JP2015534267A5 - - Google Patents
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- JP2015534267A5 JP2015534267A5 JP2015531193A JP2015531193A JP2015534267A5 JP 2015534267 A5 JP2015534267 A5 JP 2015534267A5 JP 2015531193 A JP2015531193 A JP 2015531193A JP 2015531193 A JP2015531193 A JP 2015531193A JP 2015534267 A5 JP2015534267 A5 JP 2015534267A5
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- Prior art keywords
- measurement
- proportionality constant
- measuring
- quality
- measured
- Prior art date
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- 238000005259 measurement Methods 0.000 claims 132
- 238000000034 method Methods 0.000 claims 25
- 230000007547 defect Effects 0.000 claims 18
- 239000000758 substrate Substances 0.000 claims 6
- 238000000572 ellipsometry Methods 0.000 claims 2
- 230000010287 polarization Effects 0.000 claims 2
- 238000000691 measurement method Methods 0.000 claims 1
Applications Claiming Priority (11)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201261696963P | 2012-09-05 | 2012-09-05 | |
| US201261697159P | 2012-09-05 | 2012-09-05 | |
| US61/696,963 | 2012-09-05 | ||
| US61/697,159 | 2012-09-05 | ||
| US201361764441P | 2013-02-13 | 2013-02-13 | |
| US61/764,441 | 2013-02-13 | ||
| US201361766320P | 2013-02-19 | 2013-02-19 | |
| US61/766,320 | 2013-02-19 | ||
| US13/834,915 US9329033B2 (en) | 2012-09-05 | 2013-03-15 | Method for estimating and correcting misregistration target inaccuracy |
| US13/834,915 | 2013-03-15 | ||
| PCT/US2013/058254 WO2014039674A1 (en) | 2012-09-05 | 2013-09-05 | Method for estimating and correcting misregistration target inaccuracy |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015534267A JP2015534267A (ja) | 2015-11-26 |
| JP2015534267A5 true JP2015534267A5 (OSRAM) | 2016-10-20 |
| JP6215330B2 JP6215330B2 (ja) | 2017-10-18 |
Family
ID=50185527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015531193A Active JP6215330B2 (ja) | 2012-09-05 | 2013-09-05 | 位置ずれ対象の不正確性を概算および補正するための方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9329033B2 (OSRAM) |
| JP (1) | JP6215330B2 (OSRAM) |
| KR (1) | KR102000746B1 (OSRAM) |
| CN (1) | CN104736962B (OSRAM) |
| TW (1) | TWI591342B (OSRAM) |
| WO (1) | WO2014039674A1 (OSRAM) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2014194095A1 (en) | 2013-05-30 | 2014-12-04 | Kla-Tencor Corporation | Combined imaging and scatterometry metrology |
| WO2015031337A1 (en) * | 2013-08-27 | 2015-03-05 | Kla-Tencor Corporation | Removing process-variation-related inaccuracies from scatterometry measurements |
| WO2016037003A1 (en) * | 2014-09-03 | 2016-03-10 | Kla-Tencor Corporation | Optimizing the utilization of metrology tools |
| SG11201703585RA (en) * | 2014-11-25 | 2017-06-29 | Kla Tencor Corp | Analyzing and utilizing landscapes |
| KR102665579B1 (ko) * | 2015-05-19 | 2024-05-10 | 케이엘에이 코포레이션 | 오버레이 측정을 위한 지형 위상 제어 |
| CN108431692B (zh) | 2015-12-23 | 2021-06-18 | Asml荷兰有限公司 | 量测方法、量测设备和器件制造方法 |
| KR102738803B1 (ko) * | 2016-02-24 | 2024-12-04 | 케이엘에이 코포레이션 | 광학 계측의 정확도 개선 |
| US10372114B2 (en) * | 2016-10-21 | 2019-08-06 | Kla-Tencor Corporation | Quantifying and reducing total measurement uncertainty |
| US10527952B2 (en) * | 2016-10-25 | 2020-01-07 | Kla-Tencor Corporation | Fault discrimination and calibration of scatterometry overlay targets |
| US10191112B2 (en) | 2016-11-18 | 2019-01-29 | Globalfoundries Inc. | Early development of a database of fail signatures for systematic defects in integrated circuit (IC) chips |
| US10551320B2 (en) * | 2017-01-30 | 2020-02-04 | Kla-Tencor Corporation | Activation of wafer particle defects for spectroscopic composition analysis |
| US10901325B2 (en) * | 2017-02-28 | 2021-01-26 | Kla-Tencor Corporation | Determining the impacts of stochastic behavior on overlay metrology data |
| EP3435162A1 (en) * | 2017-07-28 | 2019-01-30 | ASML Netherlands B.V. | Metrology method and apparatus and computer program |
| US10401738B2 (en) * | 2017-08-02 | 2019-09-03 | Kla-Tencor Corporation | Overlay metrology using multiple parameter configurations |
| JP6979529B2 (ja) * | 2017-09-11 | 2021-12-15 | エーエスエムエル ネザーランズ ビー.ブイ. | リソグラフィプロセスにおける計測 |
| EP3492985A1 (en) * | 2017-12-04 | 2019-06-05 | ASML Netherlands B.V. | Method of determining information about a patterning process, method of reducing error in measurement data, method of calibrating a metrology process, method of selecting metrology targets |
| US10533848B2 (en) * | 2018-03-05 | 2020-01-14 | Kla-Tencor Corporation | Metrology and control of overlay and edge placement errors |
| US10622238B2 (en) | 2018-06-07 | 2020-04-14 | Kla-Tencor Corporation | Overlay measurement using phase and amplitude modeling |
| US10964566B2 (en) * | 2018-06-29 | 2021-03-30 | Taiwan Semiconductor Manufacturing Go., Ltd. | Machine learning on overlay virtual metrology |
| US11551980B2 (en) * | 2019-03-08 | 2023-01-10 | Kla-Tencor Corporation | Dynamic amelioration of misregistration measurement |
| CN113544830A (zh) * | 2019-03-08 | 2021-10-22 | 科磊股份有限公司 | 偏移测量的动态改善 |
| US20220244649A1 (en) * | 2019-07-04 | 2022-08-04 | Asml Netherlands B.V. | Sub-field control of a lithographic process and associated apparatus |
| CN110796107A (zh) * | 2019-11-04 | 2020-02-14 | 南京北旨智能科技有限公司 | 电力巡检图像缺陷识别方法和系统、电力巡检无人机 |
| US11487929B2 (en) | 2020-04-28 | 2022-11-01 | Kla Corporation | Target design process for overlay targets intended for multi-signal measurements |
| KR20230027089A (ko) | 2020-06-25 | 2023-02-27 | 케이엘에이 코포레이션 | 반도체 디바이스의 오정합 및 비대칭을 개선하기 위한 웨이블릿 시스템 및 방법 |
| US12100574B2 (en) | 2020-07-01 | 2024-09-24 | Kla Corporation | Target and algorithm to measure overlay by modeling back scattering electrons on overlapping structures |
| KR20230038285A (ko) * | 2020-07-20 | 2023-03-17 | 어플라이드 머티어리얼스, 인코포레이티드 | 광학 디바이스들 및 광학 디바이스 계측 방법 |
| US11454894B2 (en) * | 2020-09-14 | 2022-09-27 | Kla Corporation | Systems and methods for scatterometric single-wavelength measurement of misregistration and amelioration thereof |
| US12020970B2 (en) | 2021-09-22 | 2024-06-25 | International Business Machines Corporation | Metrology data correction |
| KR102519813B1 (ko) | 2022-10-17 | 2023-04-11 | (주)오로스테크놀로지 | 오버레이 계측 장치 및 방법과 이를 위한 시스템 및 프로그램 |
| TWI884023B (zh) * | 2024-07-02 | 2025-05-11 | 創意電子股份有限公司 | 掃描捕捉限制的生成裝置及其生成方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0298118A (ja) * | 1988-10-05 | 1990-04-10 | Oki Electric Ind Co Ltd | ウエハアライメント方法 |
| JP2000353647A (ja) * | 1999-06-11 | 2000-12-19 | Sumitomo Heavy Ind Ltd | マスクとウエハの倍率補正量検出方法及び位置合わせ装置 |
| US7317531B2 (en) | 2002-12-05 | 2008-01-08 | Kla-Tencor Technologies Corporation | Apparatus and methods for detecting overlay errors using scatterometry |
| US6737208B1 (en) * | 2001-12-17 | 2004-05-18 | Advanced Micro Devices, Inc. | Method and apparatus for controlling photolithography overlay registration incorporating feedforward overlay information |
| US7225047B2 (en) * | 2002-03-19 | 2007-05-29 | Applied Materials, Inc. | Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements |
| US6948254B2 (en) * | 2003-10-27 | 2005-09-27 | Micronic Laser Systems Ab | Method for calibration of a metrology stage |
| US6948149B2 (en) * | 2004-02-19 | 2005-09-20 | Infineon Technologies, Ag | Method of determining the overlay accuracy of multiple patterns formed on a semiconductor wafer |
| US7065737B2 (en) * | 2004-03-01 | 2006-06-20 | Advanced Micro Devices, Inc | Multi-layer overlay measurement and correction technique for IC manufacturing |
| JP4449697B2 (ja) * | 2004-10-26 | 2010-04-14 | 株式会社ニコン | 重ね合わせ検査システム |
| US7684011B2 (en) | 2007-03-02 | 2010-03-23 | Asml Netherlands B.V. | Calibration method for a lithographic apparatus |
| CN100559283C (zh) * | 2007-12-28 | 2009-11-11 | 上海微电子装备有限公司 | 测量方镜非正交性角度和缩放比例因子校正值的方法 |
| US8214771B2 (en) * | 2009-01-08 | 2012-07-03 | Kla-Tencor Corporation | Scatterometry metrology target design optimization |
| US8484382B2 (en) * | 2009-03-11 | 2013-07-09 | Qualcomm Incorporated | Methods and apparatus for merging peer-to-peer overlay networks |
| NL2005459A (en) * | 2009-12-08 | 2011-06-09 | Asml Netherlands Bv | Inspection method and apparatus, and corresponding lithographic apparatus. |
| NL2005719A (en) * | 2009-12-18 | 2011-06-21 | Asml Netherlands Bv | Method of measuring properties of dynamic positioning errors in a lithographic apparatus, data processing apparatus, and computer program product. |
| US9620426B2 (en) * | 2010-02-18 | 2017-04-11 | Kla-Tencor Corporation | Method and system for providing process tool correctables using an optimized sampling scheme with smart interpolation |
| JP2011192769A (ja) * | 2010-03-15 | 2011-09-29 | Renesas Electronics Corp | 半導体デバイス製造方法、及び製造システム |
| NL2006322A (en) * | 2010-03-18 | 2011-09-20 | Asml Netherlands Bv | Inspection apparatus and associated method and monitoring and control system. |
| US11372340B2 (en) | 2011-04-06 | 2022-06-28 | Kla Corporation | Method and system for providing a quality metric for improved process control |
-
2013
- 2013-03-15 US US13/834,915 patent/US9329033B2/en active Active
- 2013-09-05 WO PCT/US2013/058254 patent/WO2014039674A1/en not_active Ceased
- 2013-09-05 JP JP2015531193A patent/JP6215330B2/ja active Active
- 2013-09-05 KR KR1020157007740A patent/KR102000746B1/ko active Active
- 2013-09-05 TW TW102132061A patent/TWI591342B/zh active
- 2013-09-05 CN CN201380054535.0A patent/CN104736962B/zh active Active
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