JP2016012631A - Processing method of circuit board, and curable adhesive composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a processing method of a circuit board by which, even in the case where a circuit board processing step of applying heating and pressing processing is implemented, a sufficient adhesion strength is maintained during the heating and pressing processing and after the end of the circuit board processing step, a support plate can be exfoliated from the circuit board without damaging the circuit board or without adhesive residue.SOLUTION: At least in the order of steps, the processing method includes: a support plate fixing step of fixing a circuit board 11 to a support plate 2 via a curable adhesive composition 3 containing a curable adhesive component which is cross-linked and cured by stimuli; an adhesive curing step of cross-linking and curing the curable adhesive component by stimulating the curable adhesive composition; a circuit board processing step of applying the heating and pressing processing to the circuit board fixed to the support plate; and a support plate exfoliation step of exfoliating the support plate from the circuit board after the processing.

Description

The present invention is a processing method of a circuit board that is processed in a state in which the circuit board is fixed to a support plate via an adhesive composition, and even when a circuit board processing step of performing heating and pressurization processing is performed, The present invention relates to a method of processing a circuit board that maintains a sufficient adhesive force during heating and pressurizing processes and that can release a support plate from a circuit board without damaging the circuit board or leaving adhesive residue after completion of the circuit board processing process. .

In the manufacturing process of an electronic product, the circuit board is temporarily fixed to a support plate in order to facilitate handling at the time of processing the circuit board and prevent it from being damaged.
The adhesive composition that bonds the circuit board to the support plate is required to have a high adhesive enough to firmly fix the circuit board during the processing step, and to be able to be peeled off after the process without damaging the circuit board (hereinafter referred to as the circuit board). , Also referred to as “high adhesion easy peeling”). As an adhesive composition that realizes such high adhesion and easy peeling, for example, Patent Document 1 discloses an adhesive composition containing a gas generating agent that generates a gas by stimulation with an azo compound or the like.

On the other hand, for example, in a circuit board on which an electronic component is mounted with an adhesive for electronic components, a pressure curing step for removing voids in the adhesive for electronic components may be performed by heating and pressurizing the circuit substrate. is there. In such a pressure curing step, heating and pressurization at about 50 to 200 ° C. and about 0.1 to 2 MPa are performed.
For example, in the manufacture of electronic products, a circuit board is sealed with a resin using a mold to obtain an electronic product that is a molded product. As a resin sealing method at this time, a method of placing a circuit board in a cavity of a mold and pressurizing molten resin with a plunger to fill the cavity is common. In such a resin sealing step, heating and pressurization at 150 to 200 ° C. and about 3 to 15 MPa are performed.

In the processing of circuit boards involving such severe heating and pressure treatment, when the circuit board is fixed to a support plate using a conventional adhesive composition, the adhesive composition is not heated during the heating and pressure treatment. There is a problem that the circuit board and the support plate may be separated due to fluidization, or the surroundings may be contaminated by the fluidized adhesive composition. In addition, due to the heating and pressurizing treatment, the adhesive composition is increased in adhesion and the peelability is lowered, and the circuit board is damaged when the support plate is peeled off from the circuit board after the circuit board processing step. There was a problem that the adhesive remained on the circuit board. In particular, when the circuit board is a substrate made of an organic polymer such as a glass epoxy board, the adhesion is easily promoted, and the support plate is peeled off from the circuit board without damaging the circuit board or leaving adhesive residue. Was difficult.

JP 2003-231872 A

The present invention is a processing method of a circuit board that is processed in a state in which the circuit board is fixed to a support plate via an adhesive composition, and even when a circuit board processing step of performing heating and pressurization processing is performed, A circuit board processing method capable of maintaining a sufficient adhesive force during heating and pressurizing processing and peeling the support plate from the circuit board without damaging the circuit board or leaving adhesive residue after the circuit board processing step is completed. The purpose is to provide.

The present invention includes a support plate fixing step of fixing a circuit board to a support plate via a curable adhesive composition containing a curable adhesive component that is crosslinked and cured by stimulation at least in the order of steps, and the curable adhesive An adhesive curing process for stimulating the composition to crosslink and cure the curable adhesive component; a circuit board processing process for heating and pressurizing the circuit board fixed to the support plate; It is a processing method of a circuit board which has a support plate peeling process which peels a support plate from a circuit board.
The present invention is described in detail below.

In the method for treating a circuit board according to the present invention, first, a support fixing process is performed in which the circuit board is fixed to the support via a curable adhesive composition containing a curable adhesive component that is crosslinked and cured by stimulation. By fixing the circuit board to the support and reinforcing it, the handling can be facilitated and the circuit board can be prevented from being damaged.

The circuit board to which the processing method of the circuit board of the present invention is applied is not particularly limited. For example, the present invention is excellent in the case of an organic polymer or inorganic substrate such as a glass epoxy substrate, a polyimide substrate, or a ceramic substrate. Especially effective.
The circuit board may have one or more electronic components mounted thereon. For mounting the electronic component on the circuit board, a conventionally known adhesive for electronic components can be used.

The curable adhesive composition contains a curable adhesive component that crosslinks and cures upon stimulation. Examples of the stimulus for crosslinking and curing the curable adhesive component include heat, light, electromagnetic waves, electron beams, and ultrasonic waves. Among these, it is preferable to contain a photocurable adhesive component that is crosslinked and cured by light irradiation, or a thermosetting adhesive component that is crosslinked and cured by heating, and it is easy to adjust the speed and degree of crosslinking and crosslinking. Therefore, the photocurable adhesive component is more preferable.
Examples of the photocurable adhesive component include a photocurable adhesive containing a polymerizable polymer as a main component and a photopolymerization initiator.
Examples of the thermosetting adhesive component include a thermosetting adhesive containing a polymerizable polymer as a main component and a thermal polymerization initiator.

The polymerizable polymer is prepared by, for example, previously synthesizing a (meth) acrylic polymer having a functional group in the molecule (hereinafter referred to as a functional group-containing (meth) acrylic polymer) and reacting with the functional group in the molecule. It can obtain by making it react with the compound (henceforth a functional group containing unsaturated compound) which has a functional group to perform and a radically polymerizable unsaturated bond.

The functional group-containing (meth) acrylic polymer is an acrylic having an alkyl group usually in the range of 2 to 18 as a polymer having adhesiveness at room temperature, as in the case of a general (meth) acrylic polymer. By copolymerizing an acid alkyl ester and / or methacrylic acid alkyl ester as a main monomer, a functional group-containing monomer, and, if necessary, another modifying monomer copolymerizable therewith by a conventional method It is obtained. The weight average molecular weight of the functional group-containing (meth) acrylic polymer is usually about 200,000 to 2,000,000.

Examples of the functional group-containing monomer include a carboxyl group-containing monomer such as acrylic acid and methacrylic acid; a hydroxyl group-containing monomer such as hydroxyethyl acrylate and hydroxyethyl methacrylate; and an epoxy group containing glycidyl acrylate and glycidyl methacrylate. Monomers; Isocyanate group-containing monomers such as isocyanate ethyl acrylate and isocyanate ethyl methacrylate; and amino group-containing monomers such as aminoethyl acrylate and aminoethyl methacrylate.

Examples of other modifying monomers that can be copolymerized include various monomers used in general (meth) acrylic polymers such as vinyl acetate, acrylonitrile, and styrene.

The functional group-containing unsaturated compound to be reacted with the functional group-containing (meth) acrylic polymer is the same as the functional group-containing monomer described above according to the functional group of the functional group-containing (meth) acrylic polymer. it can. For example, when the functional group of the functional group-containing (meth) acrylic polymer is a carboxyl group, an epoxy group-containing monomer or an isocyanate group-containing monomer is used, and when the functional group is a hydroxyl group, an isocyanate group-containing monomer is used. When the functional group is an epoxy group, a carboxyl group-containing monomer or an amide group-containing monomer such as acrylamide is used, and when the functional group is an amino group, an epoxy group-containing monomer is used.

The polymerizable polymer preferably has a lower limit of the content of the radical polymerizable unsaturated bond of 0.01 meq / g and a preferable upper limit of 2.0 meq / g. When the content of the radically polymerizable unsaturated bond of the polymerizable polymer is within this range, the adhesive composition is irradiated or heated in the adhesive curing step to crosslink and cure the curable adhesive component. The storage shear modulus at 25 ° C. measured at a continuous temperature rise from −50 ° C. to 300 ° C. in the shear mode of dynamic viscoelasticity measurement for the adhesive composition after the treatment was 2.0 × 10 ⁵ to 2 It can be adjusted to a range of about 0.0 × 10 ⁸ Pa. Thereby, when the support is peeled from the wafer in the support peeling process, it is possible to more effectively prevent the adhesive residue from being generated on the surface of the wafer. The minimum with more preferable content of the radically polymerizable unsaturated bond of the said polymeric polymer is 0.05 meq / g, and a more preferable upper limit is 1.0 meq / g.

Examples of the photopolymerization initiator include those activated by irradiation with light having a wavelength of 250 to 800 nm. Examples of such a photopolymerization initiator include acetophenone derivative compounds such as methoxyacetophenone; Benzoin ether compounds such as benzoin propyl ether and benzoin isobutyl ether; ketal derivative compounds such as benzyldimethyl ketal and acetophenone diethyl ketal; phosphine oxide derivative compounds; bis (η5-cyclopentadienyl) titanocene derivative compounds, benzophenone, Michler's ketone, Chlorothioxanthone, Todecylthioxanthone, Dimethylthioxanthone, Diethylthioxanthone, α-hydroxycyclohexyl phenyl ketone, 2-hydroxymethylphenylpropane, etc. These radical photopolymerization initiators. These photoinitiators may be used independently and 2 or more types may be used together.

Examples of the thermal polymerization initiator include those that decompose by heat and generate active radicals that initiate polymerization. Examples thereof include dicumyl peroxide, di-t-butyl peroxide, t-butyl peroxybenzoate, t- Examples include butyl hydroperoxide, benzoyl peroxide, cumene hydroperoxide, diisopropylbenzene hydroperoxide, paramentane hydroperoxide, and di-t-butyl peroxide. These thermal polymerization initiators may be used independently and 2 or more types may be used together.

The photocurable adhesive or thermosetting adhesive preferably further contains a radical polymerizable polyfunctional oligomer or monomer. By containing a radically polymerizable polyfunctional oligomer or monomer, photocurability or thermosetting is improved.
The polyfunctional oligomer or monomer preferably has a molecular weight of 10,000 or less, and more preferably has a molecular weight of 5000 or less so that the three-dimensional network of the adhesive layer can be efficiently formed by heating or light irradiation. And the number of radically polymerizable unsaturated bonds in the molecule is 2-20.

The polyfunctional oligomer or monomer is, for example, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, pentaerythritol triacrylate, pentaerythritol tetraacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol hexaacrylate or the same methacrylate as described above. And the like. Other examples include 1,4-butylene glycol diacrylate, 1,6-hexanediol diacrylate, polypropylene glycol # 700 diacrylate, polyethylene glycol diacrylate, commercially available oligoester acrylate, and methacrylates similar to those described above. These polyfunctional oligomers or monomers may be used alone or in combination of two or more.

The curable adhesive composition may further contain a gas generating agent that generates gas upon stimulation. In the support fixing step, when a plate-like body such as a glass plate is used as the support, it may be difficult to peel the support from the resin-sealed circuit board in the support peeling step described later. is there. When the curable adhesive composition contains the gas generating agent, in the support peeling process, the adhesive composition is stimulated to generate gas from the gas generating agent, and easily. The support can be peeled off from the resin-sealed circuit board without any adhesive residue.

Here, for the curable adhesive component and the gas generating agent, a combination in which a stimulus for crosslinking and curing the curable adhesive component and a stimulus for generating a gas from the gas generating agent are qualitatively or quantitatively different is selected. To do. By selecting such a combination, it is possible to prevent gas from being generated from the gas generating agent and peeling of the circuit board and the support due to stimulation in the adhesive curing step described later. Specifically, for example, when a photocurable adhesive component is used as the curable adhesive component, a gas generating agent that generates gas by stimulation other than light such as heat may be selected. In addition, even if the stimulus for generating gas from the gas generating agent is light, even if the wavelength is different from the light that crosslinks and cures the photocurable adhesive component or the wavelength overlaps, the photocurable adhesive component A gas generating agent that requires a larger amount of light than the amount of light that crosslinks and cures is selected.

For example, a photocurable adhesive component containing a polymer having an unsaturated double bond such as a vinyl group in the side chain and a photopolymerization initiator activated at a wavelength of 250 to 800 nm irradiates light having a wavelength of 365 nm or more. By doing so, it can be crosslinked and cured. If such a photo-curable adhesive component is combined with a gas generating agent that generates gas by irradiating light with a wavelength of 300 nm or less, light with a wavelength of 365 nm or more is irradiated in the adhesive curing step. And in a support body peeling process, it becomes possible to generate gas by irradiating light with a wavelength of 300 nm or less.
For example, for a thermosetting adhesive containing a polymer having an unsaturated double bond such as a vinyl group in the side chain and a thermal polymerization initiator activated by heating at about 50 to 150 ° C., 200 ° C. or higher. If a gas generating agent that generates gas by heating is combined, heating is performed at 50 to 150 ° C. in the adhesive curing step, and gas is generated by heating at 200 ° C. or higher in the support peeling step. It becomes possible.

The said gas generating agent is not specifically limited, For example, conventionally well-known gas generating agents, such as an azo compound and an azide compound, can be used.
Moreover, since it does not peel even under the high-temperature and high-pressure conditions in the resin sealing step, a carboxylic acid compound represented by the following general formula (1) or a salt thereof is also suitable. Such a gas generating agent generates gas (carbon dioxide gas) by irradiating light such as ultraviolet rays, and has high heat resistance that does not decompose even under high temperature and high pressure conditions in the resin sealing step.

In formula (1), R ^{1 to} R ⁷ each represent hydrogen or an organic group. R ^{1 to} R ⁷ may be the same or different. Two of R ^{1 to} R ⁷ may be bonded to each other to form a cyclic structure.

Examples of the organic group in the general formula (1) include an alkyl group such as a methyl group, an ethyl group, a propyl group, a butyl group, and an isobutyl group, an alkoxy group such as a methoxy group and an ethoxy group, a carboxyl group, a hydroxyl group, , Aromatic groups such as nitro groups and phenyl groups, polycyclic hydrocarbon groups such as naphthyl groups, fluorenyl groups and pyrenyl groups, ring-assembled hydrocarbon groups such as biphenyl groups, and heterocyclic groups such as xanthenyl groups Etc.
Among them, one of R ^{3 to} R ^{7 in} the above formula (1) is an organic group represented by the following formula (2), or R ^{3 to} R ⁷ in the above formula (1). It is preferable that two adjacent ones are bonded to each other to form a cyclic structure represented by the following formula (3).

In formula (2), R < ⁸ > -R < ¹² > shows hydrogen or an organic group, respectively. R ^{8 to} R ¹² may be the same or different. Two of R ^{8 to} R ¹² may be bonded to each other to form a cyclic structure.
In formula (3), R < ¹³ > -R < ¹⁶ > shows hydrogen or an organic group, respectively. R ^{13 to} R ¹⁶ may be the same or different. Two of R ^{13 to} R ¹⁶ may be bonded to each other to form a cyclic structure.
In addition, R ¹ in the above formula (1) is preferably a methyl group.

Specific examples of the carboxylic acid compound represented by the above formula (1) include, for example, phenylacetic acid, diphenylacetic acid, triphenylacetic acid, 2-phenylpropionic acid, 2,2-diphenylpropionic acid, 2,2,2- Triphenylpropionic acid, 2-phenylbutyric acid, α-methoxyphenylacetic acid, mandelic acid, atrolactone acid, benzylic acid, tropic acid, phenylmalonic acid, phenylsuccinic acid, 3-methyl-2-phenylbutyric acid, orthotoluylacetic acid , Metatoluylacetic acid, 4-isobutyl-α-methylphenylacetic acid, p-toluylacetic acid, 1,2-phenylenediacetic acid, 1,3-phenylenediacetic acid, 1,4-phenylenediacetic acid, 2-methoxyphenylacetic acid, 2-hydroxy Phenylacetic acid, 2-nitrophenylacetic acid, 3-nitrophenylacetic acid, 4-ni Trophenylacetic acid, 2- (4-nitrophenyl) propionic acid, 3- (4-nitrophenyl) propionic acid, 4- (4-nitrophenyl) propionic acid, 3,4-dimethoxyphenylacetic acid, 3,4- ( Methylenedioxy) phenylacetic acid, 2,5-dimethoxyphenylacetic acid, 3,5-dimethoxyphenylacetic acid, 3,4,5-trimethoxyphenylacetic acid, 2,4-dinitrophenylacetic acid, 4-biphenylacetic acid, 1-naphthyl Examples include acetic acid, 2-naphthylacetic acid, 6-methoxy-α-methyl-2-naphthylacetic acid, 1-pyreneacetic acid, 9-fluorenecarboxylic acid, or 9H-xanthene-9-carboxylic acid.

Among these, the carboxylic acid compound represented by the above formula (1) is ketoprofen represented by the following formula (1-1) or 2-xanthone acetic acid represented by the following formula (1-2). preferable.

Since the salt of the carboxylic acid compound represented by the above formula (1) also has a skeleton derived from the carboxylic acid compound represented by the above formula (1), decarboxylation easily occurs when irradiated with light, Carbon dioxide gas can be generated.

The salt of the carboxylic acid compound represented by the above formula (1) can be obtained by simply mixing the carboxylic acid compound represented by the above formula (1) and the basic compound in a container without going through a complicated synthesis route. Easy to prepare.
The basic compound is not particularly limited, and examples thereof include amines, hydrazine compounds, quaternary ammonium hydroxide salts, and phosphine compounds.
The amine is not particularly limited, and any of primary amines, secondary amines, and tertiary amines can be used.
Among these, the basic compound is preferably a monoalkylamine or a dialkylamine. When monoalkylamine or dialkylamine is used, the polarity of the obtained salt of the carboxylic acid compound represented by the formula (1) can be reduced, and the solubility with the adhesive component can be increased. More preferably, it is a C6-C12 monoalkylamine or dialkylamine.

As the gas generating agent, a tetrazole compound represented by the following general formula (4), general formula (5) or general formula (6) or a salt thereof is also suitable. These gas generating agents also generate gas (nitroso gas) by irradiating light such as ultraviolet rays, and have high heat resistance that does not decompose even under high temperature and high pressure conditions in the resin sealing step.

In formulas (4) to (6), R ²¹ and R ²² represent hydrogen, an alkyl group having 1 to 7 carbon atoms, an alkylene group, a phenyl group, a mercapto group, a hydroxyl group, or an amino group.

Since the salt of the tetrazole compound represented by the general formulas (4) to (6) also has a skeleton derived from the tetrazole compound represented by the general formulas (4) to (6), light is irradiated. And nitrogen gas can be generated.
The salt of the tetrazole compound represented by the general formulas (4) to (6) is not particularly limited, and examples thereof include a sodium salt, a potassium salt, and an ammonium salt.

The salt of the tetrazole compound represented by the general formulas (4) to (6) can be obtained by simply mixing the tetrazole compound and the basic compound represented by the general formulas (4) to (6) in a container. It can be easily prepared without going through a complicated synthetic route.
The basic compound is not particularly limited, and examples thereof include amines, hydrazine compounds, quaternary ammonium hydroxide salts, and phosphine compounds.
The amine is not particularly limited, and any of primary amines, secondary amines, and tertiary amines can be used.
Among these, the basic compound is preferably a monoalkylamine or a dialkylamine. When monoalkylamine or dialkylamine is used, the polarity of the resulting salt of the tetrazole compound represented by the general formulas (4) to (6) can be reduced and dissolved with the photocurable adhesive component. Can increase the sex. More preferably, it is a C6-C12 monoalkylamine or dialkylamine.

The tetrazole compound represented by the general formula (4) or a salt thereof is not particularly limited, but specifically, for example, 1H-tetrazole, 5-phenyl-1H-tetrazole, 5,5-azobis-1H-tetrazole, 5 -Amino-1H-tetrazole, 5-methyl-1H-tetrazole, 1-methyl-5-mercapto-1H-tetrazole, 1-methyl-5-ethyl-1H-tetrazole, 1- (dimethylaminoethyl) -5-mercapto -1H-tetrazole and the like.

Although the tetrazole compound or its salt represented by the said General formula (5) is not specifically limited, For example, 5,5'-bistetrazole diammonium salt etc. are mentioned.

Although the tetrazole compound or its salt represented by the said General formula (6) is not specifically limited, For example, 5,5'-bistetrazoleamine monoammonium salt etc. are mentioned.

As for the content of the gas generating agent, a preferable lower limit with respect to 100 parts by weight of the curable adhesive component is 5 parts by weight, and a preferable upper limit is 50 parts by weight. If the content of the gas generating agent is less than 5 parts by weight, the amount of gas generated by stimulation may be reduced and sufficient peeling may not be performed. If the content exceeds 50 parts by weight, the curable adhesive component may be obtained. It may not melt and the adhesive strength may decrease. The minimum with more preferable content of the said gas generating agent is 10 weight part, and a more preferable upper limit is 30 weight part.

The curable adhesive composition may further contain a photosensitizer.
Since the photosensitizer has an effect of amplifying stimulation by light on the gas generating agent, gas can be released by irradiation with less light. In addition, gas can be emitted by light in a wider wavelength region.

The photosensitizer is not particularly limited as long as it has excellent heat resistance.
Examples of the photosensitizer excellent in heat resistance include polycyclic aromatic compounds having at least one alkoxy group. Among these, a substituted alkoxy polycyclic aromatic compound having an alkoxy group partially substituted with a glycidyl group or a hydroxyl group is preferable. These photosensitizers have high resistance to sublimation and can be used at high temperatures. Moreover, when a part of the alkoxy group is substituted with a glycidyl group or a hydroxyl group, the solubility in the curable adhesive component is increased, and bleeding out can be prevented.

The polycyclic aromatic compound is preferably an anthracene derivative. The alkoxy group preferably has 1 to 18 carbon atoms, and more preferably has 1 to 8 carbon atoms.

Examples of the polycyclic aromatic compound having at least one alkoxy group include 9,10-dimethoxyanthracene, 2-ethyl-9,10-dimethoxyanthracene, 2-tbutyl-9,10-dimethoxyanthracene, 2, 3-dimethyl-9,10-dimethoxyanthracene, 9-methoxy-10-methylanthracene, 9,10-diethoxyanthracene, 2-ethyl-9,10-diethoxyanthracene, 2-tbutyl-9,10-di Ethoxyanthracene, 2,3-dimethyl-9,10-diethoxyanthracene, 9-ethoxy-10-methylanthracene, 9,10-dipropoxyanthracene, 2-ethyl-9,10-dipropoxyanthracene, 2-tbutyl -9,10-dipropoxyanthracene, 2,3-dimethyl-9, 0-dipropoxyanthracene, 9-isopropoxy-10-methylanthracene, 9,10-dibutoxyanthracene, 9,10-dibenzyloxyanthracene, 2-ethyl-9,10-dibenzyloxyanthracene, 2-tbutyl -9,10-dibenzyloxyanthracene, 2,3-dimethyl-9,10-dibenzyloxyanthracene, 9-benzyloxy-10-methylanthracene, 9,10-di-α-methylbenzyloxyanthracene, 2- Ethyl-9,10-di-α-methylbenzyloxyanthracene, 2-tbutyl-9,10-di-α-methylbenzyloxyanthracene, 2,3-dimethyl-9,10-di-α-methylbenzyloxy Anthracene, 9- (α-methylbenzyloxy) -10-methylanthracase , 9,10-di (2-hydroxyethoxy) anthracene, and the like anthracene derivative such as 2-ethyl-9,10-di (2-carboxyethoxy) anthracene.

The substituted alkoxy polycyclic aromatic compound having an alkoxy group partially substituted with a glycidyl group or a hydroxyl group is, for example, 9,10-di (glycidyloxy) anthracene, 2-ethyl-9,10-di (glycidyloxy). ) Anthracene, 2-tbutyl-9,10-di (glycidyloxy) anthracene, 2,3-dimethyl-9,10-di (glycidyloxy) anthracene, 9- (glycidyloxy) -10-methylanthracene, 9, 10-di (2-vinyloxyethoxy) anthracene, 2-ethyl-9,10-di (2-vinyloxyethoxy) anthracene, 2-tbutyl-9,10-di (2-vinyloxyethoxy) anthracene, 2 , 3-Dimethyl-9,10-di (2-vinyloxyethoxy) anthracene, 9- (2-vinyloxy) Ethoxy) -10-methylanthracene, 9,10-di (3-methyl-3-oxetanylmethoxy) anthracene, 2-ethyl-9,10-di (3-methyl-3-oxetanylmemethoxy) anthracene, 2-t Butyl-9,10-di (3-methyl-3-oxetanylmemethoxy) anthracene, 2,3-dimethyl-9,10-di (3-methyl-3-oxetanylmemethoxy) anthracene, 9- (3-methyl -3-oxetanylmemethoxy) -10-methylanthracene, 9,10-di (p-epoxyphenylmethoxy) anthracene, 2-ethyl-9,10-di (p-epoxyphenylmethoxy) anthracene, 2-tbutyl- 9,10-di (p-epoxyphenylmethoxy) anthracene, 2,3-dimethyl-9,10-di (p-ethylene) Xylphenylmethoxy) anthracene, 9- (p-epoxyphenylmethoxy) -10-methylanthracene, 9,10-di (p-vinylphenylmethoxy) anthracene, 2-ethyl-9,10-di (p-vinylphenylmethoxy) ) Anthracene, 2-tbutyl-9,1-di (p-vinylphenylmethoxy) anthracene, 2,3-dimethyl-9,10-di (p-vinylphenylmethoxy) anthracene, 9- (p-vinylphenylmethoxy) ) -10-methylanthracene, 9,10-di (2-hydroxyethoxy) anthracene, 9,10-di (2-hydroxypropoxy) anthracene, 9,10-di (2-hydroxybutoxy) anthracene, 9,10- Di (2-hydroxy-3-butoxypropoxy) anthracene, 9,10-di (2-Hydroxy-3- (2-ethylhexyloxy) propoxy) anthracene, 9,10-di (2-hydroxy-3-allyloxypropoxy) anthracene, 9,10-di (2-hydroxy-3-phenoxypropoxy) Anthracene, 9,10-di (2,3-dihydroxypropoxy) anthracene, etc. are mentioned.

The content of the photosensitizer is preferably 0.05 parts by weight and preferably 10 parts by weight with respect to 100 parts by weight of the curable adhesive component. When the content of the photosensitizer is less than 0.05 parts by weight, a sufficient sensitizing effect may not be obtained. When the content exceeds 10 parts by weight, the residue derived from the photosensitizer increases. , Sufficient peeling may not be performed. The minimum with more preferable content of the said photosensitizer is 0.1 weight part, and a more preferable upper limit is 5 weight part.

The curable adhesive composition may contain fumed silica. By blending fumed silica, the cohesive strength of the adhesive composition is increased. For this reason, the adhesive composition can be made uniform without separation even when additives having different polarities are mixed with the functional group-containing (meth) acrylic polymer. Further, since the tensile strength is remarkably improved, the adhesive is not broken by the stress at the time of peeling even after being subjected to the high temperature and high pressure conditions in the resin sealing step, and can be peeled without any adhesive residue.

The lower limit of the average particle diameter of the fumed silica is 0.05 μm, and the upper limit is 3 μm. When the average particle size of the fumed silica is within this range, high heat resistance that does not cause floating even when subjected to high-temperature and high-pressure conditions in the resin sealing step, and no adhesive residue remains in the subsequent support peeling step High non-glue residue can be exhibited. The preferable lower limit of the average particle diameter of the fumed silica is 0.06 μm, the preferable upper limit is 2 μm, the more preferable lower limit is 0.07 μm, and the more preferable upper limit is 1 μm.
In addition, in this specification, the average particle diameter of fumed silica is determined by using any of the laser scattering / diffraction method or the dynamic light scattering method, methyl ethyl ketone, methyl ethyl ketone / toluene (60:40) solution before blending, or the like. The particle diameter of fumed silica dispersed in the medium is measured.

When mix | blending the said fumed silica, the compounding quantity of 40 weight part or less is preferable with respect to 100 weight part of said curable adhesive components. With a blending amount of 40 parts by weight or less, the effect of improving the cohesive force to make the adhesive composition uniform and the effect of improving the non-glue residue can be exhibited. Although the minimum of the compounding quantity of the said fumed silica is not specifically limited, In order to fully exhibit the effect of the uniformity of the said adhesive composition, and non-adhesive residue improvement, it is preferable to mix | blend 3 parts weight or more.

The curable adhesive composition may contain a silicone compound having a functional group capable of crosslinking with the curable adhesive component (hereinafter also simply referred to as “silicone compound A”).
Since the silicone compound is excellent in heat resistance, it prevents the adhesive from being burnt even under high-temperature and high-pressure conditions in the resin sealing process, and bleeds out to the adherend interface at the time of peeling to facilitate peeling. Since the silicone compound has a functional group capable of cross-linking with the curable adhesive component, it is chemically reacted with the curable adhesive component by stimulation and taken into the curable adhesive component. The compound will not adhere and contaminate. Further, by blending the silicone compound, the affinity for the support is improved, and the effect of preventing adhesive residue on the circuit board is also exhibited.

The silicone skeleton of the silicone compound A is not particularly limited, and may be either D-form or DT-form.
The silicone compound A preferably has the functional group at the side chain or terminal of the silicone skeleton.
In particular, when a silicone compound having a D-form silicone skeleton and having a functional group capable of crosslinking with the curable adhesive component at the end is used, the peel strength after high initial adhesive strength and high temperature and high pressure conditions It is more preferable because it is easy to achieve both.

As the functional group of the silicone compound A, an appropriate one is selected and used according to the curable adhesive component. For example, when the curable adhesive component is composed mainly of a (meth) acrylic acid alkyl ester polymerizable polymer having a radical polymerizable unsaturated bond in the molecule, it can be cross-linked with a (meth) acrylic group. Functional group is selected.
The functional group capable of crosslinking with the (meth) acryl group is a functional group having an unsaturated double bond, and specific examples include a vinyl group, a (meth) acryl group, an allyl group, and a maleimide group. .

The functional group equivalent of the silicone compound A is not particularly limited, but the preferred lower limit is 1, and the preferred upper limit is 20. When the functional group equivalent is less than 1, the silicone compound A is not sufficiently taken into the photocurable adhesive component when the resulting adhesive composition is cured, and the adherend is contaminated or peelable. In some cases, sufficient adhesion may not be achieved, and when it exceeds 20, sufficient adhesive strength may not be obtained. A more preferable upper limit of the functional group equivalent is 10, a more preferable lower limit is 2, and a more preferable upper limit is 6.

The molecular weight of the silicone compound A is not particularly limited, but a preferred lower limit is 300 and a preferred upper limit is 50000. When the molecular weight is less than 300, the resulting adhesive composition may have insufficient heat resistance, and when it exceeds 50,000, mixing with the curable adhesive component may be difficult. The more preferable lower limit of the molecular weight is 400, the more preferable upper limit is 10,000, the still more preferable lower limit is 500, and the more preferable upper limit is 5000.

A method for synthesizing the silicone compound A is not particularly limited. For example, a silicone resin having a SiH group and a vinyl compound having a functional group capable of crosslinking with the curable adhesive component are reacted by a hydrosilylation reaction. A method of introducing a functional group capable of crosslinking with the curable adhesive component into a silicone resin, a method of causing a condensation reaction between a siloxane compound and a siloxane compound having a functional group capable of crosslinking with the curable adhesive component, etc. Is mentioned.

Examples of commercially available silicone compounds A include X-22-164, X-22-164AS, X-22-164A, X-22-164B, and X-22-164C manufactured by Shin-Etsu Chemical Co., Ltd. , A silicone compound having methacrylic groups at both ends such as X-22-164E, and a methacrylic group at one end such as X-22-174DX, X-22-2426, X-22-2475 manufactured by Shin-Etsu Chemical Co., Ltd. Silicone compounds having an acrylic group such as EBECRYL350 and EBECRYL1360 manufactured by Daicel Cytec, and silicone compounds having an acrylic group such as AC-SQ TA-100 and AC-SQ SI-20 manufactured by Toagosei Co., Ltd. MAC-SQ TM-100, MAC-SQ SI-20, MAC-S manufactured by Toagosei Co., Ltd. Silicone compounds having a methacryl group such as HDM and the like.

Among these, the silicone compound A has particularly high heat resistance and high polarity, so that bleeding out from the adhesive composition is easy. Therefore, the following general formula (I), general formula (II), and general formula A silicone compound represented by (III) having a (meth) acryl group in the siloxane skeleton is preferred.

In the formula, X and Y represent an integer of 0 to 1200 (except when X and Y are both 0), and R represents a functional group having an unsaturated double bond.

Of the silicone compounds having a (meth) acryl group in the siloxane skeleton represented by the above general formula (I), general formula (II), or general formula (III), commercially available products are, for example, manufactured by Daicel Cytec Co., Ltd. EBECRYL350, EBECRYL1360 (both of which R is an acrylic group) and the like.

Moreover, the said silicone compound can also use the silicone compound which has a three-dimensional structure represented by the following general formula (IV).

In the formula, R represents a functional group having an unsaturated double bond.

The lower limit of the content of the silicone compound A is preferably 0.5 parts by weight and the upper limit is preferably 50 parts by weight with respect to 100 parts by weight of the curable adhesive component. When the content of the silicone compound A is less than 0.5 parts by weight, the adhesive force may not be sufficiently reduced even when a stimulus is applied, and may not be peeled off from the adherend. May cause contamination. The more preferable lower limit of the content of the silicone compound A is 1 part by weight, and the more preferable upper limit is 40 parts by weight.

For the purpose of adjusting the cohesive force as an adhesive, the curable adhesive composition described above suitably contains various polyfunctional compounds blended in general adhesives such as isocyanate compounds, melamine compounds, and epoxy compounds as desired. You may contain.
The adhesive composition may contain known additives such as a plasticizer, a resin, a surfactant, a wax, and a fine particle filler.

The support is not particularly limited as long as it has sufficient strength to easily handle a circuit board, has excellent heat resistance, and transmits or passes light. For example, a glass plate, 200 ° C melting point of quartz plates, sapphire plates, etc., polyimide, polyetherimide, polyethylene terephthalate, polyethylene naphthalate, polyphenylene sulfide, polyether ether ketone, ethylene / vinyl alcohol copolymer resin, methyl pentene polymer, etc. The sheet-like body which consists of resin excellent in the above heat resistance and excellent in flexibility can be used.
When a plate-like body is used as the support, a high reinforcing effect can be obtained. On the other hand, when a sheet-like body is used as the support, the support can be easily peeled in the support peeling process described later.

The circuit board and the support in the support fixing step are performed via a curable adhesive composition, but the circuit board and the support may be directly bonded using the curable adhesive composition as an adhesive. . When the support is composed of a sheet-like body, a support sheet in which an adhesive layer composed of the curable adhesive composition is formed on one surface of the base material using the sheet-like support as a base is manufactured. And you may affix this support body sheet | seat on a circuit board.
Moreover, you may perform adhesion | attachment of the circuit board and support body in the said support body fixing process using the double-sided adhesive tape which has an adhesive bond layer which consists of the said curable adhesive composition in at least one surface. The double-sided adhesive tape may be a support tape having an adhesive layer on both sides of the base material, or a non-support tape having no base material.

In the circuit board processing method of the present invention, an adhesive curing step is then performed in which the curable adhesive composition is stimulated to crosslink and cure the curable adhesive component.
The curable adhesive component that has been crosslinked and cured by stimulation has greatly improved heat resistance, and the circuit board and the support are not peeled off even when subjected to heating and pressure treatment. Further, in the resin sealing step described later, the fluidized curable adhesive composition does not contaminate the mold.
On the other hand, the curable adhesive component that has been cross-linked and cured by stimulation makes it difficult for the adhesion enhancement to proceed, so the circuit board may be damaged when the support board is peeled off from the circuit board after the circuit board processing step is completed. There is no glue residue on the circuit board. Thereby, even if it is a case where a circuit board is a board | substrate consisting of organic polymers, such as a glass epoxy board | substrate, the outstanding peelability can be implement | achieved. Furthermore, when a gas is generated from the gas generating agent in a hard curable adhesive component whose elasticity modulus has been increased by crosslinking and curing, most of the generated gas is released to the outside, and the released gas is deposited. At least a part of the adhesive surface of the adhesive is peeled off from the body to reduce the adhesive force. By realizing such easy peeling, a reduction in tact can be expected.
As described above, in the present invention, by performing the adhesive curing step before the circuit board processing step for performing heating and pressurizing treatment, sufficient adhesive force is maintained even under high temperature and high pressure in the circuit substrate processing step. In addition to preventing contamination of the mold due to fluidization of the composition, the support can be peeled off after the circuit board processing step is completed without damaging the circuit board or leaving adhesive residue.

For example, as a photocurable adhesive component that crosslinks and cures upon irradiation with light, a polymer having an unsaturated double bond such as a vinyl group in the side chain and a photopolymerization initiator activated at a wavelength of 250 to 800 nm are contained. When the adhesive composition is used, the curable adhesive component can be crosslinked and cured by irradiating light having a wavelength of 365 nm or more.
For such a photocurable adhesive component, for example, it is preferable to irradiate light with a wavelength of 365 nm with an illuminance of 5 mW or more, more preferably with an illuminance of 10 mW or more, and with an illuminance of 20 mW or more. It is more preferable to irradiate with an illuminance of 50 mW or more. In addition, it is preferable to irradiate light with a wavelength of 365 nm with an integrated illuminance of 300 mJ or more, more preferably with an integrated illuminance of 500 mJ or more and 10,000 mJ or less, and more preferably with an integrated illuminance of 500 mJ or more and 7500 mJ or less. It is particularly preferable to irradiate with an integrated illuminance of 1000 mJ or more and 5000 mJ or less.

Also, for example, as a thermosetting adhesive component that is crosslinked and cured by heating, a polymer having an unsaturated double bond such as a vinyl group in the side chain and a thermal polymerization initiator that is activated by heating at about 50 to 150 ° C. When the adhesive composition containing is used, the thermosetting adhesive component can be crosslinked and cured by heating to a temperature of about 50 to 150 ° C.

For the adhesive composition after the adhesive curing step, the preferred lower limit of the storage shear modulus at 25 ° C. measured at a continuous temperature rise from −50 ° C. to 300 ° C. in the shear mode of dynamic viscoelasticity measurement is 2. 0.0 × 10 ⁵ Pa, and the preferable upper limit is 10 ⁹ Pa. When the elastic modulus is within this range, the circuit board and the support are not unintentionally peeled off in the circuit board processing step, while the support is peeled off from the circuit board in the support peeling step. Generation of adhesive residue on the surface of the circuit board can be prevented. A more preferable lower limit of the elastic modulus is 1.0 × 10 ⁶ Pa, and a more preferable upper limit is 2.0 × 10 ⁸ Pa.

In the circuit board processing method of the present invention, a circuit board processing step is then performed in which the circuit board fixed to the support plate is heated and pressurized.
As the circuit board processing method for performing the heating and pressurizing treatment, specifically, for example, the circuit board fixed to the support is heated and pressurized to remove voids in the adhesive for electronic components. Resin sealing that seals the circuit board with resin by placing the circuit board fixed to the support in the pressure curing process or in the cavity part of the mold, pressurizing the molten resin and filling the cavity part A process etc. are mentioned. In addition, the die attach film can be cured and the circuit board can be dehydrated.
At this time, since the circuit board is reinforced by the support, it is not damaged by heat or pressure during processing of the circuit board. In addition, since it is fixed by the crosslinked and cured adhesive composition, the adhesion between the circuit board and the support is further increased, or the adhesive composition is fluidized under high temperature and high pressure. There is no pollution.

A support for fixing a circuit board on which an electronic component is mounted with an adhesive for electronic components to a support through a curable adhesive composition containing a curable adhesive component that is crosslinked and cured by stimulation at least in the order of steps. Fixing process, adhesive curing process for stimulating curable adhesive composition to crosslink and cure curable adhesive components, and heating and pressurizing circuit board fixed to support for electronic components A circuit board processing method including a pressure curing process for removing voids in the adhesive and a support peeling process for peeling the support from the circuit board is also one aspect of the present invention.
A support fixing step of fixing a circuit board to which an electronic component is bonded by an adhesive to a support through a curable adhesive composition containing a curable adhesive component that is crosslinked and cured by stimulation at least in the order of steps; The adhesive curing process in which the curable adhesive composition is stimulated to crosslink and cure the curable adhesive component, and the circuit board fixed to the support is placed in the cavity of the mold, and the molten resin is A circuit board processing method comprising a resin sealing step of sealing the circuit board with resin by pressurizing and filling the cavity portion, and a support body peeling step of peeling the support body from the circuit board are also disclosed in the present invention. One.

For example, FIG. 1 shows a schematic diagram for explaining a process of resin-sealing by the circuit board processing method of the present invention.
In FIG. 1, first, a circuit board 11 on which a semiconductor element 12 is mounted as an electronic component is fixed to a support sheet in which an adhesive layer 3 made of an adhesive composition is formed on a sheet-like support 2 ( FIG. 1 (a), (b)). Next, the adhesive layer 3 is cross-linked and cured by applying a stimulus (FIG. 1C). The circuit board fixed to the support is placed in the cavity of the mold 4 and the circuit board is sealed with resin by filling the cavity with resin (FIGS. 1D and 1E). A dicing tape 5 is affixed to one surface of the resin-sealed circuit board taken out from the mold (FIG. 1 (f)). Then, the support sheet is peeled off from the resin-sealed circuit board (FIG. 1 (g)). Thereafter, individual electronic products can be obtained by dicing (FIGS. 1 (h) and (i)).

In the method for treating a circuit board according to the present invention, prior to a support peeling step described later, a dicing tape is affixed to the surface opposite to the side affixed to the support of the resin-sealed object to be sealed. You may have a dicing tape sticking process.
By sticking a dicing tape in advance, after the support is peeled off in the support peeling step, the dicing tape can be quickly advanced.

In the circuit board processing method of the present invention, a support peeling process for peeling the support from the processed circuit board is then performed. Since the curable adhesive component is crosslinked and cured in the adhesive curing step, peeling of the support from the circuit board can be performed relatively easily and without adhesive residue.
When the support is a sheet-like body made of highly flexible resin, it can be peeled off from the circuit board by turning the support.

On the other hand, when the support is a plate-like body, peeling may be difficult. Even in such a case, it can be easily peeled by adding a gas generating agent to the curable adhesive composition. That is, when the curable adhesive composition contains the gas generating agent, it is easier to generate gas from the gas generating agent by stimulating the curable adhesive composition in the support peeling step. In addition, the support can be peeled from the circuit board.

For example, when a gas generating agent that generates gas by irradiating light with a wavelength of 300 nm or less is used as the gas generating agent, gas is emitted from the gas generating agent by irradiating light with a wavelength of 300 nm or less. The support can be easily peeled off from the circuit board.
For such a gas generating agent, for example, light with a wavelength of 254 nm is preferably irradiated with an illuminance of 5 mW or more, more preferably with an illuminance of 10 mW or more, and irradiation with an illuminance of 20 mW or more. More preferably, irradiation with an illuminance of 50 mW or more is particularly preferable. Moreover, it is preferable to irradiate light with a wavelength of 254 nm with an integrated illuminance of 1000 mJ or more, more preferably with an integrated illuminance of 1000 mJ or more and 20 J or less, and more preferably with an integrated illuminance of 1500 mJ or more and 15 J or less. It is particularly preferable to irradiate with an integrated illuminance of 2000 mJ or more and 10 J or less.

According to the present invention, there is provided a circuit board processing method in which a circuit board is fixed to a support plate via an adhesive composition, even when performing a circuit board processing step in which heating and pressure processing are performed. A circuit board processing method capable of maintaining a sufficient adhesive force during heating and pressurizing processing and peeling the support plate from the circuit board without damaging the circuit board or leaving adhesive residue after completion of the circuit board processing step. Can be provided.

It is a schematic diagram explaining the process of resin-sealing by the processing method of the circuit board of this invention.

Hereinafter, embodiments of the present invention will be described in more detail with reference to examples. However, the present invention is not limited to these examples.

(Example 1)
(Synthesis of Resin A to Resin L)
A reactor equipped with a thermometer, a stirrer, and a cooling pipe was prepared. In this reactor, 94 parts by weight of 2-ethylhexyl acrylate as an alkyl (meth) acrylate and 6 parts by weight of hydroxyethyl methacrylate as a functional group-containing monomer After adding 0.01 parts by weight of lauryl mercaptan and 80 parts by weight of ethyl acetate, the reactor was heated to start refluxing. Subsequently, 0.01 parts by weight of 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane was added as a polymerization initiator in the reactor, and polymerization was started under reflux. It was. Next, after 1 hour and 2 hours from the start of polymerization, 0.01 parts by weight of 1,1-bis (t-hexylperoxy) -3,3,5-trimethylcyclohexane was added, and the polymerization was started. 4 hours later, 0.05 part by weight of t-hexylperoxypivalate was added to continue the polymerization reaction. Then, 8 hours after the start of polymerization, an ethyl acetate solution of a functional group-containing (meth) acrylic polymer having a solid content of 55% by weight and a weight average molecular weight of 600,000 was obtained.
The resin solid content of 100 parts by weight of the ethyl acetate solution containing the functional group-containing (meth) acrylic polymer was added and reacted with 3.5 parts by weight of 2-isocyanatoethyl methacrylate as the functional group-containing unsaturated compound. To obtain a photocurable adhesive (resin A).

Resins B to L were synthesized in the same manner as in the case of Resin A, except that the (meth) acrylic acid alkyl ester, the functional group-containing monomer, and the functional group-containing unsaturated compound described in Table 1 were used. In resin I, 5 parts by weight of pentaerythritol triacrylate was used in combination as a polyfunctional oligomer to initiate polymerization.

(Example 1)
(1) Production of Support Sheet 1 part by weight of a photopolymerization initiator (Esacure One, manufactured by Nippon Sebel Hegner) was mixed with 100 parts by weight of the resin solid content of the obtained ethyl acetate solution of resin A.
The ethyl acetate solution of the obtained adhesive composition was applied with a doctor knife so that the dry film thickness was 40 μm on the corona-treated surface of a 25 μm-thick polyethylene naphthalate film with one side corona-treated. The coating solution was dried by heating at 110 ° C. for 5 minutes. Then, stationary curing was performed at 40 ° C. for 3 days to obtain a support sheet.

(2) Evaluation of elastic modulus of adhesive composition after irradiation with ultraviolet rays As a sample for evaluation and evaluation, corona of a transparent polyethylene naphthalate film having a thickness of 50 μm obtained by corona-treating an ethyl acetate solution of the adhesive composition on one side On the treated surface, apply with a doctor knife so that the thickness of the dry film is 500 μm, heat at 110 ° C. for 5 minutes to dry the coating solution, and then perform static curing at 40 ° C. for 3 days. It was. The obtained adhesive tape was cut into a rectangular shape having a length of 0.6 cm and a width of 1.0 cm, and this was used as a sample for evaluation. Next, using an ultra-high pressure mercury lamp, the adhesive component was cross-linked and cured by irradiating with ultraviolet rays of 365 nm for 2 minutes while adjusting the illuminance so that the irradiation intensity on the tape surface was 80 mW / cm ² . About the sample for evaluation after hardening, it measured with the shear mode angular frequency 10Hz of a dynamic viscoelasticity measurement, and the value of the storage elastic modulus in 25 degreeC among the measured values which heated up continuously from -50 degreeC to 300 degreeC Got.

(3) Twenty-four semiconductor elements were mounted on a glass epoxy substrate on which a circuit for performing pressure cure was formed, using an electronic component adhesive (epoxy adhesive, manufactured by Sekisui Chemical Co., Ltd.). A support sheet was adhered and fixed to the surface of the circuit board on which the semiconductor element was not mounted. In this state, using an ultra-high pressure mercury lamp from the support sheet side, irradiating 365 nm ultraviolet rays for 1 minute while adjusting the illuminance so that the irradiation intensity on the support surface is 80 mW / cm ^2, and photocurable adhesive The agent component was crosslinked and cured. Next, a pressure curing process for removing voids in the adhesive for electronic components was performed by heating and pressing the substrate fixed to the support under the conditions of 150 ° C., 0.5 Pa, 30 minutes. After the pressure curing process, the support sheet was peeled off.
The surface of the circuit board after peeling the support sheet was visually observed, and a case where no adhesive residue was observed was evaluated as “◯”, and a case where adhesive residue was observed was evaluated as “x”.

(4) Implementation of Circuit Board Sealing As a body to be sealed, a circuit board on which a plurality of semiconductor elements were mounted was prepared, and this was resin-sealed according to FIG.
First, a support sheet was attached and fixed to the surface of the build-up substrate (glass epoxy substrate) on which 24 semiconductor elements were mounted, on the side where the semiconductor elements were not mounted. In this state, using an ultra-high pressure mercury lamp from the support sheet side, irradiating 365 nm ultraviolet rays for 1 minute while adjusting the illuminance so that the irradiation intensity on the support surface is 80 mW / cm ^2, and photocurable adhesive The agent component was crosslinked and cured. Next, the circuit board fixed to the support was placed in the cavity of the mold, and the melted epoxy resin was pressurized to fill the cavity. At this time, the inside of the cavity portion reached 180 ° C. and 7.0 MPa. After cooling the mold to 23 ° C., the resin-sealed circuit board was taken out. A dicing tape was applied to the surface of the resin-sealed circuit board on the sealed side, and then the support sheet was peeled off. Thereafter, dicing was performed to obtain individual resin-sealed electronic products.
Here, the surface of the circuit board after peeling the support sheet was visually observed, and the case where no adhesive residue was observed was evaluated as “◯”, and the case where adhesive residue was observed was evaluated as “x”.
In addition, after obtaining the resin sealing body, the cavity of the used mold was visually observed, and “○” was evaluated when no contamination was observed, and “X” was evaluated when contamination was observed. did.

(Examples 2 to 26, Comparative Example 1)
In the preparation of the adhesive composition as shown in Table 2, and in the preparation of the adhesive composition, a silicone compound having a (meth) acrylic group (manufactured by Daicel Cytec, EBECRYL350 (acrylic equivalent 2), EBECRYL1360 (acrylic equivalent) 6)), a plasticizer (manufactured by Negami Kogyo Co., Ltd., UN-2600, UN-5500, UN-7700, U-324A) was added in the same manner as in Example 1 except that it was added as shown in Table 2. A composition and a support sheet were obtained. Evaluation similar to Example 1 was performed using the obtained support sheet.
In Comparative Example 1, in the chemical resistance, heat resistance evaluation and adhesive residue evaluation, the adhesive component was not crosslinked and cured by irradiating with ultraviolet rays.
The results are shown in Table 2.

According to the present invention, there is provided a circuit board processing method in which a circuit board is fixed to a support plate through an adhesive composition, and when a circuit board processing step for performing heating and pressure processing is performed. However, it is possible to process a circuit board that maintains a sufficient adhesive force during the heating and pressurizing processes, and can peel the support plate from the circuit board without damaging the circuit board or leaving an adhesive residue after completion of the circuit board processing process. A method can be provided.

11 Substrate 12 Semiconductor element 2 Support (sheet-like body)
3 Adhesive layer 4 Mold 5 Dicing tape

Claims (9)

At least in process order,
A support plate fixing step of fixing the circuit board to the support plate via a curable adhesive composition containing a curable adhesive component that crosslinks and cures upon stimulation;
An adhesive curing step of stimulating the curable adhesive composition to crosslink and cure the curable adhesive component;
A circuit board processing step of heating and pressurizing the circuit board fixed to the support plate;
A circuit board processing method comprising a support plate peeling step of peeling a support plate from the processed circuit board. At least in process order,
A support fixing step of fixing a circuit board on which an electronic component is mounted with an adhesive for electronic components to a support through a curable adhesive composition containing a curable adhesive component that is crosslinked and cured by stimulation; and
An adhesive curing step of stimulating the curable adhesive composition to crosslink and cure the curable adhesive component;
A pressure curing step of removing voids in the adhesive for electronic components by heating and pressing the circuit board fixed to the support;
A method for processing a circuit board, comprising: a support peeling process for peeling the support from the circuit board. At least in process order,
Via a curable adhesive composition containing a curable adhesive component that crosslinks and cures when stimulated, a support fixing step of fixing the circuit board to which the electronic component is bonded by the adhesive to the support;
An adhesive curing step of stimulating the curable adhesive composition to crosslink and cure the curable adhesive component;
A resin sealing step in which the circuit board fixed to the support is placed in the cavity of the mold, and the molten resin is pressurized and filled into the cavity by sealing the circuit board with the resin;
A method for processing a circuit board, comprising: a support peeling process for peeling the support from the circuit board. About the adhesive composition after an adhesive hardening process, the storage shear elastic modulus in 25 degreeC measured on condition of continuous temperature rising from -50 degreeC to 300 degreeC in the shear mode of a dynamic viscoelasticity measurement is 2.0 * 10. ^5. The processing method for a circuit board according to claim 1, wherein the processing method is ^{5 to} 2.0 × 10 ⁸ Pa. ⁵ . The circuit board processing method according to claim 1, 2, 3, or 4, wherein the stimulus in the adhesive curing step is ultraviolet light or heat. The curable adhesive composition contains a gas generating agent that generates gas by stimulation, and the curable adhesive composition is stimulated to generate gas from the gas generating agent in the support peeling step. 6. The method for processing a circuit board according to claim 1, wherein the support is peeled off from the circuit board. The circuit board processing method according to claim 1, wherein the circuit board is a glass epoxy board. The circuit board processing method according to claim 1, 2, 3, 4, 5, 6 or 7, wherein the circuit board is mounted with one or more electronic components. A curable adhesive composition for use in a method for treating a circuit board according to claim 1, 2, 3, 4, 5, 6, 7 or 8, comprising a curable adhesive component that crosslinks and cures upon stimulation. A curable adhesive composition characterized by comprising:

Images