention, the mark camera 44 corresponds to a photographing unit, and the controller 60 corresponds to a determination unit. In the present embodiment, an example of the defective member determination method of the present invention is also clarified by describing the operation of the electronic component mounting apparatus 10.

  According to the electronic component mounting apparatus 10 of the embodiment described above, a determination area having a size smaller than the search area is applied in the search area for searching for the presence or absence of the defect mark M in the photographed image of the die D. The presence / absence of the defective mark M is determined by comparing the gray scale average value of the dots included in the determination region with a threshold value. Here, as shown in FIG. 10, when the determination area frame F2 is the same as the search area frame F1 (that is, the determination area is the same as the search area), the size of the minimum defect mark Mmin is larger than that of the determination area. Therefore, the gray scale average value of the determination region may be too small to exceed the threshold value, and there is a possibility that it is determined that there is no defective mark M despite the presence of the defective mark M. On the other hand, in this embodiment, since the determination area is smaller than the search area, such a fear is eliminated. Therefore, occurrence of erroneous detection of the defective mark M attached to the die D can be suppressed.

  Moreover, since the presence or absence of the defective mark M is determined by comparing the gray scale average value and the threshold value, even if the defective mark M attached to the die D is blurred and the black dots are discontinuous, It can be determined that there is a defective mark with high accuracy.

  Further, a defect mark candidate part is set based on the gray scale value of the dot included in the search area of the die D, and the determination area is applied to the defect mark candidate part to determine the presence or absence of the defect mark M. It is possible to make a determination in a shorter time compared to the case where the region is applied to the search region.

  It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  For example, in the embodiment described above, the size and shape of the search area frame F1 may be set and changed. In this way, the size and shape of the search area can be changed according to the size and shape of the die D to be mounted, so that the occurrence of erroneous detection of the defective mark M can be suppressed more effectively. Alternatively, the size and shape of the determination area frame F2 may be set and changed. In this way, since the size and shape of the determination area can be changed according to the size and shape of the defect mark M attached to the die D, the occurrence of erroneous detection of the defect mark M can be more effectively suppressed. it can.

  In the above-described embodiment, the search area frame F1 has the same shape and size as the die D. However, the search area frame F1 may be set so as to exclude an exclusion area preset in the image of the die D. . An example is shown in FIG. Here, it is assumed that a plurality of circular circuit patterns P are formed on the die D, and the gray scale values of the dots of the circuit patterns P are equivalent to the defect mark M. In this case, an area surrounding the circuit pattern P is set as an excluded area, and the search area frame F1 is set so as to exclude the excluded area. In this way, an area that is likely to be confused with the defective mark M can be excluded from the search area in advance, and the effect of suppressing the occurrence of erroneous detection of the defective mark M is enhanced.

  In the above-described embodiment, the die D is exemplified as a member used in the mounting machine. However, as shown in FIG. 12, a member used in the mounting machine is a multi-sided board 116 in which a plurality of daughter boards 116a are integrally coupled. It is good. The sub board 116a is finally separated from the multi-sided board 116. The multi-sided substrate 116 corresponds to the substrate 16 in FIG. 1 and is transported from the left to the right by the substrate transport device 18. As shown in FIG. 12, the multi-chamfer substrate 116 is provided with a mark region 117 at a position different from the daughter substrate 116a. The mark area 117 is provided with the number of mark columns 117a as many as the number of child boards 116a, the left mark field 117a corresponds to the left child board 116a, the center mark field 117a corresponds to the center child board 116a, and the right side. The mark column 117a corresponds to the right sub board 116a. If any of the sub-substrates 116a is a defective sub-substrate, a defect mark is added to the corresponding mark column 117a. Each mark column 117a corresponds to a search region, and a determination region is set by a determination region frame F3 having a size smaller than that of the mark column 117a. Also for such a multi-sided board 116, before supplying it to the electronic component mounting apparatus 10, a photographed image of the mark area 117 is acquired, and whether or not a defective mark is attached to each mark column 117a is a flowchart of FIG. It may be determined in the same manner as described above. Further, instead of providing the mark region 117, a mark column 117a may be provided for each daughter board 116a.

  In the above-described embodiment, it is determined whether or not the defect mark M is attached to the die D depending on whether or not the gray scale average value exceeds the threshold value. However, the gray scale value of the dot included in the determination area and the determination area are determined. The parameters are not particularly limited to the gray scale average value as long as the number of dots included is used. For example, a value obtained by dividing the number of dots of the color of the defective mark M or a color close to it (for example, a gray scale value of 0 to 60) among the dots included in the determination region by the number of dots included in the determination region, The presence / absence of the defect mark M may be determined by comparing.

  In the above-described embodiment, the base of the die D is silver and the defect mark M is black ink. However, if the defect mark M can be distinguished from the base of the die D when expressed in grayscale. Any color is acceptable. For example, when the base of the die D is black, the defect mark M may be attached with white ink.

  In the above-described embodiment, the gray scale value of the defect mark M is used, but other color information such as RGB values may be used instead of the gray scale value.

  The present invention can be used, for example, in an electronic component mounting apparatus.

DESCRIPTION OF SYMBOLS 10 Electronic component mounting apparatus, 12 Housing | casing, 18 Board | substrate conveyance apparatus, 20 Support plate, 22 Conveyor belt, 23 Support pin, 24 Head, 26 X-axis slider, 28 Guide rail, 30 Y-axis slider, 32 Guide rail, 33 Mark Camera, 34 Z-axis motor, 36 Ball screw, 40 Suction nozzle, 42 Holder, 44 Mark camera, 50 Wafer pallet, 52 Pallet body, 52a Circular hole, 54 Grip ring, 56 Adhesive sheet, 60 Controller, 60a CPU, 60b ROM, 60c HDD, 60d RAM, 60e input / output interface, 60f bus, 116 multi-sided board, 116a slave board, 117 mark area, 117a mark field, d1, d2 circular part, D die, F1 search area frame, F2 judgment area Frame, F3 determination region for the frame, M bad mark, W wafer.

Claims (7)

A defective member determination device for determining whether or not a defect mark is attached to a member used in a mounting machine,
Photographing means for photographing the member;
In the search area for searching for the presence or absence of a defective mark in the image of the member imaged by the imaging means, a determination area having a size smaller than the search area is applied, and the dot color information included in the determination area and the color information Determination means for determining the presence or absence of the defective mark using the number of dots included in the determination area;
The defective member determination apparatus provided with. The determination means determines the presence or absence of the defective mark by comparing an average value of gray scale values of dots included in the determination region with a predetermined threshold;
The defective member determination apparatus according to claim 1. The defective member determination device according to claim 1 or 2,
Furthermore, the defective member determination apparatus provided with the setting change means to change the setting of the size or shape of at least one of the said search area | region and the said determination area | region. The determination unit sets a defective mark candidate portion based on color information of dots included in the search region of the member, and determines the presence or absence of the defective mark by applying the determination region to the defective mark candidate portion. To
The defective member determination apparatus of any one of Claims 1-3. The determination means excludes an exclusion area preset in the image of the member from the search area,
The defective member determination apparatus of any one of Claims 1-4. The exclusion area is set based on a circuit pattern formed on the member.
The defective member determination apparatus according to claim 5. A defective member determination method for determining whether or not a defect mark is attached to a member used in a mounting machine,
(A) photographing the member;
(B) In the search area for searching for the presence or absence of a defective mark in the image of the member photographed in step (a), a determination area having a size smaller than the search area is applied, and the dots included in the determination area Determining the presence or absence of the defective mark using color information and the number of dots included in the determination area;
A defective member determination method including:

Images