JP2016003359A5 - - Google Patents
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- Publication number
- JP2016003359A5 JP2016003359A5 JP2014123900A JP2014123900A JP2016003359A5 JP 2016003359 A5 JP2016003359 A5 JP 2016003359A5 JP 2014123900 A JP2014123900 A JP 2014123900A JP 2014123900 A JP2014123900 A JP 2014123900A JP 2016003359 A5 JP2016003359 A5 JP 2016003359A5
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- wiring board
- ultraviolet
- cured resin
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims 23
- 239000011347 resin Substances 0.000 claims 23
- 238000004519 manufacturing process Methods 0.000 claims 11
- 238000007772 electroless plating Methods 0.000 claims 9
- 239000003054 catalyst Substances 0.000 claims 8
- 239000003822 epoxy resin Substances 0.000 claims 6
- 229910052751 metal Inorganic materials 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 6
- 238000000034 method Methods 0.000 claims 6
- 229920000647 polyepoxide Polymers 0.000 claims 6
- 125000004185 ester group Chemical group 0.000 claims 5
- 150000001875 compounds Chemical class 0.000 claims 4
- 238000001179 sorption measurement Methods 0.000 claims 4
- 239000000758 substrate Substances 0.000 claims 4
- 239000000463 material Substances 0.000 claims 3
- 125000003700 epoxy group Chemical group 0.000 claims 2
- 125000000524 functional group Chemical group 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 2
- 239000012466 permeate Substances 0.000 claims 2
- 239000011342 resin composition Substances 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 1
- -1 alkylene glycol Chemical compound 0.000 claims 1
- 230000005540 biological transmission Effects 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims 1
- 150000002941 palladium compounds Chemical class 0.000 claims 1
- 239000002243 precursor Substances 0.000 claims 1
- 230000003746 surface roughness Effects 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014123900A JP6318895B2 (ja) | 2014-06-17 | 2014-06-17 | 配線板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014123900A JP6318895B2 (ja) | 2014-06-17 | 2014-06-17 | 配線板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016003359A JP2016003359A (ja) | 2016-01-12 |
| JP2016003359A5 true JP2016003359A5 (enrdf_load_stackoverflow) | 2017-03-16 |
| JP6318895B2 JP6318895B2 (ja) | 2018-05-09 |
Family
ID=55222883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014123900A Active JP6318895B2 (ja) | 2014-06-17 | 2014-06-17 | 配線板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6318895B2 (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017204538A (ja) * | 2016-05-10 | 2017-11-16 | 日立化成株式会社 | 柔軟性シート、透明フレキシブルプリント配線板及びそれらの製造方法 |
| JP2017208471A (ja) * | 2016-05-19 | 2017-11-24 | 日立化成株式会社 | 積層板及び配線板の製造方法 |
| JP6898740B2 (ja) * | 2017-01-17 | 2021-07-07 | マクセルホールディングス株式会社 | メッキ部品の製造方法 |
| JP7228468B2 (ja) * | 2019-05-28 | 2023-02-24 | 上村工業株式会社 | プリント配線基板の製造方法 |
| JP7439652B2 (ja) * | 2020-06-02 | 2024-02-28 | トヨタ自動車株式会社 | 配線基板の製造方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4423027B2 (ja) * | 2003-12-24 | 2010-03-03 | 京セラ株式会社 | 配線基板の製造方法 |
| JP2009174041A (ja) * | 2007-12-27 | 2009-08-06 | Fujifilm Corp | めっき触媒吸着方法、金属層付き基板の製造方法及びそれらに用いるめっき触媒液 |
| JP5664008B2 (ja) * | 2010-08-10 | 2015-02-04 | 日立化成株式会社 | 樹脂組成物、樹脂硬化物、配線板及び配線板の製造方法 |
| JP2014031395A (ja) * | 2012-08-01 | 2014-02-20 | Kanto Gakuin | 親水性官能基含有樹脂用のコンディショニング液、コンディショニング方法およびこれらを利用した親水性官能基含有樹脂の金属化方法 |
-
2014
- 2014-06-17 JP JP2014123900A patent/JP6318895B2/ja active Active
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